BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/New_York
BEGIN:DAYLIGHT
DTSTART:20240310T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:EDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20231105T010000
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:EST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20231215T214116Z
UID:C8331642-07ED-4815-929D-C2F1F0BE9D07
DTSTART;TZID=America/New_York:20231215T130000
DTEND;TZID=America/New_York:20231215T140000
DESCRIPTION:“Interconnect Gap” has been a long-standing grand challenge
  caused by the gap between the ever-increasing data rate demand and the in
 sufficient capabilities. The capacity challenge is further deteriorated wi
 th simultaneous challenges of energy efficiency and cost. Existing electri
 cal interconnect (EI) and optical interconnect (OI) face fundamental diffi
 culties to completely address the interconnect issues individually. THz In
 terconnect (TI)\, utilizing the frequency spectrum sandwiched between micr
 owave and optical frequencies\, holds the high potentials to complement EI
  and OI by leveraging the advantages of both electronics and optics. In th
 is talk\, I will present our research activities in the high potential TI 
 field\, including THz silicon waveguide channel development\, TI system de
 monstration\, dispersion constrained link bandwidth and mitigation schemes
  such as mode division and frequency division multiplexing based channeliz
 ation.\n\nSpeaker(s): Dr Qun Jane Gu\n\nVirtual: https://events.vtools.iee
 e.org/m/387729
LOCATION:Virtual: https://events.vtools.ieee.org/m/387729
ORGANIZER:bshubha@ieee.org
SEQUENCE:12
SUMMARY:THz Interconnect\, Complement to Electrical and Optical Interconnec
 ts
URL;VALUE=URI:https://events.vtools.ieee.org/m/387729
X-ALT-DESC:Description: <br /><p>&ldquo\;Interconnect Gap&rdquo\; has been 
 a long-standing grand challenge caused by the gap between the ever-increas
 ing data rate demand and the insufficient capabilities. The capacity chall
 enge is further deteriorated with simultaneous challenges of energy effici
 ency and cost. Existing electrical interconnect (EI) and optical interconn
 ect (OI) face fundamental difficulties to completely address the interconn
 ect issues individually. THz Interconnect (TI)\, utilizing the frequency s
 pectrum sandwiched between microwave and optical frequencies\, holds the h
 igh potentials to complement EI and OI by leveraging the advantages of bot
 h electronics and optics. In this talk\, I will present our research activ
 ities in the high potential TI field\, including THz silicon waveguide cha
 nnel development\, TI system demonstration\, dispersion constrained link b
 andwidth and mitigation schemes such as mode division and frequency divisi
 on multiplexing based channelization.</p>
END:VEVENT
END:VCALENDAR