BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT DTSTART:20240329T030000 TZOFFSETFROM:+0200 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=-1FR;BYMONTH=3 TZNAME:IDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20241027T010000 TZOFFSETFROM:+0300 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:IST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250127T082119Z UID:C1D710E0-C15F-4102-B8A0-2439628C2C86 DTSTART;TZID=Asia/Jerusalem:20240709T090000 DTEND;TZID=Asia/Jerusalem:20240711T090200 DESCRIPTION:On behalf of the IEEE COMCAS 2024 Steering Committee\, we are p leased to launch the 9th International IEEE Conference on Microwaves\, Com munications\, Antennas\, Biomedical Engineering and Electronic Systems (IE EE COMCAS 2024).\nIn 2024\, the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange o f ideas\, research results\, and industry experience in a range of key are as i.e.\, microwaves\, communications\, and sensors\, antennas\, biomedica l engineering\, RF and microwave devices and circuits\, thermal management and electronic packaging\, signal processing and imaging\, as well as rad ar\, acoustics and microwave system engineering.\nThe event includes a tec hnical program\, industry exhibits\, and guest presentations from global e xperts on recent academic and industry advancements.\nIn launching the 202 3 event\, we would also like to welcome you to the sunshine of the eastern Mediterranean\, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation\, Tel Aviv is a center that resonates with an energize d atmosphere\, streets of storied history\, and an internationally recogni zed nightlife.\nTaking place 6-8 November 2023 in Tel Aviv\, Israel\, at t he David Intercontinental Hotel by the Mediterranean Sea\; IEEE COMCAS wil l continue a biennial series tailored to maximize professional networking\ , support the candid exchange of ideas\, and develop a range of enduring o pportunities.\n\nConference Dates: 9-11 July 2024\nVenue: David Interconti nental Hotel\, Tel Aviv\, Israel\n\nI\n\nDownload Call for Papers file [HE RE](https://www.comcas.org/Portals/173/CFP-03-12-2023.pdf)\nPapers submiss ion: [EDAS Login](https://edas.info/N30559)\n\nLIST OF TOPICS\n\nCommunica tions and Sensors\nBeyond 5G – Systems & Technologies\nAI\, Machine Lear ning\, Deep Learning in Communications and Sensors\nBig Data in Communicat ion Networks\nMIMO & Space-Time Coding Technologies\n5G systems & Millimet er Wave Propagation\nCognitive Radio & Spectral Sharing\nCommunications Se curity\nFirst Responder/Military Communications\nGreen Communication\nInte rnet of Things\nLong Range Low Power Networks\nMicro/Pico/Femtocell Device s and Systems\nModulation & Signal Processing Technologies\nOn-Body and Sh ort Range Communications\nRadio over Fiber & Optical/Wireless Convergence\ nSensor Networks and Technologies\nSoftware-Defined Radio & Multiple Acces s\n\nAntennas\, Propagation\, and Scattering\nAntenna Theory and Design\nS mart Antennas\, Beamforming and MIMO\nWave Propagation and Channel Modelin g\nWave Scattering and RCS\nNanoEM\, Plasmonics\, and Applications\nMetama terials\, FSS and EBG\nEM Field Theory and Numerical Techniques\nEM Interf erence & Compatibility\, SI\nSpectrum Management and Monitoring\nELF\, RF\ , μWave\, mmW and THz Measurements\n\nElectronic Packaging & Thermal Mana gement (P&TM)\nChip\, Package and PCB – Design\, Advanced Materials and Technologies\nChip & Board Level Assembly\nAdvanced Packaging – 2.5D\, 3 D and Heterogenous\nIntegration\n3D Printing & Additive Manufacturing of E lectronics\nElectro Photonics Packaging\nAdhesives\, Molding & Encapsulati on – Materials &\nTechnologies\nSoldering & Brazing for Electronic Packa ging\nBio Medical Packaging\nPlating & Coating – Materials & Technologie s\nDestructive and Non-destructive Testing\nThermal Management in Electron ic Systems – Methods\,\nModeling and Solutions\nConnectors\, Cables & Ro uting\nInspection – Technologies & Methods\nReliability in Electronic Sy stems\n\nBiomedical Engineering\nBig Data in Medicine\nArtificial Intellig ence\, Machine Learning\, Deep Learning\nBiomedical Systems and Applicatio ns\nAdvances in Medical Imaging Technology\nMedical RF\, MW & MMW Applicat ions and Devices\nMedical Image Processing\nAcousto-Optic Technologies\nNo vel Therapeutic Modalities\nEffects of RF and MW on Biological Tissues\n\n RF/MW Devices and