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PRODID:IEEE vTools.Events//EN
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TZID:America/Mexico_City
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DTSTART:20221030T010000
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BEGIN:VEVENT
DTSTAMP:20230701T170501Z
UID:95C42987-EDDE-4861-BAB7-858537F35644
DTSTART;TZID=America/Mexico_City:20230630T110000
DTEND;TZID=America/Mexico_City:20230630T130000
DESCRIPTION:On the behalf of the Seventh IEEE-EDS Mexico Technical Meeting 
 2023 (MTM_7-2023)\, organized jointly by the IEEE EDS CINVESTAV-IPN Studen
 t Branch Chapter from the Section of Solid-State Electronics at the Center
  for Research and Advanced Studies of the Polytechnic National Institute (
 CINVESTAV-IPN)\, we extend the invitation for the conference with an Peter
  Grüberg Institute 9.\n\nThe MTM_7-2023 will be held SEES bunker room at 
 June 30th\, 2023.\n\nCo-sponsored by: Center for Research and Advanced Stu
 dies of the National Polytechnique Institute\, CINVESTAV-IPN.\n\nSpeaker(s
 ): Prof. Dan \, \n\nAgenda: \nSchedule Tuesday 30th—SEES Bunker room Spe
 aker\n\n11:00 - 11:10 Presentation of Dr. Dan Buca Dr. Arturo Escobosa\n\n
 11:10 - 13:00 New group IV materials and challenges for Dr. Dan Buca\n\nap
 plications convergence in Si -CMOS Technology\n\nBldg: Sección de Electr
 ónica del Estado Solido Aula: bunker\, Av Instituto Politécnico Nacional
  2508\, San Pedro Zacatenco\, Gustavo A. Madero\, 07360 Ciudad de México\
 , CDMX\, Sección de Electrónica del Estado Solido \, Cd. De México\, Me
 xico\, Mexico\, 07360
LOCATION:Bldg: Sección de Electrónica del Estado Solido Aula: bunker\, Av
  Instituto Politécnico Nacional 2508\, San Pedro Zacatenco\, Gustavo A. M
 adero\, 07360 Ciudad de México\, CDMX\, Sección de Electrónica del Esta
 do Solido \, Cd. De México\, Mexico\, Mexico\, 07360
ORGANIZER:abril.garcia.soriano@cinvestav.mx 
SEQUENCE:40
SUMMARY:New group IV materials and challenges for applications convergence 
 in Si -CMOS Technology
URL;VALUE=URI:https://events.vtools.ieee.org/m/365533
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;span style=&quot;font-family: &#39;times new roman
 &#39;\, times\, serif\; font-size: 12pt\;&quot;&gt;On the behalf of the Seventh &lt;stron
 g&gt;IEEE-EDS Mexico Technical Meeting 2023 (MTM_7-2023)&lt;/strong&gt;\, organized
  jointly by the &lt;em&gt;IEEE EDS CINVESTAV-IPN Student Branch Chapter&lt;/em&gt;&amp;nbs
 p\;from the &lt;em&gt;Section of Solid-State Electronics&lt;/em&gt; at the &lt;em&gt;Center 
 for Research and Advanced Studies of the Polytechnic National Institute&lt;/e
 m&gt; (CINVESTAV-IPN)\, we extend the invitation for the conference with an P
 eter Gr&amp;uuml\;berg Institute 9.&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;font-family: &#39;
 times new roman&#39;\, times\, serif\; font-size: 12pt\;&quot;&gt;The MTM_7-2023 will 
 be held SEES bunker room at June 30th\, 2023.&lt;/span&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda
 : &lt;br /&gt;&lt;p&gt;&lt;strong&gt;Schedule&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;
  Tuesday 30th&amp;mdash\;SEES Bunker room&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp
 \; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;
  &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;
 nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nb
 sp\; &amp;nbsp\; &amp;nbsp\;Speaker&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;11:00 - 11:10&amp;nbsp\; &amp;nbsp\; 
 &amp;nbsp\; Presentation of Dr. Dan Buca&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\
 ; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; 
 &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;n
 bsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbs
 p\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; Dr. Arturo Escobosa&lt;/p
 &gt;\n&lt;p&gt;11:10 - 13:00 &amp;nbsp\; &amp;nbsp\;New group IV materials and challenges f
 or&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; 
 &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;n
 bsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbs
 p\; &amp;nbsp\; Dr. Dan Buca&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;
 nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; applications convergence in
 &amp;nbsp\; Si -CMOS Technology&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;
  &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;
 nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nb
 sp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;&lt;/p&gt;
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