BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20220313T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20221106T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20221103T010156Z UID:748D1731-4910-4F1D-9C1D-923E71C145EE DTSTART;TZID=America/New_York:20221102T183000 DTEND;TZID=America/New_York:20221102T210000 DESCRIPTION:Millimeter Wave Integration and Packaging Strategies\nusing Ant enna-in-Package\n\nProf. Rashaunda Henderson\n\n2022 President of the IEEE Microwave Theory and Technology Society\n\nECE Department\, University of Texas at Dallas\nRichardson\, TX 75080\n\nWednesday Nov 2 2022\n\nAfforda ble and high performance front end modules (FEMs) have been identified as key research challenges for millimeter wave communications. While the desi gn of active components and sub-systems has been explored by many research groups\, there is still a need to provide integration and packaging strat egies that can meet system requirements and not inhibit the performance ob tained at the wafer level. Antenna in package (AiP) is a key technique ena bling the realization of future millimeter wave FEMs.\n\nThis presentation highlights the design\, modeling\, and characterization of planar antenna s integrated into enhanced quad flat no-lead (eQFN) packages in WR8 (90GHz -140GHz) and WR5 (140GHz-220GHz) frequency bands. Further\, the design\, m odeling\, and simulation results of chip-to-package transitions\, transmis sion line structures\, and antenna feed elements are provided. The simulat ed bandwidth and gain of the integrated antennas is compared with their st andalone versions. A description of the designed test vehicles and measure ment methodology for antenna bandwidth\, and radiation pattern characteriz ation in the WR5 frequency band is also presented. To facilitate accurate design of the antennas and packaging transitions\, high frequency material characterization is needed. This work will include results on the dielect ric properties of the packaging substrates and overmold materials utilized in the frequency ranges mentioned.\n\nBiography:\n\nRashaunda M. Henderso n (S’91-M’99-SM’06) received the BSEE degree from Tuskegee Universit y\, Tuskegee AL in 1992\, graduating with highest honors. She received the MS and PhD degrees in electrical engineering from The University of Michi gan\, Ann Arbor\, MI\, in 1994 and 1999\, respectively. Upon graduation\, she joined Motorola Semiconductor Product Sector in Tempe\, AZ and worked as a research and development device engineer in the microwave and mixed-s ignal technology labs for wireless embedded systems. She joined The Univer sity of Texas at Dallas in 2007 as an Assistant Professor in the Erik Jons son School of Engineering and Computer Science. She is now a Professor in the Electrical and Computer Engineering Department and Interim co-Departme nt Head. Dr. Henderson is co-founder of the High Frequency Circuits and Sy stems Laboratory\, which facilitates millimeter-wave design and developmen t of components\, circuits and integrated packages and antennas for wirele ss communication systems. She has authored/co-authored more than 100 journ al and conference papers/presentations in the field of microwave circuits and electronic packaging for high frequency applications. Dr. Henderson is a Senior Member of the IEEE and the 2022 President of the IEEE Microwave Theory and Technology Society (MTT-S) Administrative Committee. She is pas sionate about educating the next generation student and encouraging them t o seek careers in science\, technology\, engineering and mathematics.\n\nA genda: \nDinner 6:30-7:30 pm\n\nLecture 7:30-9:00 pm\n\nYou are cordially invited to our first post-pandemic IEEE MTT technical dinner-meeting.\nFre e dinner for all attendees will be provided.\nPlease register to attend. A dvance registration is required. Capacity is limited.\nIf after registerin g you find that you cannot attend\, please email ikossi@ieee.org\n\nRoom: Level 2\, near Nieman Marcus\, Bldg: Tysons Galleria Mall\, Maggiano's Lit tle Italy\, 2001 International Drive\, McLean\, Virginia\, United States\, 22102 LOCATION:Room: Level 2\, near Nieman Marcus\, Bldg: Tysons Galleria Mall\, Maggiano's Little Italy\, 2001 International Drive\, McLean\, Virginia\, U nited States\, 22102 ORGANIZER:ali.darwish.ieee@gmail.com SEQUENCE:39 SUMMARY:Millimeter Wave Integration and Packaging Strategies using Antenna- in-Package URL;VALUE=URI:https://events.vtools.ieee.org/m/326639 X-ALT-DESC:Description: <br /><h4><span style="font-family: arial\, helveti ca\, sans-serif\; color: #000000\;"><strong><span class="speakername" styl e="font-size: 18pt\;">Millimeter Wave Integration and Packaging Strategies <br />using Antenna-in-Package&nbsp\;</span></strong></span></h4>\n<h4><s pan style="font-family: arial\, helvetica\, sans-serif\; color: #000000\; font-size: 14pt\;"><strong><span class="speakername">Prof. Rashaunda Hende rson</span></strong></span></h4>\n<h4 style="box-sizing: border-box\; font -family: 'Open Sans'\,formata\,Verdana\,sans-serif\; line-height: 1.1\; co lor: #5f5f5f\; margin: 0px 0px 14px\;"><span style="color: #000000\; font- size: 14pt\;"><strong><span style="box-sizing: