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DTSTART:20240310T030000
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DTSTART;TZID=America/Los_Angeles:20240201T120000
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DESCRIPTION:[this is a no-charge online event]\n\nThis talk will cover majo
 r developments within additive manufacturing as applied towards electronic
 s packaging needs generally and especially for heterogeneous integration a
 pplications\, as well as overview the benefits and growth needs for these 
 manufacturing approaches to have impact within our future electronic devic
 es.\n\nSpeaker(s): Kris\, \n\nVirtual: https://events.vtools.ieee.org/m/38
 7328
LOCATION:Virtual: https://events.vtools.ieee.org/m/387328
ORGANIZER:anmalik@ieee.org
SEQUENCE:29
SUMMARY:Additive Manufacturing: Packaging Applications and Growth Needs for
  Heterogeneous Integration Impact [remote/no fee]
URL;VALUE=URI:https://events.vtools.ieee.org/m/387328
X-ALT-DESC:Description: <br /><p>[this is a no-charge online event]</p>\n<p
 ><span style="caret-color: #7a7a7a\; color: #7a7a7a\; font-family: 'Open S
 ans'\, 'Open Sans'\; font-size: 18px\; font-style: normal\; font-variant-c
 aps: normal\; font-weight: 400\; letter-spacing: normal\; orphans: auto\; 
 text-align: start\; text-indent: 0px\; text-transform: none\; white-space:
  normal\; widows: auto\; word-spacing: 0px\; -webkit-text-stroke-width: 0p
 x\; background-color: #ffffff\; text-decoration: none\; display: inline !i
 mportant\; float: none\;">This talk will cover major developments within a
 dditive manufacturing as applied towards electronics packaging needs gener
 ally and especially for heterogeneous integration applications\, as well a
 s overview the benefits and growth needs for these manufacturing approache
 s to have impact within our future electronic devices.</span></p>\n<p>&nbs
 p\;</p>
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