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DTSTART:20230312T030000
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DTSTART:20231105T010000
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BEGIN:VEVENT
DTSTAMP:20230615T210113Z
UID:531A46BE-41DD-4F07-84E7-108E46AE7D86
DTSTART;TZID=America/Los_Angeles:20230615T120000
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DESCRIPTION:Massive demands are being placed on computing due to skyrocketi
 ng increases in data consumption. Penetration of AI and ML into more and m
 ore fields requires real-time fast processing at the edge as well as fast 
 data transfer to datacenters for analysis. 5G and 6G technologies demand e
 ver increasing frequency for wireless communications. Autonomous driving a
 nd other harsh environments demand high reliability. The semiconductor ind
 ustry needs to continuously deliver better performance from a smaller foot
 print with higher frequency response\, higher reliability\, lower power co
 nsumption\, and all with a lower barrier for entry than advances at the tr
 ansistor level. How are these rigorous market demands influencing innovati
 ons in chip manufacturing and advanced interconnect such as hybrid bonding
 ?\nThis presentation will give a brief introduction of the hybrid bonding 
 technology\, how it enables disaggregation and heterogeneous integration a
 nd helps increase efficiency and performance while shrinking footprint\, a
 nd how it enables high reliability.\n\nSpeaker(s):  Guilian Gao\, \n\nSEMI
  World Hdqtrs\, 673 S Milpitas Blvd\, Milpitas\, California\, United State
 s\, 95035\, Virtual: https://events.vtools.ieee.org/m/360650
LOCATION:SEMI World Hdqtrs\, 673 S Milpitas Blvd\, Milpitas\, California\, 
 United States\, 95035\, Virtual: https://events.vtools.ieee.org/m/360650
ORGANIZER:p.wesling@ieee.org
SEQUENCE:2
SUMMARY:Hybrid Bonding: Greater Functionality\, Higher Performance and Smal
 ler Size
URL;VALUE=URI:https://events.vtools.ieee.org/m/360650
X-ALT-DESC:Description: <br /><p>Massive demands are being placed on comput
 ing due to skyrocketing increases in data consumption. Penetration of AI a
 nd ML into more and more fields requires real-time fast processing at the 
 edge as well as fast data transfer to datacenters for analysis. 5G and 6G 
 technologies demand ever increasing frequency for wireless communications.
  Autonomous driving and other harsh environments demand high reliability. 
 The semiconductor industry needs to continuously deliver better performanc
 e from a smaller footprint with higher frequency response\, higher reliabi
 lity\, lower power consumption\, and all with a lower barrier for entry th
 an advances at the transistor level. How are these rigorous market demands
  influencing innovations in chip manufacturing and advanced interconnect s
 uch as hybrid bonding?<br />This presentation will give a brief introducti
 on of the hybrid bonding technology\, how it enables disaggregation and he
 terogeneous integration and helps increase efficiency and performance whil
 e shrinking footprint\, and how it enables high reliability.</p>
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