BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT DTSTART:20230312T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20221106T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20230105T231006Z UID:6D2550AC-BBB3-4FC1-91A1-53BF25733EBB DTSTART;TZID=America/Los_Angeles:20230105T080000 DTEND;TZID=America/Los_Angeles:20230105T100000 DESCRIPTION:Recent advances and trends in lead-free solder joint reliabilit y are presented in this study. Emphasis is placed on the design for reliab ility (DFR) and reliability testing and data analysis\, including: Norton power creep constitutive equations and examples\; the Wises two power cree p constitutive equations and examples\; the Garofalo hyperbolic sine creep constitutive equations and examples\; and the Anand viscoplasticity const itutive equations and examples\, with temperature and strain rate-dependen t parameters. For reliability testing and data analysis\, the Weibull and lognormal life distributions for lead-free solder joints under thermal-cyc ling and drop tests\; the true Weibull slope\, true characteristic life\, and true mean life\; and the linear acceleration factors for various lead- free solder alloys based on frequency and maximum temperature\, dwell time and maximum temperature\; and frequency and mean temperature will be pres ented. Some recommendations will also be provided.\n\nSpeaker(s): John H L au\, \n\nVirtual: https://events.vtools.ieee.org/m/336536 LOCATION:Virtual: https://events.vtools.ieee.org/m/336536 ORGANIZER:p.wesling@ieee.org SEQUENCE:3 SUMMARY:Tutorial: Reliability Testing and Design for Reliability of Packagi ng Interconnects URL;VALUE=URI:https://events.vtools.ieee.org/m/336536 X-ALT-DESC:Description: <br /><p><span style="font-size: 12pt\;">Recent adv ances and trends in lead-free solder joint reliability are presented in th is study. Emphasis is placed on the design for reliability (DFR) and relia bility testing and data analysis\, including: Norton power creep constitut ive equations and examples\; the Wises two power creep constitutive equati ons and examples\; the Garofalo hyperbolic sine creep constitutive equatio ns and examples\; and the Anand viscoplasticity constitutive equations and examples\, with temperature and strain rate-dependent parameters. For rel iability testing and data analysis\, the Weibull and lognormal life distri butions for lead-free solder joints under thermal-cycling and drop tests\; &nbsp\;the true Weibull slope\, true characteristic life\, and true mean life\; and the linear acceleration factors for various lead-free solder al loys based on frequency and maximum temperature\, dwell time and maximum t emperature\; and frequency and mean temperature will be presented. Some re commendations will also be provided.</span></p> END:VEVENT END:VCALENDAR