BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT DTSTART:20230312T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20231105T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20231107T193359Z UID:14824D0A-9B94-42A6-B975-18278AB638AC DTSTART;TZID=America/Los_Angeles:20231102T080000 DTEND;TZID=America/Los_Angeles:20231102T093000 DESCRIPTION:Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extract ion from hot spots\, heat transfer through multiple layers of materials\, different target temperatures for specific devices/materials\, to heat rej ection to a system cooling solution or the ambient. This applies to system -in-packages\, including 2D\, 2.5D\, and 3D subsystems and the special nee ds of photonic devices. We need to consider the various thermal paths with in packages to dissipate the generated heat\, how to apply modeling and si mulation\, and advanced cooling methods including conduction\, liquid cool ing\, heat pipes\, and more exotic designs.\nIt is important to identify a nd develop a detailed understanding of the capabilities and limitations of key thermal technologies that meet or exceed these demands so that they a re available well in advance of need and can be implemented if they meet i ntegration cost envelopes. We will consider three areas for thermal manage ment: Die level\; Package integration/System-in-Package (SIP)/module level \; and System level. We will focus on emerging challenges and opportunitie s for thermal modeling of advanced 3D IC systems\; challenges and characte rization of hotspot modeling\; thermal modeling for High Bandwidth Memory (HBM) and integrated voltage regulators\; and innovative methods for manuf acturing silicon microchannels.\n\nThen\, we will consider an advanced des ign example. Sustainable and efficient operation of US data centers\, curr ently consuming ~100 billion kWh/year\, requires transformative and innova tive technologies. Nearly 20% of the total power is used to run the data c enter refrigeration cooling infrastructure\, which is extremely sensitive to climate and environmental conditions. The ever-increasing prevalence of higher-power processors aggravates cooling/energy challenges. It is expec ted that reducing the thermal resistance of the device junction to coolant by 10×\, will pave the way for elimination of refrigeration cooling syst ems\, resulting in considerable energy saving in the data centers.\nIn the case of two-phase flow\, flow instability and large superheat are major c oncerns that must be addressed: pressure drop\, hotspot cooling\, larger c hip areas\, and liquid films on heat walls. The enhanced cooling <strong>I ceCool Fundamentals</strong> initiative by DARPA\, and several ARPA-e rece nt initiatives\, resulted in development of a series of remarkable thermal management solutions for very challenging performance metrics targets.\n\ nSpeaker(s): Tiwei Wei\, Mehdi Asheghi\, \n\nVirtual: https://events.vtool s.ieee.org/m/375984 LOCATION:Virtual: https://events.vtools.ieee.org/m/375984 ORGANIZER:p.wesling@ieee.org SEQUENCE:17 SUMMARY:Tutorial: Thermal Challenges for Heterogeneous Integration Packagin g URL;VALUE=URI:https://events.vtools.ieee.org/m/375984 X-ALT-DESC:Description: <br /><p>Heterogeneous Integration poses several si gnificant challenges for thermal management at multiple length scales rang ing from heat extraction from hot spots\, heat transfer through multiple l ayers of materials\, different target temperatures for specific devices/ma terials\, to heat rejection to a system cooling solution or the ambient. T his applies to system-in-packages\, including 2D\, 2.5D\, and 3D subsystem s and the special needs of photonic devices. We need to consider the vario us thermal paths within packages to dissipate the generated heat\, how to apply modeling and simulation\, and advanced cooling methods including con duction\, liquid cooling\, heat pipes\, and more exotic designs.<br />It i s important to identify and develop a detailed understanding of the capabi lities and limitations of key thermal technologies that meet or exceed the se demands so that they are available well in advance of need and can be i mplemented if they meet integration cost envelopes. We will consider three areas for thermal management: Die level\; Package integration/System-in-P ackage (SIP)/module level\; and System level. We will focus on emerging ch allenges and opportunities for thermal modeling of advanced 3D IC systems\ ; challenges and characterization of hotspot modeling\; thermal modeling f or High Bandwidth Memory (HBM) and integrated voltage regulators\; and inn ovative methods for manufacturing silicon microchannels.</p>\n<p>Then\, we will consider an advanced design example. &nbsp\;Sustainable and efficien t operation of US data centers\, currently consuming ~100 billion kWh/year \, requires transformative and innovative technologies. Nearly 20% of the total power is used to run the data center refrigeration cooling infrastru cture\, which is extremely sensitive to climate and environmental conditio ns. The ever-increasing prevalence of higher-power processors aggravates c ooling/energy challenges. &nbsp\;It is expected that reducing the thermal resistance of the device junction to coolant by 10&times\;\, will pave the way for elimination of refrigeration cooling systems\, resulting in consi derable energy saving in the data centers. &nbsp\;<br />In the case of two -phase flow\, flow instability and large superheat are major concerns that must be addressed: pressure drop\, hotspot cooling\, larger chip areas\, and liquid films on heat walls. &nbsp\;The enhanced cooling &lt\;strong&gt \;IceCool Fundamentals&lt\;/strong&gt\; initiative by DARPA\, and several ARPA-e recent initiatives\, resulted in development of a series of remarka ble thermal management solutions for very challenging performance metrics targets.</p> END:VEVENT END:VCALENDAR