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DTSTART:20240310T030000
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DTSTART:20241103T010000
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DTSTAMP:20240314T175549Z
UID:6EA9E20A-7997-4098-9114-19935371B00A
DTSTART;TZID=America/Los_Angeles:20240314T075000
DTEND;TZID=America/Los_Angeles:20240314T090000
DESCRIPTION:[this is a no-charge online event]\n\nJoana Mendes  will presen
 t a detailed background on current status of diamond film development. Art
 ificial diamond films are deposited from a mixture of methane and hydrogen
  — and the deposition of the material is not an expensive process. Howev
 er\, the integration of diamond films and electronic devices requires the 
 development and optimization of new processing lines\, which is a costly p
 rocedure. LEDs\, for instance\, have become low-cost components. Are manuf
 acturers willing to trade the current low cost for higher efficiency/perfo
 rmance and longer lifetime? Specific upcoming possibilities are for HEMT p
 ackaging\, 5G/6G RF modules in cell phones\, and in heterogeneous integrat
 ion such as for high-power SiP modules.\nThe second talk: Diamond Foundry\
 , Inc. produces CVD single-crystal diamond (SCD) at scale\, and recently a
 chieved the historic milestone of the creation of the world’s first 100m
 m SCD wafer. SCD as heat spreader achieves performance enhancements of 3-6
 x and temperature reductions of 65C due to its unmatched high isotropic th
 ermal conductivity (2\,200W/m-K). Jeroen van Duren will describe the manuf
 acturing of SCD dies and wafers and use for AI and power electronics packa
 ging\n\nSpeaker(s): Joana Catarina\, Jeroen\n\nVirtual: https://events.vto
 ols.ieee.org/m/388160
LOCATION:Virtual: https://events.vtools.ieee.org/m/388160
ORGANIZER:anmalik@ieee.org
SEQUENCE:20
SUMMARY:Using Diamond in Advanced Packaging: Current Developments and Statu
 s [remote/no fee]
URL;VALUE=URI:https://events.vtools.ieee.org/m/388160
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;[this is a no-charge online event]&lt;/p&gt;\n&lt;p
 &gt;&lt;span style=&quot;caret-color: #7a7a7a\; color: #7a7a7a\; font-family: &#39;Open S
 ans&#39;\, &#39;Open Sans&#39;\; font-size: 18px\; font-style: normal\; font-variant-c
 aps: normal\; font-weight: 400\; letter-spacing: normal\; orphans: auto\; 
 text-align: start\; text-indent: 0px\; text-transform: none\; white-space:
  normal\; widows: auto\; word-spacing: 0px\; -webkit-text-stroke-width: 0p
 x\; background-color: #ffffff\; text-decoration: none\; display: inline !i
 mportant\; float: none\;&quot;&gt;&lt;strong&gt;Joana Mendes &lt;/strong&gt; will present a de
 tailed background on current status of diamond film development. Artificia
 l diamond films are deposited from a mixture of methane and hydrogen &amp;mdas
 h\; and the deposition of the material is not an expensive process. Howeve
 r\, the integration of diamond films and electronic devices requires the d
 evelopment and optimization of new processing lines\, which is a costly pr
 ocedure. LEDs\, for instance\, have become low-cost components. Are manufa
 cturers willing to trade the current low cost for higher efficiency/perfor
 mance and longer lifetime? Specific upcoming possibilities are for HEMT pa
 ckaging\, 5G/6G RF modules in cell phones\, and in heterogeneous integrati
 on such as for high-power SiP modules.&lt;br&gt;The second talk: Diamond Foundry
 \, Inc. produces CVD single-crystal diamond (SCD) at scale\, and recently 
 achieved the historic milestone of the creation of the world&amp;rsquo\;s firs
 t 100mm SCD wafer. SCD as heat spreader achieves performance enhancements 
 of 3-6x and temperature reductions of 65C due to its unmatched high isotro
 pic thermal conductivity (2\,200W/m-K). &lt;strong&gt;Jeroen van Duren&lt;/strong&gt; 
 will describe the manufacturing of SCD dies and wafers and use for AI and 
 power electronics packaging&amp;nbsp\;&lt;br&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;
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