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DTSTAMP:20221216T140122Z
UID:E8541980-32CD-4770-8490-E8E1EF65EBCB
DTSTART;TZID=America/New_York:20221213T110000
DTEND;TZID=America/New_York:20221213T123000
DESCRIPTION:[]\n\nPlease note that this lecture has unfortunately had to be
  cancelled. Lecture notes from the talk will be shared with registrants. W
 e sincerely apologize for the inconvenience.\n\nThe IEEE Toronto Electroni
 cs Packaging Society is proud to present Distinguished Lecturer Dr. John L
 au of Unimicron Technology Corporation and his talk on "Chiplet Design and
  Heterogeneous Integration Packaging".\n\nAbstract\n\nChiplet is a chip de
 sign method and heterogeneous integration is a chip packaging method. Hete
 rogeneous integration uses packaging technology to integrate dissimilar ch
 ips\, photonic devices\, and/or components (either side-by-side\, stacked\
 , or both) with different sizes and functions\, and from different fabless
  design houses\, foundries\, wafer sizes\, feature sizes and companies int
 o a system or subsystem on a common package substrate. For the next few ye
 ars\, we will see more implementations of a higher level of chiplet design
 s and heterogeneous integration packaging\, whether it is for time-to-mark
 et\, performance\, form factor\, power consumption or cost. In this lectur
 e\, the introduction\, recent advances\, and trends in chiplet design and 
 heterogeneous integrationpackaging will be presented.\n\nPlease join us Tu
 esday\, December 13th at 11 AM in BA1240. The event will also be streamed 
 live on Zoom for those who cannot attend in person.\n\nFood and refreshmen
 ts will be served.\n\nSpeaker(s): Dr. John H Lau\, \n\nBldg: Bahen Centre 
 for Information Technology\, 40 St George St\, Room BA1240\, Toronto\, Ont
 ario\, Canada\, M5S 2E4\, Virtual: https://events.vtools.ieee.org/m/335514
LOCATION:Bldg: Bahen Centre for Information Technology\, 40 St George St\, 
 Room BA1240\, Toronto\, Ontario\, Canada\, M5S 2E4\, Virtual: https://even
 ts.vtools.ieee.org/m/335514
ORGANIZER:mengqiw@ieee.org
SEQUENCE:13
SUMMARY:IEEE EPS Distinguished Lecture: Chiplet Design and Heterogeneous In
 tegration Packaging
URL;VALUE=URI:https://events.vtools.ieee.org/m/335514
X-ALT-DESC:Description: <br /><p class="xmsonormal" align="center"><a name=
 "x__Hlk90328867"></a></p>\n<p class="xmsonormal"><strong><span style="font
 -size: 18pt\;">Please note that this lecture has unfortunately had to be c
 ancelled. Lecture notes from the talk will be shared with registrants. We 
 sincerely apologize for the inconvenience.</span></strong></p>\n<p class="
 xmsonormal"><br />The IEEE Toronto Electronics Packaging Society is proud 
 to present Distinguished Lecturer Dr. John Lau of Unimicron Technology Cor
 poration and his talk on "Chiplet Design and Heterogeneous Integration Pac
 kaging".</p>\n<p class="xmsonormal"><span style="text-decoration: underlin
 e\; font-size: 12pt\;">Abstract</span></p>\n<p class="xmsonormal">Chiplet 
 is a chip design method and heterogeneous integration is a chip packaging 
 method. Heterogeneous integration uses packaging technology to integrate d
 issimilar chips\, photonic devices\, and/or components (either side-by-sid
 e\, stacked\, or both) with different sizes and functions\, and from diffe
 rent fabless design houses\, foundries\, wafer sizes\, feature sizes and c
 ompanies into a system or subsystem on a common package substrate. For the
  next few years\, we will see more implementations of a higher level of ch
 iplet designs and heterogeneous integration packaging\, whether it is for 
 time-to-market\, performance\, form factor\, power consumption or cost. In
  this lecture\, the introduction\, recent advances\, and trends in chiplet
  design and heterogeneous integrationpackaging will be presented.</p>\n<p 
 class="xmsonormal"><strong>Please join us Tuesday\, December 13th at 11 AM
  in BA1240. The event will also be streamed live on Zoom for those who can
 not attend in person.</strong></p>\n<p class="xmsonormal"><strong>Food and
  refreshments will be served.</strong></p>
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