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DTSTAMP:20231019T215250Z
UID:EC1A4720-7A90-4345-B598-52E03E898E40
DTSTART;TZID=America/Los_Angeles:20231019T120000
DTEND;TZID=America/Los_Angeles:20231019T130000
DESCRIPTION:Photonic integrated circuit technology (silicon photonics) is u
 sed for many applications including optical data communications\, optical 
 and quantum computing\, and sensing including LiDAR\, biomedical and envir
 onmental. A major packaging challenge facing the industry is optical coupl
 ing between multiple integrated photonic components together with low inse
 rtion loss\, in a cost effective manner\, into a package suitable for comm
 ercialization. A promising approach is to create “photonic wire bonds”
  (PWBs)\, namely optical waveguides that look similar to conventional elec
 trical wire bonds. PWBs are a high-yield\, low-insertion-loss\, and high-t
 hroughput versatile method of packaging photonic components such as chip-t
 o-fiber and laser-to-chip interconnects. Utilizing two-photon polymerizati
 on to fabricate freeform 3D polymer structures\, PWBs can connect componen
 ts with arbitrarily disparate mode field shapes and sizes. Capabilities an
 d advantages of the PWB technique include: gain chip integration with exis
 ting ’known good die’\, dense optical I/O connections to the chip\, sc
 alability from prototyping to high-volume\, and interconnects that are not
  possible with other standard photonic packaging techniques.\n\nSpeaker(s)
 : Lukas Chrostowski\, \n\nVirtual: https://events.vtools.ieee.org/m/372682
LOCATION:Virtual: https://events.vtools.ieee.org/m/372682
ORGANIZER:p.wesling@ieee.org
SEQUENCE:17
SUMMARY:Photonic Wire Bond Packaging for Silicon Photonic Optical Fibres an
 d Laser Integration [remote/no fee]
URL;VALUE=URI:https://events.vtools.ieee.org/m/372682
X-ALT-DESC:Description: <br /><p>Photonic integrated circuit technology (si
 licon photonics) is used for many applications including optical data comm
 unications\, optical and quantum computing\, and sensing including LiDAR\,
  biomedical and environmental. A major packaging challenge facing the indu
 stry is optical coupling between multiple integrated photonic components t
 ogether with low insertion loss\, in a cost effective manner\, into a pack
 age suitable for commercialization. A promising approach is to create &ldq
 uo\;photonic wire bonds&rdquo\; (PWBs)\, namely optical waveguides that lo
 ok similar to conventional electrical wire bonds. PWBs are a high-yield\, 
 low-insertion-loss\, and high-throughput versatile method of packaging pho
 tonic components such as chip-to-fiber and laser-to-chip interconnects. Ut
 ilizing two-photon polymerization to fabricate freeform 3D polymer structu
 res\, PWBs can connect components with arbitrarily disparate mode field sh
 apes and sizes. Capabilities and advantages of the PWB technique include: 
 gain chip integration with existing &rsquo\;known good die&rsquo\;\, dense
  optical I/O connections to the chip\, scalability from prototyping to hig
 h-volume\, and interconnects that are not possible with other standard pho
 tonic packaging techniques.</p>
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