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DTSTART:20230312T030000
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DTSTART:20221106T010000
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DTSTAMP:20230308T223356Z
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DTSTART;TZID=US/Eastern:20230214T120000
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DESCRIPTION:In this talk\, I will present radio frequency design solutions 
 for wireless sensors and communication nodes to solve sustainability issue
 s in the Internet of things (IoT) due to the massive deployment of wireles
 s IoT nodes on environmental\, economic\, and societal levels. Engineers c
 an apply these design solutions to improve the (ultra-)low-power operation
  of IoT nodes\, avoid batteries’ eco-toxicity\, and decrease maintenance
  costs due to battery replacement. The presented solutions offer high inte
 gration levels based on system-on-chip and system-in-package concepts in l
 ow-cost complementary metal-oxide-semiconductor technologies to limit the 
 costs and carbon footprints of these nodes.\n\nPlease click the link for r
 egistration for attending the webinar: ([Register now](https://event.on24.
 com/wcc/r/4074075/12292C487DF313A718847C5A928C46CF))\n\nCo-sponsored by: I
 EEE North Jersey Section\n\nSpeaker(s): Prof. Jasmin Grosinger\, \n\nAgend
 a: \nPlease click the link for registration for attending the webinar: ([R
 egister now](https://event.on24.com/wcc/r/4074075/12292C487DF313A718847C5A
 928C46CF))\n\nVirtual: https://events.vtools.ieee.org/m/342941
LOCATION:Virtual: https://events.vtools.ieee.org/m/342941
ORGANIZER:akpoddar@ieee.org
SEQUENCE:3
SUMMARY:RF Design for Sustainability
URL;VALUE=URI:https://events.vtools.ieee.org/m/342941
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;In this talk\, I will present radio freque
 ncy design solutions for wireless sensors and communication nodes to solve
  sustainability issues in the Internet of things (IoT) due to the massive 
 deployment of wireless IoT nodes on environmental\, economic\, and societa
 l levels. Engineers can apply these design solutions to improve the (ultra
 -)low-power operation of IoT nodes\, avoid batteries&amp;rsquo\; eco-toxicity\
 , and decrease maintenance costs due to battery replacement. The presented
  solutions offer high integration levels based on system-on-chip and syste
 m-in-package concepts in low-cost complementary metal-oxide-semiconductor 
 technologies to limit the costs and carbon footprints of these nodes.&lt;/p&gt;\
 n&lt;p&gt;&lt;span style=&quot;font-size: 14pt\;&quot;&gt;Please click the link for registration
  for attending the webinar: &lt;strong&gt;(&lt;a href=&quot;https://event.on24.com/wcc/r
 /4074075/12292C487DF313A718847C5A928C46CF&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot;&gt;
 Register now&lt;/a&gt;)&lt;/strong&gt;&lt;/span&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&lt;span st
 yle=&quot;font-size: 14pt\;&quot;&gt;Please click the link for registration for attendi
 ng the webinar: &lt;strong&gt;(&lt;a href=&quot;https://event.on24.com/wcc/r/4074075/122
 92C487DF313A718847C5A928C46CF&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot;&gt;Register now
 &lt;/a&gt;)&lt;/strong&gt;&lt;/span&gt;&lt;/p&gt;
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