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DTSTART:20230312T030000
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DTSTART:20221106T010000
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BEGIN:VEVENT
DTSTAMP:20230202T180120Z
UID:A905EF5C-1620-4BA4-AFF7-F7E058D298AD
DTSTART;TZID=America/Los_Angeles:20230126T120000
DTEND;TZID=America/Los_Angeles:20230126T140000
DESCRIPTION:Electronics Packaging Chapter\n\nThermal and Failure Analysis o
 f Advanced Sub-Micron Devices\n\n-- thermal imaging\, fine-geometry\, stat
 ic/dynamic\, high-resolution\, thermoreflectance\, near-ultraviolet to inf
 rared\, examples ...\n\nSpeaker: Dr. Mo Shakouri\, Microsanj Corp.\n\nDate
 : Thursday\, January 26\, 2023\n\nLocation: in person at SEMI World Hdqtrs
 \, Milpitas\, CA USA (and via WebEx)\n\nTime: Checkin at SEMI (sandwiches 
 and drinks) at 11:30 AM\; Presentation at noon (PST). WebEx at noon.\n\nCo
 st: none\n\nvTools Information: https://events.vtools.ieee.org/m/336546\n\
 nRegistration: https://r6.ieee.org/scv-eps/?p=2998\n\nSummary: Performance
  requirements for today’s semiconductor and optoelectronic devices are l
 eading to shrinking geometries\, more complex 3-dimensional structures\, a
 nd new materials. High temperatures\, hot spots and temperature spikes can
  have a major impact on reliability. It is essential that one have a thoro
 ugh understanding of static and dynamic thermal performance under operatin
 g and static conditions. This has traditionally been complex\, time consum
 ing\, and often lacked the resolution required to detect thermal anomalies
  that could lead to early device failures. Fortunately\, advances in therm
 al imaging techniques that combine the benefits of thermoreflectance-based
  analysis with illumination wavelengths from near-ultraviolet to near infr
 ared coupled with infrared thermography can support thermal\, spatial\, an
 d transient resolution consistent with today’s advanced complex device s
 tructures and shrinking geometries. In addition\, equipment has advanced t
 o considerably reduce the time and cost to get accurate results. Many exam
 ples will be shared to fully illustrate the device thermal behaviors that 
 can be detected with these advanced thermal analysis techniques.\n\nCo-spo
 nsored by: Habib Hichri\n\nVirtual: https://events.vtools.ieee.org/m/33689
 8
LOCATION:Virtual: https://events.vtools.ieee.org/m/336898
ORGANIZER:trichur.ram@gmail.com
SEQUENCE:2
SUMMARY:CO-hosting event: Thermal and Failure Analysis of Advanced Sub-Micr
 on Devices
URL;VALUE=URI:https://events.vtools.ieee.org/m/336898
X-ALT-DESC:Description: <br /><p><em>Electronics Packaging Chapter</em></p>
 \n<p><strong>Thermal and Failure Analysis of Advanced Sub-Micron Devices <
 /strong></p>\n<p><em>-- thermal imaging\, fine-geometry\, static/dynamic\,
  high-resolution\, thermoreflectance\, near-ultraviolet to infrared\, exam
 ples ...</em></p>\n<p>Speaker: Dr. Mo Shakouri\, Microsanj Corp.</p>\n<p>D
 ate: Thursday\, January 26\, 2023</p>\n<p>Location: in person at SEMI Worl
 d Hdqtrs\, Milpitas\, CA USA (and via WebEx)</p>\n<p>Time: Checkin at SEMI
  (sandwiches and drinks) at 11:30 AM\; Presentation at noon (PST). WebEx a
 t noon.</p>\n<p>Cost: none</p>\n<p>vTools Information: <a href="https://ev
 ents.vtools.ieee.org/m/336546">https://events.vtools.ieee.org/m/336546</a>
 </p>\n<p>Registration: <a href="https://r6.ieee.org/scv-eps/?p=2998">https
 ://r6.ieee.org/scv-eps/?p=2998</a></p>\n<p>Summary: Performance requiremen
 ts for today&rsquo\;s semiconductor and optoelectronic devices are leading
  to shrinking geometries\, more complex 3-dimensional structures\, and new
  materials. High temperatures\, hot spots and temperature spikes can have 
 a major impact on reliability. It is essential that one have a thorough un
 derstanding of static and dynamic thermal performance under operating and 
 static conditions. This has traditionally been complex\, time consuming\, 
 and often lacked the resolution required to detect thermal anomalies that 
 could lead to early device failures. Fortunately\, advances in thermal ima
 ging techniques that combine the benefits of thermoreflectance-based analy
 sis with illumination wavelengths from near-ultraviolet to near infrared c
 oupled with infrared thermography can support thermal\, spatial\, and tran
 sient resolution consistent with today&rsquo\;s advanced complex device st
 ructures and shrinking geometries. In addition\, equipment has advanced to
  considerably reduce the time and cost to get accurate results. Many examp
 les will be shared to fully illustrate the device thermal behaviors that c
 an be detected with these advanced thermal analysis techniques.</p>
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END:VCALENDAR