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PRODID:IEEE vTools.Events//EN
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DTSTART:20220313T030000
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DTSTAMP:20221105T033755Z
UID:BE097B49-C444-4904-9728-491A4158FF32
DTSTART;TZID=America/Los_Angeles:20221102T080000
DTEND;TZID=America/Los_Angeles:20221102T100000
DESCRIPTION:This free course presents an overview of the physics of failure
 s in electronics packaging. The course discusses key fundamental concepts 
 of reliability physics associated with various stress conditions\, includi
 ng thermal degradation\, thermo-mechanical stress\, dynamic and vibrationa
 l loading\, moisture and humidity\, as well as electrical current stress. 
 Failure mechanisms studied include chip-package interactions\, micro-bump 
 reliability\, electromigration performance\, inter-layer dielectric (ILD) 
 damage under bumps and Cu pillars\, solder joint reliability\, drop and vi
 brational damage\, interfacial delamination\, and the impact of moisture a
 nd environmental humidity. Acceleration factor models for different failur
 e mechanisms are introduced. Stress analysis methods using finite element 
 analysis (FEA) with specific applications to packaging are described.\n\nS
 peaker(s): Xuejun Fan\, \n\nVirtual: https://events.vtools.ieee.org/m/3285
 02
LOCATION:Virtual: https://events.vtools.ieee.org/m/328502
ORGANIZER:p.wesling@ieee.org
SEQUENCE:1
SUMMARY:Reliability Physics and Failure Mechanisms in Electronics Packaging
URL;VALUE=URI:https://events.vtools.ieee.org/m/328502
X-ALT-DESC:Description: <br /><p>This free course presents an overview of t
 he physics of failures in electronics packaging. The course discusses key 
 fundamental concepts of reliability physics associated with various stress
  conditions\, including thermal degradation\, thermo-mechanical stress\, d
 ynamic and vibrational loading\, moisture and humidity\, as well as electr
 ical current stress. Failure mechanisms studied include chip-package inter
 actions\, micro-bump reliability\, electromigration performance\, inter-la
 yer dielectric (ILD) damage under bumps and Cu pillars\, solder joint reli
 ability\, drop and vibrational damage\, interfacial delamination\, and the
  impact of moisture and environmental humidity. Acceleration factor models
  for different failure mechanisms are introduced. Stress analysis methods 
 using finite element analysis (FEA) with specific applications to packagin
 g are described.</p>
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