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DTSTAMP:20240306T161653Z
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DTSTART;TZID=America/New_York:20240110T110000
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DESCRIPTION:Foundations for advancing wireless networks rely on the explora
 tion of high-frequency bands ranging from 30 GHz to 300 GHz. FutureG and T
 Hz communication technologies enable access to these bands with improved s
 pectral efficiency and bandwidth. However\, these trends also present sign
 ificant challenges for future electronic systems. These are associated wit
 h design for higher gain and bandwidth to address higher pathlosses\, inte
 rconnect losses between the transceiver and the antenna array\, higher pow
 er consumption because of hardware complexity\, thermal management for hig
 her power dissipation\, limited manufacturability because of the new set o
 f required materials\, high functional density in multilayered substrates\
 , and high production costs. Nanopackaging enables key solutions to many o
 f these challenges by bringing advanced packaging and device materials\, i
 nterfaces and package architectures to manage the complex system requireme
 nts for THz communications. These include nanoscale reconfigurable systems
  with tunable components\, THz arrays and detectors\, metasurfaces and sea
 mless heterogeneous integration with low-loss conductors\, shielding struc
 tures\, thermal interfaces and heat-spreaders. This webinar reviews the ke
 y nanopackaging advances that are making FutureG and THz systems a reality
 .\n\nSpeakers: Prof. Premjeet Chahal (MSU) and Prof. Nezih Pala (FIU)\n\nM
 oderator: Dr. Atom Watanabe (IBM)\n\nSpeaker(s): Dr. Prem Chahal  \, Dr. N
 ezih Pala\n\nVirtual: https://events.vtools.ieee.org/m/392907
LOCATION:Virtual: https://events.vtools.ieee.org/m/392907
ORGANIZER:vdone001@fiu.edu
SEQUENCE:56
SUMMARY:Nanopackaging for AI\, power delivery and THz solutions
URL;VALUE=URI:https://events.vtools.ieee.org/m/392907
X-ALT-DESC:Description: <br /><div dir="ltr">\n<div>\n<div>\n<div>\n<p>Foun
 dations for advancing wireless networks rely on the exploration of high-fr
 equency bands ranging from 30 GHz to 300 GHz. FutureG and THz communicatio
 n technologies enable access to these bands with improved spectral efficie
 ncy and bandwidth. However\, these trends also present significant challen
 ges for future electronic systems. These are associated with design for hi
 gher gain and bandwidth to address higher pathlosses\, interconnect losses
  between the transceiver and the antenna array\, higher power consumption 
 because of hardware complexity\, thermal management for higher power dissi
 pation\, limited manufacturability because of the new set of required mate
 rials\, high functional density in multilayered substrates\, and high prod
 uction costs. Nanopackaging enables key solutions to many of these challen
 ges by bringing advanced packaging and device materials\, interfaces and p
 ackage architectures to manage the complex system requirements for THz com
 munications. These include nanoscale reconfigurable systems with tunable c
 omponents\, THz arrays and detectors\, metasurfaces and seamless heterogen
 eous integration with low-loss conductors\, shielding structures\, thermal
  interfaces and heat-spreaders. This webinar reviews the key nanopackaging
  advances that are making FutureG and THz systems a reality.</p>\n<p><br a
 ria-hidden="true" />Speakers:&nbsp\;&nbsp\;Prof.&nbsp\;Premjeet Chahal (MS
 U) and Prof.&nbsp\;Nezih Pala&nbsp\;(FIU)</p>\n<p>Moderator: Dr. Atom Wata
 nabe (IBM)</p>\n</div>\n</div>\n</div>\n</div>
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