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DTSTAMP:20230115T022508Z
UID:94011BE3-CA22-44AF-A942-608BD0F9B7C4
DTSTART;TZID=America/New_York:20221213T100000
DTEND;TZID=America/New_York:20221213T115900
DESCRIPTION:The Poly-Grames Research Centre has acquired major millimetre-w
 ave infrastructures enabling it to further develop its modelling\, manufac
 turing and measurement (up to 110 GHz) operations. Current research into m
 illimetre waves will be further explored thanks to the novel hybrid and mo
 nolithic manufacturing technologies now available.\n\nIn this visit\, an o
 verview of the various microwave circuit manufacturing technologies availa
 ble to Polygrams will be presented including: printed circuit board on dur
 oid substrates\, thin film MHMIC on ceramics\, laser machining of metals\,
  ceramics\, TMM\, etc.\, and high precision machining on CNC.\n\nThe visio
 n of integration with the consideration of manufacturing limits will be di
 scussed.\n\nCo-sponsored by: Poly- Staracom\n\nSpeaker(s): Traian Antonesc
 u\, \n\nRoom: M6022\, Bldg: Pavillon Lassonde / M-6106\, Polytechnique Mon
 tréal-Centre de recherche Poly-Grames\, 2500\, Chemin Polytechnique\, Mon
 treal\, Quebec\, Canada\, H3T 1J4
LOCATION:Room: M6022\, Bldg: Pavillon Lassonde / M-6106\, Polytechnique Mon
 tréal-Centre de recherche Poly-Grames\, 2500\, Chemin Polytechnique\, Mon
 treal\, Quebec\, Canada\, H3T 1J4
ORGANIZER:tarek.djerafi@inrs.ca
SEQUENCE:10
SUMMARY:Microwave circuit manufacturing technologies 
URL;VALUE=URI:https://events.vtools.ieee.org/m/337079
X-ALT-DESC:Description: <br /><p>The Poly-Grames Research Centre has acquir
 ed major millimetre-wave infrastructures enabling it to further develop it
 s modelling\, manufacturing and measurement (up to 110 GHz) operations. Cu
 rrent research into millimetre waves will be further explored thanks to th
 e novel hybrid and monolithic manufacturing technologies now available.</p
 >\n<p>In this visit\, an overview of the various microwave circuit manufac
 turing technologies available to Polygrams will be presented including: pr
 inted circuit board on duroid substrates\, thin film MHMIC on ceramics\, l
 aser machining of metals\, ceramics\, TMM\, etc.\, and high precision mach
 ining on CNC.</p>\n<p>The vision of integration with the consideration of 
 manufacturing limits will be discussed.</p>\n<p>&nbsp\;</p>\n<p>&nbsp\;</p
 >
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