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DESCRIPTION:FREE Webinar\n\nThe reliability and manufacturability of BGA de
 vices is becoming more dependent on the PCB structure\, layout and chassis
  design. With every increasing part densities the chassis design (PCB moun
 ting)\, board layout\, and underfills can cause additional stresses to be 
 applied to the BGA device beyond just the thermal expansion mismatch. This
  presentation will cover some of the thermal-mechanical issues\, manufactu
 ring defects\, and modeling techniques that can be used to help determine 
 the reliability of BGA devices.\n\nSpeaker(s): Nathan Blattau\, \n\nAgenda
 : \n11:00 AM Technical Presentation\n\n11:45 AM Questions and Answers\n\n1
 2:00 PM Adjournment\n\nVirtual: https://events.vtools.ieee.org/m/337840
LOCATION:Virtual: https://events.vtools.ieee.org/m/337840
ORGANIZER:michael.bannan@ieee.org
SEQUENCE:9
SUMMARY:Webinar - BGA Reliability and Manufacturing Challenges
URL;VALUE=URI:https://events.vtools.ieee.org/m/337840
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;&lt;em&gt;FREE Webinar&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;
 \n&lt;p&gt;&lt;span style=&quot;color: #222222\;&quot;&gt;&lt;span style=&quot;font-family: Arial\, Helv
 etica\, sans-serif\;&quot;&gt;&lt;span style=&quot;font-size: medium\;&quot;&gt;The reliability an
 d manufacturability of BGA devices is becoming more dependent on the PCB s
 tructure\, layout and chassis design. With every increasing part densities
  the chassis design (PCB mounting)\, board layout\, and underfills can cau
 se additional stresses to be applied to the BGA device beyond just the the
 rmal expansion mismatch. This presentation will cover some of the thermal-
 mechanical issues\, manufacturing defects\, and modeling techniques that c
 an be used to help determine the reliability of BGA devices.&lt;/span&gt;&lt;/span&gt;
 &lt;/span&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;11:00 AM&lt;/
 strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;Technical Presentation&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;11:45 A
 M&lt;/strong&gt;&amp;nbsp\;&amp;nbsp\; Questions and Answers&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;12:00 PM&lt;/s
 trong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;Adjournment&lt;/p&gt;
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