border-box\; font-family: a rial\, helvetica\, sans-serif\;"><span style="box-sizing: border-box\;"><s pan class="gmail-speakername" style="box-sizing: border-box\;">2022 Presid ent of the IEEE Microwave Theory and Technology Society <br /></span></spa n></span></strong></span></h4>\n<h4><span style="font-family: arial\, helv etica\, sans-serif\; color: #000000\;"><span style="font-size: 14pt\;"><st rong><span class="speakername">E</span></strong></span><span style="font-s ize: 18pt\;"><strong><span style="font-size: 14pt\;">CE Department\, Unive rsit<span style="background-color: #ecf0f1\;">y</span> of Texas at Dallas< /span><br /><span style="font-size: 14pt\;">Richardson\, TX 75080</span></ strong></span></span></h4>\n<p><span style="font-family: arial\, helvetica \, sans-serif\; color: #236fa1\;"><span style="font-size: 18pt\;"><strong> <span style="font-size: 14pt\;">Wednesday Nov 2 2022</span></strong></span ></span></p>\n<p><span style="font-size: 14pt\; font-family: arial\, helve tica\, sans-serif\; color: #000000\;">Affordable and high performance fron t end modules (FEMs) have been identified as key research challenges for m illimeter wave communications. While the design of active components and s ub-systems has been explored by many research groups\, there is still a ne ed to provide integration and packaging strategies that can meet system re quirements and not inhibit the performance obtained at the wafer level. An tenna in package (AiP) is a key technique enabling the realization of futu re millimeter wave FEMs.</span></p>\n<p><span style="font-size: 14pt\; fon t-family: arial\, helvetica\, sans-serif\; color: #000000\;">This presenta tion highlights the design\, modeling\, and characterization of planar ant ennas integrated into enhanced quad flat no-lead (eQFN) packages in WR8 (9 0GHz-140GHz) and WR5 (140GHz-220GHz) frequency bands. Further\, the design \, modeling\, and simulation results of chip-to-package transitions\, tran smission line structures\, and antenna feed elements are provided. The sim ulated bandwidth and gain of the integrated antennas is compared with thei r standalone versions. A description of the designed test vehicles and mea surement methodology for antenna bandwidth\, and radiation pattern charact erization in the WR5 frequency band is also presented. To facilitate accur ate design of the antennas and packaging transitions\, high frequency mate rial characterization is needed.&nbsp\; This work will include results on the dielectric&nbsp\; properties of the packaging substrates and overmold materials utilized in the frequency ranges mentioned.</span></p>\n<p><span class="sublabel" style="font-size: 14pt\; font-family: arial\, helvetica\ , sans-serif\; color: #000000\;">Biography:</span></p>\n<p><span style="fo nt-size: 14pt\; font-family: arial\, helvetica\, sans-serif\; color: #0000 00\;"><strong>Rashaunda M. Henderson</strong> (S&rsquo\;91-M&rsquo\;99-SM& rsquo\;06) received the BSEE degree from Tuskegee University\, Tuskegee AL in 1992\, graduating with highest honors. She received the MS and PhD deg rees in electrical engineering from The University of Michigan\, Ann Arbor \, MI\, in 1994 and 1999\, respectively.&nbsp\; Upon graduation\, she join ed Motorola Semiconductor Product Sector in Tempe\, AZ and worked as a res earch and development device engineer in the microwave and mixed-signal te chnology labs for wireless embedded systems.&nbsp\; She joined The Univers ity of Texas at Dallas in 2007 as an Assistant Professor in the Erik Jonss on School of Engineering and Computer Science. She is now a Professor in t he Electrical and Computer Engineering Department and Interim co-Departmen t Head. Dr. Henderson is co-founder of the High Frequency Circuits and Sys tems Laboratory\, which facilitates millimeter-wave design and development of components\, circuits and integrated packages and antennas for wireles s communication systems. She has authored/co-authored more than 100 journa l and conference papers/presentations in the field of microwave circuits a nd electronic packaging for high frequency applications. Dr. Henderson is a Senior Member of the IEEE and the 2022 President of the IEEE Microwave T heory and Technology Society (MTT-S) Administrative Committee. She is pass ionate about educating the next generation student and encouraging them to seek careers in science\, technology\, engineering and mathematics.</span ></p><br /><br />Agenda: <br /><p><span style="font-size: 18pt\;">Dinner 6 :30-7:30 pm<br /></span></p>\n<p><span style="font-size: 18pt\;"> Lecture 7:30-9:00 pm<br /></span></p>\n<p><span style="font-size: 18pt\;">You are cordially invited to our first post-pandemic IEEE MTT technical dinner-mee ting.&nbsp\;&nbsp\;<br />Free dinner for all attendees will be provided. < br /></span><span style="font-size: 18pt\;">Please register to attend. </s pan><span style="font-size: 18pt\;"><strong>Advance registration is requir ed.&nbsp\; </strong>Capacity is limited.<br /></span><span style="font-siz e: 18pt\;">If after registering you find that you cannot attend\, please < /span><span style="font-size: 18pt\;">email ikossi@ieee.org</span></p> END:VEVENT END:VCALENDAR