BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20230312T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20231105T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20240207T031856Z UID:74DABF4F-D3D2-4132-9FBD-BA66F96289DC DTSTART;TZID=America/New_York:20230426T110000 DTEND;TZID=America/New_York:20230426T130000 DESCRIPTION:This talk describes two new Heterogeneous Multichip Packaged (M CP) devices prototyped under the DoD State of the Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program. These devices were designed by integ rating state-of-the-art Quad-Channel Direct RF Data Converter Tiles (DCTs) operating at 64 Giga Samples per Second (GSPS) in the same package with l eading-edge Field Programmable Gate Array (FPGA) devices. The DCTs also in clude built-in Digital Upconverters (DUCs) and Digital Downconverters (DDC s) to offload this processing from the FPGAs and lower the overall power o f the device. The DUCs and DDCs can be tuned in real-time across the full 32GHz of instantaneous input bandwidth (IBW). The Direct RF capabilities o f the DCTs combined with the massive IBW\, high dynamic range\, low latenc y\, small size\, and low power of these devices allow unprecedented improv ements to the Size\, Weight\, Power & Cost (SWAP-C) for Electronic Warfare Systems. We will give an overview of the SHIP program\, describe the two MCP configurations offered\, describe the operating modes of the Data Conv erter Tiles\, show some RF performance measurements of the DCTs\, and fina lly will discuss some target applications for the MCP devices.\nAttend vir tually or in person and enjoy a complimentary lunch while learning about t his technology!\n\nPresenters:\n\nDr. Darren Crum\, Technical Area Lead an d Program Technical Manager\, NSWC Crane\n\nMr. Ben Esposito\, Senior Prin cipal Engineer\, Intel PSG\n\nMr. Carmine Pagano\, SHIP Systems Architect & Technical Director\, Intel PSG\n\nCo-sponsored by: MTT/AP-S\, AES Chapte r\n\nSpeaker(s): Dr. Darren Crum\, Mr. Ben Esposito\n\nAgenda: \nWednesday \, April 26\, 2023\, 1130 AM-1:00 PM (EST)\n\nVenue: L3Harris Technologies \, Auditorium\, 77 River Road\, Clifton\, NJ\n\nand YOUR DESK via MS Teams !\n\nRSVP No Later Than Thursday\, April 18 to Nicole Zaretski\, [Nicole.Z aretski@l3harris.com](mailto:Nicole.Zaretski@l3harris.com?subject=RSVP:%20 24%20Jan%20AOC%20L&L)\n\nPlease note: in-person attendance is limited to U S-ONLY. Non-L3Harris individuals will be required to provide information f or security screening prior to arrival Seating is Limited - Pizza and Beve rages are Provided for Lunch Courtesy of\n\nBldg: Auditorium \, L3Harris T echnologies\, 77 River Road\, Clifton\, New Jersey\, United States LOCATION:Bldg: Auditorium \, L3Harris Technologies\, 77 River Road\, Clifto n\, New Jersey\, United States ORGANIZER:anisha_apte@ieee.org SEQUENCE:5 SUMMARY:Game Changing Technology for EW Systems URL;VALUE=URI:https://events.vtools.ieee.org/m/352229 X-ALT-DESC:Description: <br /><p>This talk describes two new Heterogeneous Multichip Packaged (MCP) devices prototyped under the DoD State of the Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program.&nbsp\; These de vices were designed by integrating state-of-the-art Quad-Channel Direct RF Data Converter Tiles (DCTs) operating at 64 Giga Samples per Second (GSPS ) in the same package with leading-edge Field Programmable Gate Array (FPG A) devices.&nbsp\; The DCTs also include built-in Digital Upconverters (DU Cs) and Digital Downconverters (DDCs) to offload this processing from the FPGAs and lower the overall power of the device.&nbsp\; The DUCs and DDCs can be tuned in real-time across the full 32GHz of instantaneous input ban dwidth (IBW).&nbsp\; The Direct RF capabilities of the DCTs combined with the massive IBW\, high dynamic range\, low latency\, small size\, and low power of these devices allow unprecedented improvements to the Size\, Weig ht\, Power &amp\; Cost (SWAP-C) for Electronic Warfare Systems.&nbsp\; We will give an overview of the SHIP program\, describe the two MCP configura tions offered\, describe the operating modes of the Data Converter Tiles\, show some RF performance measurements of the DCTs\, and finally will disc uss some target applications for the MCP devices.<br />Attend virtually or in person and enjoy a complimentary lunch while learning about this techn ology!</p>\n<p><span style="font-size: 14pt\;"><strong>Presenters:&nbsp\;< /strong></span></p>\n<p>&nbsp\; &nbsp\;<strong>Dr. Darren Crum\, Technical Area Lead and &nbsp\; Program Technical Manager\, NSWC Crane</strong></p> \n<p><strong>&nbsp\; &nbsp\;Mr. Ben Esposito\, Senior Principal Engineer\, Intel PSG</strong></p>\n<p><strong>&nbsp\; &nbsp\;Mr. Carmine Pagano\, SH IP Systems &nbsp\;Architect &amp\; Technical Director\, Intel PSG</strong> </p><br /><br />Agenda: <br /><p>Wednesday\, April 26\, 2023\,&nbsp\;1130 AM-1:00 PM (EST)</p>\n<p>Venue: L3Harris Technologies\, Auditorium\,&nbsp\ ;&nbsp\;77 River Road\, Clifton\, NJ</p>\n<p><em>and </em><u><strong><em>Y OUR DESK </em></strong></u><em>via MS Teams!</em></p>\n<p><strong><em>RSVP No Later Than Thursday\, April 18 to </em></strong><em>Nicole Zaretski\, </em><em><a href="mailto:Nicole.Zaretski@l3harris.com?subject=RSVP:%2024%2 0Jan%20AOC%20L&amp\;L">Nicole.Zaretski@l3harris.com</a></em><em> </em></p> \n<p><strong><em>Please note: </em></strong><u><strong><em>in-person </em> </strong></u><strong><em>attendance is limited to </em></strong><u><strong ><em>US-ONLY</em></strong></u><strong><em>. Non-L3Harris individuals will be required to provide information for security screening prior to arrival &nbsp\;</em></strong><strong><em>Seating is Limited - Pizza and Beverages are Provided for Lunch Courtesy of</em></strong></p> END:VEVENT END:VCALENDAR