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DTSTART:20231105T010000
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DTSTAMP:20230824T213745Z
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DESCRIPTION:[this is a no-charge online-only event]\n\nAs demand for high-p
 erformance semiconductors increases\, heterogeneous integration using a co
 mbination of 3D monolithic and 2.5D/3D advanced packaging technology can b
 oost the system performance significantly. Consequently\, electromigation 
 (EM)-induced failure in micro-bumps and redistribution lines (RDL) has bec
 ome a great concern. In addition\, as electrical current is eventually mer
 ged into substrates\, thermomigration (TM) due to Joule heating\, combined
  with EM\, is one of the potential risks in substrates. In this presentati
 on\, I will present some general guidelines about design rules and acceler
 ated tests for electromigration (EM)-induced failure\, based on fully coup
 led modeling. For years\, the existing EM theories have succeeded only in 
 partially predicting or explaining complicated phenomena in experiments. R
 ecently\, we sorted out many incorrect models and assumptions under the fr
 amework of the coupling theory. In addition\, taking multi-scale effects i
 nto consideration\, we used molecular dynamics simulation to determine the
  key microscopic parameters\, thus establishing a complete and self-consis
 tent multi-physics coupling model of electromigration. We further conducte
 d extensive EM tests and collected consistent test data for the purpose of
  model verification. The theoretical and numerical results fully reproduce
 d the various phenomena in the experiments\, including the impact of therm
 omigration. We then used the validated theory to provide new insights into
  design rules and acceleration factors to prevent EM-induced failure. This
  presentation is based on the content of the following two papers\, which 
 can be downloaded from these two links.\nCui\, Z.\, Fan\, X.\, Zhang\, Y.\
 , Vollebregt\, S.\, Fan\, J.\, Zhang\, G.Q\, 2023. [Coupling Model of Elec
 tromigration and Experimental Verification – Part I: Effect of Atomic Co
 ncentration Gradient](https://doi.org/10.1016/j.jmps.2023.105257). Journal
  of the Mechanics and Physics of Solids. Volume 174\, May 2023\, 105257.\n
 Cui\, Z.\, Fan\, X.\, Zhang\, Y.\, Vollebregt\, S.\, Fan\, J.\, Zhang\, G.
 Q.\, 2023. [Coupling Model of Electromigration and Experimental Verificati
 on – Part II: Impact of Thermomigration](https://doi.org/10.1016/j.jmps.
 2023.105256). Journal of the Mechanics and Physics of Solids. Volume 174\,
  May 2023\, 105256.\n\nSpeaker(s): Xuejun Fan\, \n\nVirtual: https://event
 s.vtools.ieee.org/m/366152
LOCATION:Virtual: https://events.vtools.ieee.org/m/366152
ORGANIZER:anmalik@ieee.org
SEQUENCE:29
SUMMARY:Design Rules And Acceleration For Electromigration-Induced Failure:
  Coupled Modeling And Experimental Verification [no fee]
URL;VALUE=URI:https://events.vtools.ieee.org/m/366152
X-ALT-DESC:Description: <br /><p>[this is a no-charge online-only event]</p
 >\n<p><span style="caret-color: #7a7a7a\; color: #7a7a7a\; font-family: 'O
 pen Sans'\, 'Open Sans'\; font-size: 18px\; font-style: normal\; font-vari
 ant-caps: normal\; font-weight: 400\; letter-spacing: normal\; orphans: au
 to\; text-align: start\; text-indent: 0px\; text-transform: none\; white-s
 pace: normal\; widows: auto\; word-spacing: 0px\; -webkit-text-stroke-widt
 h: 0px\; background-color: #ffffff\; text-decoration: none\; display: inli
 ne !important\; float: none\;">As demand for high-performance semiconducto
 rs increases\, heterogeneous integration using a combination of 3D monolit
 hic and 2.5D/3D advanced packaging technology can boost the system perform
 ance significantly. Consequently\, electromigation (EM)-induced failure in
  micro-bumps and redistribution lines (RDL) has become a great concern. In
  addition\, as electrical current is eventually merged into substrates\, t
 hermomigration (TM) due to Joule heating\, combined with EM\, is one of th
 e potential risks in substrates. In this presentation\, I will present som
 e general guidelines about design rules and accelerated tests for electrom
 igration (EM)-induced failure\, based on fully coupled modeling. For years
 \, the existing EM theories have succeeded only in partially predicting or
  explaining complicated phenomena in experiments. Recently\, we sorted out
  many incorrect models and assumptions under the framework of the coupling
  theory. In addition\, taking multi-scale effects into consideration\, we 
 used molecular dynamics simulation to determine the key microscopic parame
 ters\, thus establishing a complete and self-consistent multi-physics coup
 ling model of electromigration. We further conducted extensive EM tests an
 d collected consistent test data for the purpose of model verification. Th
 e theoretical and numerical results fully reproduced the various phenomena
  in the experiments\, including the impact of thermomigration. We then use
 d the validated theory to provide new insights into design rules and accel
 eration factors to prevent EM-induced failure. This presentation is based 
 on the content of the following two papers\, which can be downloaded from 
 these two links.</span><br style="box-sizing: border-box\; caret-color: #7
 a7a7a\; color: #7a7a7a\; font-family: 'Open Sans'\, 'Open Sans'\; font-siz
 e: 18px\; font-style: normal\; font-variant-caps: normal\; font-weight: 40
 0\; letter-spacing: normal\; orphans: auto\; text-align: start\; text-inde
 nt: 0px\; text-transform: none\; white-space: normal\; widows: auto\; word
 -spacing: 0px\; -webkit-text-stroke-width: 0px\; text-decoration: none\;" 
 /><span style="caret-color: #7a7a7a\; color: #7a7a7a\; font-family: 'Open 
 Sans'\, 'Open Sans'\; font-size: 18px\; font-style: normal\; font-variant-
 caps: normal\; font-weight: 400\; letter-spacing: normal\; orphans: auto\;
  text-align: start\; text-indent: 0px\; text-transform: none\; white-space
 : normal\; widows: auto\; word-spacing: 0px\; -webkit-text-stroke-width: 0
 px\; background-color: #ffffff\; text-decoration: none\; display: inline !
