BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD DTSTART:19451014T230000 TZOFFSETFROM:+0630 TZOFFSETTO:+0530 TZNAME:IST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20231027T091325Z UID:E0B304C8-BE3C-440D-B069-89AE70479D93 DTSTART;TZID=Asia/Kolkata:20231017T110000 DTEND;TZID=Asia/Kolkata:20231017T123000 DESCRIPTION:Modern integrated circuit technology has enabled a lot of appli cations in the RF\, mm-wave\, and sub-\nTHz frequency range at a low cost and in a small form factor in emerging areas such as wireless\n\ncommunica tion and radar-based sensing. In this presentation\, key challenges in RF\ , mm-wave\, and\n\nsub-THz circuit design for next-generation high data ra te wireless communication systems and high-\nresolution radars will be dis cussed. To address the demand for high performance in these systems\, it\n \nis becoming increasingly important to take a multidisciplinary approach such as digitally assisted RF\ncircuits and heterogeneous co-integration o f III-V and CMOS technologies. The power amplifier (PA)\nis one of the mos t critical blocks in the transceiver and innovative PA architectures\, whi ch utilize such\nmultidisciplinary techniques to improve output power\, ef ficiency\, gain\, and linearity\, will be discussed\nin this presentation. Novel topologies of digitally enhanced outphasing and pulse width modulat ed\n(PWM) PAs in 45nm CMOS at 2.4GHz will be presented. An innovative 74GH z stacked segmented\nadaptive PA architecture in 22nm FD-SOI technology wi ll be shown next. Then an InP based 130GHz\nPA will be presented that can take advantage of III-V and CMOS co-integration for 6G wireless\ncommunica tion. Finally\, future directions and research opportunities will be discu ssed.\n\nCo-sponsored by: IEEE AP-MTTS SBC IIT Kharagpur\n\nSpeaker(s): Ar itra Banerjee\, \n\nRoom: NKN Room\, Bldg: E&ECE Department\, Kharagpur\, West Bengal\, India\, IIT Kharagpur\, Kharagpur\, West Bengal\, India\, 72 1302 LOCATION:Room: NKN Room\, Bldg: E&ECE Department\, Kharagpur\, West Bengal\ , India\, IIT Kharagpur\, Kharagpur\, West Bengal\, India\, 721302 ORGANIZER:ieee.apmtts.sbciitkgp@gmail.com SEQUENCE:64 SUMMARY:High Performance RF\, Millimeter-Wave\, and Sub-THz Integrated Circ uits and Systems URL;VALUE=URI:https://events.vtools.ieee.org/m/377531 X-ALT-DESC:Description: <br /><p>Modern integrated circuit technology has e nabled a lot of applications in the RF\, mm-wave\, and sub-<br />THz frequ ency range at a low cost and in a small form factor in emerging areas such as wireless</p>\n<p>communication and radar-based sensing. In this presen tation\, key challenges in RF\, mm-wave\, and</p>\n<p>sub-THz circuit desi gn for next-generation high data rate wireless communication systems and h igh-<br />resolution radars will be discussed. To address the demand for h igh performance in these systems\, it</p>\n<p>is becoming increasingly imp ortant to take a multidisciplinary approach such as digitally assisted RF< br />circuits and heterogeneous co-integration of III-V and CMOS technolog ies. The power amplifier (PA)<br />is one of the most critical blocks in t he transceiver and innovative PA architectures\, which utilize such<br />m ultidisciplinary techniques to improve output power\, efficiency\, gain\, and linearity\, will be discussed<br />in this presentation. Novel topolog ies of digitally enhanced outphasing and pulse width modulated<br />(PWM) PAs in 45nm CMOS at 2.4GHz will be presented. An innovative 74GHz stacked segmented<br />adaptive PA architecture in 22nm FD-SOI technology will be shown next. Then an InP based 130GHz<br />PA will be presented that can ta ke advantage of III-V and CMOS co-integration for 6G wireless<br />communi cation. Finally\, future directions and research opportunities will be dis cussed.</p> END:VEVENT END:VCALENDAR