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DTSTAMP:20230903T130107Z
UID:92F48F41-587A-4396-8375-D9A56BFA7470
DTSTART;TZID=America/New_York:20230831T113000
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DESCRIPTION:In advanced packaging\, as newer forms of interconnects emerge 
 to meet the demand for high density and high performance\, interconnect re
 liability is becoming more complex and more critical. Finer pitch intercon
 nects in advanced packaging are more susceptible to failures due to electr
 omigration\, interfacial reactions etc. Wafer level packaging\, Cu direct 
 bonding and other advanced packaging technologies\, present new considerat
 ions in interconnect reliability. At the same time\, the growing adoption 
 of heterogeneous integration leads to increased diversity of interconnects
  (with different geometries\, materials\, and interfaces) in the same pack
 age\, with complex (and often interactive) reliability failure modes and m
 echanisms.\nAs electronic products become more pervasive in application\, 
 interconnect reliability must be considered holistically with regard to en
 vironmental conditions\, from thermal\, mechanical\, and thermomechanical\
 , to electrical and electrochemical. High frequency applications demand co
 nsiderations of interconnect materials for signal integrity. High thermal 
 density and high current density can have increased impact on interconnect
  reliability. These considerations will impact reliability engineering for
  semiconductor devices\, from design for reliability\, to accelerated test
 ing and analysis.\nMeanwhile\, sustainability of electronic products deman
 ds environmentally friendly materials and processes. Understanding of the 
 failure mechanisms for different interconnect materials at various levels 
 (wafer\, chip\, package\, and system) of the semiconductor package is of g
 reat importance to interconnect reliability in advanced packaging and hete
 rogeneous integration.\n\nSpeaker(s): Dongkai Shangguan\, \, \n\nBirck Nan
 otechnology Center #1001\, 1205 W State St\, West Lafayette\, Indiana\, Un
 ited States\, Virtual: https://events.vtools.ieee.org/m/370292
LOCATION:Birck Nanotechnology Center #1001\, 1205 W State St\, West Lafayet
 te\, Indiana\, United States\, Virtual: https://events.vtools.ieee.org/m/3
 70292
ORGANIZER:p.wesling@ieee.org
SEQUENCE:20
SUMMARY:Interconnect Reliability in Advanced Packaging and Heterogeneous In
 tegration (no fee)
URL;VALUE=URI:https://events.vtools.ieee.org/m/370292
X-ALT-DESC:Description: <br /><p>In advanced packaging\, as newer forms of 
 interconnects emerge to meet the demand for high density and high performa
 nce\, interconnect reliability is becoming more complex and more critical.
  Finer pitch interconnects in advanced packaging are more susceptible to f
 ailures due to electromigration\, interfacial reactions etc. Wafer level p
 ackaging\, Cu direct bonding and other advanced packaging technologies\, p
 resent new considerations in interconnect reliability. At the same time\, 
 the growing adoption of heterogeneous integration leads to increased diver
 sity of interconnects (with different geometries\, materials\, and interfa
 ces) in the same package\, with complex (and often interactive) reliabilit
 y failure modes and mechanisms.<br />As electronic products become more pe
 rvasive in application\, interconnect reliability must be considered holis
 tically with regard to environmental conditions\, from thermal\, mechanica
 l\, and thermomechanical\, to electrical and electrochemical. High frequen
 cy applications demand considerations of interconnect materials for signal
  integrity. High thermal density and high current density can have increas
 ed impact on interconnect reliability. These considerations will impact re
 liability engineering for semiconductor devices\, from design for reliabil
 ity\, to accelerated testing and analysis.<br />Meanwhile\, sustainability
  of electronic products demands environmentally friendly materials and pro
 cesses. Understanding of the failure mechanisms for different interconnect
  materials at various levels (wafer\, chip\, package\, and system) of the 
 semiconductor package is of great importance to interconnect reliability i
 n advanced packaging and heterogeneous integration.</p>
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