BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20230312T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20231105T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20231003T163528Z UID:D3DBBD60-ADA1-47BA-8530-2CFC196C63EC DTSTART;TZID=America/New_York:20230924T130000 DTEND;TZID=America/New_York:20230924T160000 DESCRIPTION:Emerging AI and deep-learning demands computing power that exce eds 10 kW to processors of cm2 footprint. At the IC level\, interconnect d ensities will scale down to sub-micron pitch where the off-chip interconne ct densities exceed Million I/Os per mm2. To cope up with the power\, ther mal solutions should reach resistances of <0.3 mm2 W/K. Advances in packag e integration are the key enablers for next-generation power delivery with higher power densities that exceed 5 A/mm2\, efficiency and reliability. On the other hand\, power electronics in the automotive world is diversify ing to address various subsystem needs such as main and auxiliary inverter s\, DC-DC converters\, on-board chargers and others\, creating new challen ges for meeting the density and reliability needs.\n\nThis tutorial will f ocus on such key packaging building blocks: a)design for performance\, man ufacturing and reliability that relies on heterogeneous functional integra tion of wide bandgap devices\, drivers\, isolators and protection circuits to result in intelligent power modules\, b) stacked or embedded packaging through direct plated interconnects onto die interfaces\, c) thermal mana gement through double-sided cooling with integrated fluidics\, d)high-dens ity passive components such as capacitors\, transformers\, inductors for i ntegration in planar and 3D architectures. Specific emphasis will be on re cent innovations and their origins in fundamental engineering sciences.\n\ nSpeaker(s): Douglas C Hopkins \, P. M. Raj\n\nAgenda: \nTutorial Outline: \n\n- Power packaging drivers in computing and automotive\;\n- Topology ad vances\;\n- System and packaging architectures\;\n- Components and integra tion advances\;\n- Multiphysics modeling to reliability qualification\;\n- Key recent breakthroughs\;\n\nGraham Center-Ball Room\, FIU located at 11 200 SW 8th St.\, Miami\, Florida 33174\, Miami\, Florida\, United States\ , 33174 LOCATION:Graham Center-Ball Room\, FIU located at 11200 SW 8th St.\, Miami \, Florida 33174\, Miami\, Florida\, United States\, 33174 ORGANIZER:Mohammed@fiu.edu SEQUENCE:17 SUMMARY:Power system packaging through heterogeneous integration and advanc ed components URL;VALUE=URI:https://events.vtools.ieee.org/m/374373 X-ALT-DESC:Description: <br /><p>Emerging AI and deep-learning demands comp uting power that exceeds 10 kW to processors of cm2&nbsp\;footprint. At th e IC level\, interconnect densities will scale down to&nbsp\; sub-micron p itch where the off-chip interconnect densities exceed Million I/Os per mm2 . To cope up with the power\, thermal solutions should reach resistances o f &lt\;0.3 mm2&nbsp\;W/K.&nbsp\; Advances in package integration are the k ey enablers for&nbsp\; next-generation power delivery with higher power de nsities that exceed 5 A/mm2\, efficiency and reliability. On the other han d\, power electronics in the automotive world is diversifying to address v arious subsystem needs such as main and auxiliary inverters\, DC-DC conver ters\, on-board chargers and others\, creating new challenges for meeting the density and reliability needs.</p>\n<p>This tutorial will focus on suc h&nbsp\; key packaging&nbsp\; building blocks:&nbsp\; a)design for perform ance\, manufacturing and reliability that relies on heterogeneous function al integration of wide bandgap devices\, drivers\, isolators and protectio n circuits to result in intelligent power modules\, b) stacked or embedded packaging through direct plated interconnects onto die interfaces\, c) th ermal management through double-sided cooling with integrated fluidics\, d )high-density passive components such as capacitors\, transformers\, induc tors&nbsp\; for integration in planar and 3D architectures. Specific empha sis will be on recent innovations and their origins in fundamental enginee ring sciences.</p><br /><br />Agenda: <br /><p>Tutorial Outline:</p>\n<ul> \n<li><strong>Power packaging drivers in computing and automotive\;</stron g></li>\n<li><strong>Topology advances\;</strong></li>\n<li><strong>System and packaging architectures\;</strong></li>\n<li><strong>Components and i ntegration advances\;</strong></li>\n<li><strong>Multiphysics modeling to reliability qualification\;</strong></li>\n<li><strong>Key recent breakthr oughs\;</strong></li>\n</ul> END:VEVENT END:VCALENDAR