Circuits\, RFICs\nSolid-State Devices\, RFICs\nμWave\, mmW and Sub-mmW Circuits/Technologies\nNano and THz Devices/Technologies\n Microwave Photonics\nPassive Components and Circuits\nFilters and Multiple xers\nFerroelectrics\, RF MEMS\, MOEMS\, and NEMS\nActive Devices and Circ uits\nRF Power Amplifiers and Devices\nTunable and Reconfigurable Circuits /Systems\nAnalog/Digital/Mixed RF Circuits\nCircuit Theory\, Modeling and Applications\nInterconnects\, Packaging and MCM\nCAD Techniques for Device s and Circuits\nEmerging Technologies\nInternet of Things Devices\n\nMicro wave Systems\, Radar\, Acoustics\nAeronautical and Space Applications\nRFI D Devices/Systems/Applications\nAutomotive/Transportation Radar & Communic ations\nEnvironmentally Sensitive (“Green”) Design\nUWB and Multispect ral Technologies & Systems\nEmerging System Architectures\nModelling Techn iques for RF Systems\nRadar Techniques\, Systems and Applications\nSonar S ystems and Applications\nWireless Power Transfer & Energy Harvesting\nTera hertz Systems\nAI\, Machine Learning\, Deep Learning in Microwave\, Radar\ , and Acoustic Systems\n\nSignal Processing (SP) and Imaging\nMicrowave Im aging and Tomography\nAcoustic/Sonar Imaging and Techniques\nRadar SP and Imaging\, SAR\, ATR\nMIMO SP for Radar\nGround and Foliage Penetration Sys tems\nSignal Acquisition and Sensor Management\nDF\, Emitter Location\, El int\, Array Processing\nTarget Detection\, Identification and Tracking\nDa ta Fusion\nTime Domain and UWB SP\nAI\, Machine Learning\, Deep Learning i n Signal and Image Processing\n\nConference Chair: Shmuel Auster\nTechnica l Program Chair: Amir Boag\n\nWebsite: www.comcas.org\n\nCo-sponsored by: IEEE MTTS\, IEEE AESS\, IEEE APS\, IEEE EPS\, EuMA\, AEAI \n\nDAVID INTERC ONTINENTAL HOTEL\, Tel Aviv\, Tel Aviv District\, Israel LOCATION:DAVID INTERCONTINENTAL HOTEL\, Tel Aviv\, Tel Aviv District\, Isra el ORGANIZER:austers@gmail.com SEQUENCE:6 SUMMARY:IEEE COMCAS 2024 URL;VALUE=URI:https://events.vtools.ieee.org/m/353153 X-ALT-DESC:Description: <br /><p>On behalf of the IEEE COMCAS 2024 Steering Committee\, we are pleased to launch the 9th International IEEE Conferenc e on Microwaves\, Communications\, Antennas\, Biomedical Engineering and E lectronic Systems (IEEE COMCAS 2024).<br>In 2024\, the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary f orum for the exchange of ideas\, research results\, and industry experienc e in a range of key areas i.e.\, microwaves\, communications\, and sensors \, antennas\, biomedical engineering\, RF and microwave devices and circui ts\, thermal management and electronic packaging\, signal processing and i maging\, as well as radar\, acoustics and microwave system engineering.<br >The event includes a technical program\, industry exhibits\, and guest pr esentations from global experts on recent academic and industry advancemen ts.<br>In launching the 2023 event\, we would also like to welcome you to the sunshine of the eastern Mediterranean\, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation\, Tel Aviv is a center that resonates with an energized atmosphere\, streets of storied history\, and an internationally recognized nightlife.<br>Taking place 6-8 November 202 3 in Tel Aviv\, Israel\, at the David Intercontinental Hotel by the Medite rranean Sea\; IEEE COMCAS will continue a biennial series tailored to maxi mize professional networking\, support the candid exchange of ideas\, and develop a range of enduring opportunities.<br><br><strong>Conference Dates : </strong>9-11 July 2024<br><strong>Venue:</strong> David Intercontinenta l Hotel\, Tel Aviv\, Israel</p>\n<p><span style="text-decoration: underlin e\;"><strong>I</strong></span></p>\n<h2>Download Call for Papers file&nbsp \;<a class="tooltipstered" href="https://www.comcas.org/Portals/173/CFP-03 -12-2023.pdf" target="_blank" rel="noopener">HERE</a><br>Papers submission : <a href="https://edas.info/N30559">EDAS Login</a></h2>\n<p><span style=" text-decoration: underline\;"><strong>LIST OF TOPICS</strong></span></p>\n <p><span style="text-decoration: underline\;"><strong>Communications and S ensors</strong></span><br>Beyond 5G &ndash\; Systems &amp\; Technologies<b r>AI\, Machine Learning\, Deep Learning in Communications and Sensors<br>B ig Data in Communication Networks<br>MIMO &amp\; Space-Time Coding Technol ogies<br>5G systems &amp\; Millimeter Wave Propagation<br>Cognitive