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DTSTAMP:20230731T174136Z
UID:3134831D-DD0F-49EC-B0EA-11E32887E2F4
DTSTART;TZID=Europe/Dublin:20230727T160000
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DESCRIPTION:Abctract:\n\nDuring the past decades wireless communication has
  made an enormous growth. Triggered by a large R&D effort\, the integratio
 n of transceivers in CMOS technology has made low cost mass production pos
 sible. For many applications like Bluetooth\, a single chip CMOS transceiv
 er can now do the job. On the other hand\, for complex transceivers like i
 n modern smartphones\, still more discrete RF components such as filters\,
  switches and diplexers are being added to protect the transceiver from st
 rong interferers which are often produced by the device itself. To satisfy
  the future bandwidth hunger\, the number of frequency bands will further 
 increase\, modulation schemes will become more complex\, more antennas wil
 l be used and carrier aggregation will be the norm. To limit the number of
  discrete RF components\, linearity of the transceivers is key.\n\nSince m
 ore computing power will be needed in future transceivers as well\, newer 
 CMOS technologies are also wanted. CMOS technology will scale in favour of
  fast-switching digital circuits\, but not for classical analog functions\
 , like amplifiers.\n\nFor the next fifteen years re-thinking of basic circ
 uits and systems will be needed to make highly integrated linear transceiv
 ers\, in a technology that is designed for digital circuits.\n\nCo-sponsor
 ed by: Tyndall National Institute\n\nRoom: B.0.17\, Tyndall National Insti
 tute\, Lee Maltings Complex Dyke Parade\, Cork\, Cork\, Ireland\, Virtual:
  https://events.vtools.ieee.org/m/365494
LOCATION:Room: B.0.17\, Tyndall National Institute\, Lee Maltings Complex D
 yke Parade\, Cork\, Cork\, Ireland\, Virtual: https://events.vtools.ieee.o
 rg/m/365494
ORGANIZER:stefanofacchin@ieee.org
SEQUENCE:19
SUMMARY:Transceiver Roadmap for 2035 and Beyond
URL;VALUE=URI:https://events.vtools.ieee.org/m/365494
X-ALT-DESC:Description: <br /><p>Abctract:</p>\n<p>During the past decades 
 wireless communication has made an enormous growth. Triggered by a large R
 &amp\;D effort\, the integration of transceivers in CMOS technology has ma
 de low cost mass production possible. For many applications like Bluetooth
 \, a single chip CMOS transceiver can now do the job. &nbsp\;On the other 
 hand\, for complex transceivers like in modern smartphones\, still more &n
 bsp\;discrete RF components such as filters\, switches and diplexers are b
 eing added to protect the transceiver from strong interferers which are of
 ten produced by the device itself. To satisfy the future bandwidth hunger\
 , the number of frequency bands will further increase\, modulation schemes
  will become more complex\, more antennas will be used and carrier aggrega
 tion will be the norm. To limit the number of discrete RF components\, lin
 earity of the transceivers is key.</p>\n<p>Since more computing power will
  be needed in future transceivers as well\, newer CMOS technologies are al
 so wanted. CMOS technology will scale in favour of fast-switching digital 
 circuits\, but not for classical analog functions\, like amplifiers.</p>\n
 <p>For the next fifteen years re-thinking of basic circuits and systems wi
 ll be needed to make highly integrated linear transceivers\,&nbsp\; in a t
 echnology that is designed for digital circuits.</p>
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