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DESCRIPTION:[Electro-thermal simulation analysis is critical in the design 
 and optimization of various electronic systems\, such as power electronics
 \, integrated circuits\, and sensors. In electro-thermal simulation analys
 is\, electrical and thermal models are integrated to simulate the behavior
  of the device under different operating conditions. The electrical model 
 considers the device's electrical properties\, while the thermal model con
 siders the heat transfer mechanisms\, such as conduction\, convection\, an
 d radiation. The results of the simulation provide valuable insights into 
 the device's performance\, reliability\, and safety. With the recent integ
 ration of the Cadence® Celsius™ Thermal Solver within the Cadence AWR D
 esign Environment® platform\, RF designers now have access to electro-the
 rmal analysis for monolithic microwave IC (MMIC)/RFIC\, PCB\, and module d
 esigns. This discussion will highlight how the Celsius Thermal Solver dire
 ctly uses design data such as layout geometries\, material properties\, an
 d dissipated power simulation results from Microwave Office® to provide d
 esigners with thermal heat map visualization and operating temperature inf
 ormation critical to design success.](https://mail.google.com/mail/u/0/#in
 box/KtbxLzGLkSDnjRmfNDMgJDqxQhmPZxZzLq)\n\nSpeaker(s): Dustin Hoekstra\, \
 n\nAgenda: \n6:00 to 6:45 PM Social Mixer\n\n6:45 PM Talk\n\n7:45 Adjourn\
 n\nBldg: Conference Area\, 501 Amapola Avenue\, Torrance\, California\, Ca
 lifornia\, United States\, 90501
LOCATION:Bldg: Conference Area\, 501 Amapola Avenue\, Torrance\, California
 \, California\, United States\, 90501
ORGANIZER:e.camargo@gmail.com
SEQUENCE:5
SUMMARY:Addressing Performance and Reliability Concerns with Thermal Analys
 is for RF Power Applications
URL;VALUE=URI:https://events.vtools.ieee.org/m/355837
X-ALT-DESC:Description: <br /><p><a title="Addressing Performance and Relia
 bility Concerns with Thermal Analysis for RF Power Applications" href="htt
 ps://mail.google.com/mail/u/0/#inbox/KtbxLzGLkSDnjRmfNDMgJDqxQhmPZxZzLq">E
 lectro-thermal simulation analysis is critical in the design and optimizat
 ion of various electronic systems\, such as power electronics\, integrated
  circuits\, and sensors. In electro-thermal simulation analysis\, electric
 al and thermal models are integrated to simulate the behavior of the devic
 e under different operating conditions. The electrical model considers the
  device's electrical properties\, while the thermal model considers the he
 at transfer mechanisms\, such as conduction\, convection\, and radiation. 
 The results of the simulation provide valuable insights into the device's 
 performance\, reliability\, and safety. With the recent integration of the
  Cadence&reg\; Celsius&trade\; Thermal Solver within the Cadence AWR Desig
 n Environment&reg\; platform\, RF designers now have access to electro-the
 rmal analysis for monolithic microwave IC (MMIC)/RFIC\, PCB\, and module d
 esigns. This discussion will highlight how the Celsius Thermal Solver dire
 ctly uses design data such as layout geometries\, material properties\, an
 d dissipated power simulation results from Microwave Office&reg\; to provi
 de designers with thermal heat map visualization and operating temperature
  information critical to design success.</a></p><br /><br />Agenda: <br />
 <p>6:00 to 6:45 PM Social Mixer</p>\n<p>6:45 PM Talk</p>\n<p>7:45 Adjourn<
 /p>
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