Radio &amp\; Spectral Sharing<br>Communications Security<br>First Responder/Mili tary Communications<br>Green Communication<br>Internet of Things<br>Long R ange Low Power Networks<br>Micro/Pico/Femtocell Devices and Systems<br>Mod ulation &amp\; Signal Processing Technologies<br>On-Body and Short Range C ommunications<br>Radio over Fiber &amp\; Optical/Wireless Convergence<br>S ensor Networks and Technologies<br>Software-Defined Radio &amp\; Multiple Access</p>\n<p><span style="text-decoration: underline\;"><strong>Antennas \, Propagation\, and Scattering</strong></span><br>Antenna Theory and Desi gn<br>Smart Antennas\, Beamforming and MIMO<br>Wave Propagation and Channe l Modeling<br>Wave Scattering and RCS<br>NanoEM\, Plasmonics\, and Applica tions<br>Metamaterials\, FSS and EBG<br>EM Field Theory and Numerical Tech niques<br>EM Interference &amp\; Compatibility\, SI<br>Spectrum Management and Monitoring<br>ELF\, RF\, &mu\;Wave\, mmW and THz Measurements</p>\n<p ><span style="text-decoration: underline\;"><strong>Electronic Packaging & amp\; Thermal Management (P&amp\;TM)</strong></span><br>Chip\, Package and PCB &ndash\; Design\, Advanced Materials and Technologies<br>Chip &amp\; Board Level Assembly<br>Advanced Packaging &ndash\; 2.5D\, 3D and Heteroge nous<br>Integration<br>3D Printing &amp\; Additive Manufacturing of Electr onics<br>Electro Photonics Packaging<br>Adhesives\, Molding &amp\; Encapsu lation &ndash\; Materials &amp\;<br>Technologies<br>Soldering &amp\; Brazi ng for Electronic Packaging<br>Bio Medical Packaging<br>Plating &amp\; Coa ting &ndash\; Materials &amp\; Technologies<br>Destructive and Non-destruc tive Testing<br>Thermal Management in Electronic Systems &ndash\; Methods\ ,<br>Modeling and Solutions<br>Connectors\, Cables &amp\; Routing<br>Inspe ction &ndash\; Technologies &amp\; Methods<br>Reliability in Electronic Sy stems</p>\n<p><span style="text-decoration: underline\;"><strong>Biomedica l Engineering<br></strong></span>Big Data in Medicine<br>Artificial Intell igence\, Machine Learning\, Deep Learning<br>Biomedical Systems and Applic ations<br>Advances in Medical Imaging Technology<br>Medical RF\, MW &amp\; MMW Applications and Devices<br>Medical Image Processing<br>Acousto-Optic Technologies<br>Novel Therapeutic Modalities<br>Effects of RF and MW on B iological Tissues</p>\n<p><span style="text-decoration: underline\;"><stro ng>RF/MW Devices and Circuits\, RFICs</strong></span><br>Solid-State Devic es\, RFICs<br>&mu\;Wave\, mmW and Sub-mmW Circuits/Technologies<br>Nano an d THz Devices/Technologies<br>Microwave Photonics<br>Passive Components an d Circuits<br>Filters and Multiplexers<br>Ferroelectrics\, RF MEMS\, MOEMS \, and NEMS<br>Active Devices and Circuits<br>RF Power Amplifiers and Devi ces<br>Tunable and Reconfigurable Circuits/Systems<br>Analog/Digital/Mixed RF Circuits<br>Circuit Theory\, Modeling and Applications<br>Interconnect s\, Packaging and MCM<br>CAD Techniques for Devices and Circuits<br>Emergi ng Technologies<br>Internet of Things Devices</p>\n<p><span style="text-de coration: underline\;"><strong>Microwave Systems\, Radar\, Acoustics</stro ng></span><br>Aeronautical and Space Applications<br>RFID Devices/Systems/ Applications<br>Automotive/Transportation Radar &amp\; Communications<br>E nvironmentally Sensitive (&ldquo\;Green&rdquo\;) Design<br>UWB and Multisp ectral Technologies &amp\; Systems<br>Emerging System Architectures<br>Mod elling Techniques for RF Systems<br>Radar Techniques\, Systems and Applica tions<br>Sonar Systems and Applications<br>Wireless Power Transfer &amp\; Energy Harvesting<br>Terahertz Systems<br>AI\, Machine Learning\, Deep Lea rning in Microwave\, Radar\, and Acoustic Systems</p>\n<p><span style="tex t-decoration: underline\;"><strong>Signal Processing (SP) and Imaging</str ong></span><br>Microwave Imaging and Tomography<br>Acoustic/Sonar Imaging and Techniques<br>Radar SP and Imaging\, SAR\, ATR<br>MIMO SP for Radar<br >Ground and Foliage Penetration Systems<br>Signal Acquisition and Sensor M anagement<br>DF\, Emitter Location\, Elint\, Array Processing<br>Target De tection\, Identification and Tracking<br>Data Fusion<br>Time Domain and UW B SP<br>AI\, Machine Learning\, Deep Learning in Signal and Image Processi ng</p>\n<p>Conference Chair: Shmuel Auster<br>Technical Program Chair: Ami r Boag<br><br>Website: www.comcas.org</p> END:VEVENT END:VCALENDAR