BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT DTSTART:20240310T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20231105T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20231108T173555Z UID:513BA1DD-F2D9-40C2-840F-55A74903D4EA DTSTART;TZID=America/Los_Angeles:20231107T174500 DTEND;TZID=America/Los_Angeles:20231107T190000 DESCRIPTION:A Technical Talk will be given on the Title "A novel cryogenic acoustic microscope to evaluate electronic components" by Prof. Leonard Bo nd.\n\nAbstract:\n\nCold electronics is a key technology in many areas of science and technology including space exploration programs and particle p hysics. A major particle physics experiment with a very large number of an alog and digital electronics signal processing channels to be operated at cryogenic temperatures is the next-generation neutrino experiment\, the De ep Underground Neutrino Experiment (DUNE). DUNE will uses liquid Argon at ~ 87 K as a target material for neutrinos and as a medium to track charged particles resulting from interactions in the detector volume. The DUNE el ectronics will consist of about 24\,000 custom-designed ASIC (Application Specific Integrated Circuits) chips based on low-power 180 nm-CMOS technol ogy. A major risk for this technology is failures in the electronics compo nents which will be immersed in liquid argon for 20-30 years\, without opp ortunity for access or replacement. One challenge is that the ASICs which are being developed can be tested (electrically) at room temperature\, and yet still fail when cooled to cryogenic temperatures. There is therefore a need to provide a capability that can assess chips at cryogenic temperat ures\, including the ability to identify anomalies with the potential to d evelop to cause defects and subsequent failure\, due to thermal cycling to cryogenic temperatures. Various inspection technologies\, including both x-ray and ultrasound\, are being considered to ensure chip QA/QC.\n\nOne a ctivity to improve chip reliability is the design\, use\, and data analysi s for a novel low-cost cryogenic acoustic microscope (CryoSAM) which has b een developed and used to evaluate reliability issues of ASICs that may ar ise from thermal stress\, packaging\, and manufacturing-related defects. C ryogenic acoustic microscopy in itself is not new: a GHz frequency unit wa s reported by a Stanford University group in the 1980s. The current CryoSA M is intended to be an engineering capability that can operate to frequenc ies of about 50 MHz. The talk introduce DUNE and will then report on the d esign and testing of the CryoSAM\, the differences in response seen due to using a liquid gas as the complaint\, including differences in resolution and sensitivity between water and the liquid gas\, the challenges faced i n the development and use of the instrument\, including thermal issues and management of bubbles. It will also present a sophisticated correlation a nalysis technique\, applied to the acoustic microscope images and digitize d 4-D (xyz and time) data records\, that is capable of finding even subtle changes that occur inside the ASICs\, including during those which develo p during multiple thermo-cycles. The cryogenic acoustic microscopy and thi s powerful data analysis technique is demonstrating that it will allow scr eening of DUNE ASIC and potentially significantly reduce the risk of senso r failure during DUNE operation.\n\nSpeaker(s): Leonard Bond\n\nAgenda: \n Pizza 5:45 PM and Presentation 6:00 PM\n---------------------------------- -----------------------------\n\nPlease join us for free pizza and an exci ting seminar.\n\nNo IEEE membership is required.\n\nPlease register for lo gistic purposes.\n\nRoom: 103\, Bldg: BSEL\, WSU Tri-Cities\, Richland \, Washington\, United States\, 99354 LOCATION:Room: 103\, Bldg: BSEL\, WSU Tri-Cities\, Richland \, Washington\, United States\, 99354 ORGANIZER:muthu.elen@pnnl.gov SEQUENCE:45 SUMMARY:IEEE Sensor's Talk by Prof. Leonard J. Bond URL;VALUE=URI:https://events.vtools.ieee.org/m/381096 X-ALT-DESC:Description: <br /><p>A Technical Talk will be given on the Titl e "<strong>A novel cryogenic acoustic microscope to evaluate electronic co mponents"&nbsp\;</strong>by Prof. Leonard Bond.&nbsp\;</p>\n<p style="text -align: justify\;">Abstract:&nbsp\;</p>\n<p>Cold electronics is a key tech nology in many areas of science and technology including space exploration programs and particle physics. A major particle physics experiment with a very large number of analog and digital electronics signal processing cha nnels to be operated at cryogenic temperatures is the next-generation neut rino experiment\, the Deep Underground Neutrino Experiment (DUNE). DUNE wi ll uses liquid Argon at ~ 87 K as a target material for neutrinos and as a medium to track charged particles resulting from interactions in the dete ctor volume. The DUNE electronics will consist of about 24\,000 custom-des igned ASIC (Application Specific Integrated Circuits) chips based on low-p ower 180 nm-CMOS technology. A major risk for this technology is failures in the electronics components which will be immersed in liquid argon for 2 0-30 years\, without opportunity for access or replacement. One challenge is that the ASICs which are being developed can be tested (electrically) a t room temperature\, and yet still fail when cooled to cryogenic temperatu res. There is therefore a need to provide a capability that can assess chi ps at cryogenic temperatures\, including the ability to identify anomalies with the potential to develop to cause defects and subsequent failure\, d ue to thermal cycling to cryogenic temperatures. Various inspection techno logies\, including both x-ray and ultrasound\, are being considered to ens ure chip QA/QC.</p>\n<p>One activity to improve chip reliability is the de sign\, use\, and data analysis for a novel low-cost cryogenic acoustic mic roscope (CryoSAM) which has been developed and used to evaluate reliabilit y issues of ASICs that may arise from thermal stress\, packaging\, and man ufacturing-related defects. Cryogenic acoustic microscopy in itself is not new: a GHz frequency unit was reported by a Stanford University group in the 1980s. The current CryoSAM is intended to be an engineering capability that can operate to frequencies of about 50 MHz. The talk introduce DUNE and will then report on the design and testing of the CryoSAM\, the differ ences in response seen due to using a liquid gas as the complaint\, includ ing differences in resolution and sensitivity between water and the liquid gas\, the challenges faced in the development and use of the instrument\, including thermal issues and management of bubbles. It will also present a sophisticated correlation analysis technique\, applied to the acoustic m icroscope images and digitized 4-D (xyz and time) data records\, that is c apable of finding even subtle changes that occur inside the ASICs\, includ ing during those which develop during multiple thermo-cycles. The cryogeni c acoustic microscopy and this powerful data analysis technique is demonst rating that it will allow screening of DUNE ASIC and potentially significa ntly reduce the risk of sensor failure during DUNE operation.</p><br /><br />Agenda: <br /><p><strong>Pizza 5:45 PM and Presentation 6:00 PM</strong ></p>\n<hr class="hr-solid" />\n<p><strong><em>Please join us for free piz za and an exciting seminar.</em></strong></p>\n<p><strong><em>No IEEE memb ership is required.&nbsp\;</em></strong></p>\n<p><strong><em>Please regist er for logistic purposes.</em></strong></p> END:VEVENT END:VCALENDAR