 important\; float: none\;">Cui\, Z.\, Fan\, X.\, Zhang\, Y.\, Vollebregt\,
  S.\, Fan\, J.\, Zhang\, G.Q\, 2023. </span><a style="box-sizing: border-b
 ox\; background: 0px 0px\; color: #00629b\; text-decoration: none\; box-sh
 adow: none\; font-family: 'Open Sans'\, 'Open Sans'\; font-weight: bold\; 
 font-size: 18px\; font-style: normal\; font-variant-caps: normal\; letter-
 spacing: normal\; orphans: auto\; text-align: start\; text-indent: 0px\; t
 ext-transform: none\; white-space: normal\; widows: auto\; word-spacing: 0
 px\; -webkit-text-stroke-width: 0px\;" href="https://doi.org/10.1016/j.jmp
 s.2023.105257">Coupling Model of Electromigration and Experimental Verific
 ation &ndash\; Part I: Effect of Atomic Concentration Gradient</a><span st
 yle="caret-color: #7a7a7a\; color: #7a7a7a\; font-family: 'Open Sans'\, 'O
 pen Sans'\; font-size: 18px\; font-style: normal\; font-variant-caps: norm
 al\; font-weight: 400\; letter-spacing: normal\; orphans: auto\; text-alig
 n: start\; text-indent: 0px\; text-transform: none\; white-space: normal\;
  widows: auto\; word-spacing: 0px\; -webkit-text-stroke-width: 0px\; backg
 round-color: #ffffff\; text-decoration: none\; display: inline !important\
 ; float: none\;">. Journal of the Mechanics and Physics of Solids. Volume 
 174\, May 2023\, 105257.</span><br style="box-sizing: border-box\; caret-c
 olor: #7a7a7a\; color: #7a7a7a\; font-family: 'Open Sans'\, 'Open Sans'\; 
 font-size: 18px\; font-style: normal\; font-variant-caps: normal\; font-we
 ight: 400\; letter-spacing: normal\; orphans: auto\; text-align: start\; t
 ext-indent: 0px\; text-transform: none\; white-space: normal\; widows: aut
 o\; word-spacing: 0px\; -webkit-text-stroke-width: 0px\; text-decoration: 
 none\;" /><span style="caret-color: #7a7a7a\; color: #7a7a7a\; font-family
 : 'Open Sans'\, 'Open Sans'\; font-size: 18px\; font-style: normal\; font-
 variant-caps: normal\; font-weight: 400\; letter-spacing: normal\; orphans
 : auto\; text-align: start\; text-indent: 0px\; text-transform: none\; whi
 te-space: normal\; widows: auto\; word-spacing: 0px\; -webkit-text-stroke-
 width: 0px\; background-color: #ffffff\; text-decoration: none\; display: 
 inline !important\; float: none\;">Cui\, Z.\, Fan\, X.\, Zhang\, Y.\, Voll
 ebregt\, S.\, Fan\, J.\, Zhang\, G.Q.\, 2023. </span><a style="box-sizing:
  border-box\; background: 0px 0px\; color: #00629b\; text-decoration: none
 \; box-shadow: none\; font-family: 'Open Sans'\, 'Open Sans'\; font-weight
 : bold\; font-size: 18px\; font-style: normal\; font-variant-caps: normal\
 ; letter-spacing: normal\; orphans: auto\; text-align: start\; text-indent
 : 0px\; text-transform: none\; white-space: normal\; widows: auto\; word-s
 pacing: 0px\; -webkit-text-stroke-width: 0px\;" href="https://doi.org/10.1
 016/j.jmps.2023.105256">Coupling Model of Electromigration and Experimenta
 l Verification &ndash\; Part II: Impact of Thermomigration</a><span style=
 "caret-color: #7a7a7a\; color: #7a7a7a\; font-family: 'Open Sans'\, 'Open 
 Sans'\; font-size: 18px\; font-style: normal\; font-variant-caps: normal\;
  font-weight: 400\; letter-spacing: normal\; orphans: auto\; text-align: s
 tart\; text-indent: 0px\; text-transform: none\; white-space: normal\; wid
 ows: auto\; word-spacing: 0px\; -webkit-text-stroke-width: 0px\; backgroun
 d-color: #ffffff\; text-decoration: none\; display: inline !important\; fl
 oat: none\;">. Journal of the Mechanics and Physics of Solids. Volume 174\
 , May 2023\, 105256.</span></p>\n<p>&nbsp\;</p>
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