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DESCRIPTION:Future Vision for Heterogeneous Integration from Global Perspec
 tives\, 2 days\, 8 keynote talks\, working groups ...\n\n[see details in A
 GENDA box below]\n\nWhen you get to the Visitor Parking area\, staff will 
 guide you to available section\, and to the South Tower to check in and ge
 t ypour badge.\n\nSpeaker(s): \, \, \, \n\nAgenda: \nWednesday February 21
 \, 2024\n\n1:00 pm to 4:00 pm\n\nLearning from the National Advanced Packa
 ging Manufacturing Program (NAPMP)\n\nKeynote Presentation from Professor 
 Subramanian S. Iyer\, Director\, National Advanced Packaging Manufacturing
  Program (NAPMP)\n\nPanel / Fireside Chat with three guest panelists\n\nAj
 it Manocha - SEMI President\n\nNicky Lu – CEO/ Founder ETRON\n\nTim Lee 
 – IEEE USA President Elect &amp; Boeing Fellow\n\nQ&amp;A from the floor\n\nMode
 rators:\n\nRavi Mahajan &amp; William Chen\n\nThursday February 22\, 2024\n\n9
 :00 am to 12:00 noon\n\nConference Opening Welcome\n\nHIR Technology Focus
  and Future Vision\n\nKeynote Speakers\n\nDr Vincent (Woopoung) Kim (Samsu
 ng)\n\n“Advanced Packaging in the Era of HPC and AI”\n\nAlan Smith (AM
 D)\n\n“AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and A
 I Accelerator for Exa-Class Systems”\n\nCarl McCants (Darpa)\n\n“Chall
 enges and Opportunities in Manufacturing 3 dimentional Heterogeneously Int
 egrated (3DHI) Microsystem”\n\nJohn Schreck &amp; S.V. Sreenivasan (TIE UT A
 ustin)\n\n“Creating a Wafer-level 3DHI R&amp;D and Prototyping Facility”\n
 \nLunch\n\n1:15 pm to 4:30 pm\n\nHIR TWG Presentations\n\nWine Tasting\n\n
 Friday February 23\, 2024\n\nWei-Chung Lo/ Shih-Chieh Chang (EOSL-ITRI\, T
 aiwan)\n\n“Collaboration in Advancing Advanced Packaging and Manufacturi
 ng in Heterogeneous Integration in ITRI”\n\nBob Wisniewski (Samsung)\n\n
 “The Importance of Tight Coupling for Performance and Productivity”\n\
 nJosh Fryman (Intel)\n\n“Future architecture demands for more aggressive
  packaging”\n\nErik Jung/ Albert Heuberger (Fraunhofer Institute Germany
 )\n\n&quot;Advanced Heterogenous Integration as a core activity in the European
  ChipsJU Initiative&quot;\n\nLunch\n\n1:15 pm to 4:30 pm\n\nHIR TWG Presentatio
 ns\n\nHIR Town Hall\n\n* TWG Panel/ Teams\n\nTeam 1 Thursday February 22\,
  2024\n\n-\n- Aerospace &amp; Defense: Tim Lee \, Dan Blass\n- 5G Communicatio
 ns &amp; Beyond: Tim Lee \, Herbert Bennett\n- Thermal Management: Yin Hang\, 
 Madhu Iyengar\, Azmat Malik\, Weihua Tang\n- Co-Design: Jose E. Schutt-Ain
 e\n- Test: Jeorge Hurtarte\, Ken Butler\n- Integrated Power Electronics: P
 atrick McCluskey\, Douglas Hopkins\n\nTeam 2 Thursday February 22\, 2024\n
 \n-\n- High Performance Computing &amp; Data Centers: Kanad Ghose\, John Shalf
 \n- 2D-3D Interconnect: Ravi Mahajan\n- Modelling &amp; Simulation: Chris Bail
 ey \, Xuejun Fan\n- Wafer Level Packaging: Rozalia Beica \,\n- Automotive:
  Veer Dhandapani\, Vikas Gupta\n- Additive Electronics Manufacturing: Kris
  Erickson\n\nTeam 3 Friday February 23\, 2024\n\n- SiP &amp; Module: Erik Jung
 \, Rolf Aschenbrenner \, Klaus Pressel\n- MEMS &amp; Sensors Integration: Bens
 on Chan\, Mary-Ann Maher\, Shafi Saiyed\n- Advanced Manufacturing &amp; Multi 
 Chip Integration Mark Gerber\, Annette Teng &amp; William Chen\n- Supply Chain
 : Kitty Pearsall\, Melissa Grupen Shemansky Paul Trio \, Siva Sivasankar\n
 - Integrated Photonics\, Amr Helmy\, Bill Bottoms\n- Cyber Security: Sohra
 b Aftabjahani\n\nTeam 4 Friday February 23\, 2024\n\n- Medical\, Health &amp; 
 Wearables: Mark Poliks \, Jan Vardaman\n- IoT: Robert Lo Rockwell Hsu\n- M
 obile: Benson Chan \, William Chen\n- Reliability Abhijit Dasgupta\, Richa
 rd Rao &amp; Shubha Sahasrabudhe\n- Emerging Research Devices: Meyya Meyyapan\
 n\nParking available onsite: follow signs\n\nWiFi available\n\nSamsung Ele
 ctronics Campus\, 3655 N First Street\,\, San Jose\, California\, United S
 tates\, 95134
LOCATION:Samsung Electronics Campus\, 3655 N First Street\,\, San Jose\, Ca
 lifornia\, United States\, 95134
ORGANIZER:anmalik@ieee.org
SEQUENCE:99
SUMMARY:Seventh Annual Symposium on Heterogeneous Integration Roadmap and A
 nnual Meeting
URL;VALUE=URI:https://events.vtools.ieee.org/m/398899
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;span style=&quot;font-size: 12pt\;&quot;&gt;&lt;strong&gt;Fu
 ture Vision for Heterogeneous Integration&lt;/strong&gt;&lt;em&gt; from Global Perspec
 tives\, 2 days\, 8 keynote talks\, working &lt;/em&gt;&lt;em&gt;groups&lt;/em&gt; &lt;em&gt;...&lt;/e
 m&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;font-size: 12pt\;&quot;&gt;&amp;nbsp\;[see details in &lt;
 strong&gt;AGENDA&lt;/strong&gt; box below]&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;span sty
 le=&quot;font-size: 12pt\;&quot;&gt;When you get to the Visitor Parking area\, staff wi
 ll guide you to available section\, and to the South Tower to check in and
  get ypour badge.&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Ag
 enda: &lt;br /&gt;&lt;p&gt;&lt;span style=&quot;text-decoration: underline\; font-size: 14pt\;
 &quot;&gt;&lt;strong&gt;Wednesday February 21\, 2024&lt;/strong&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;1:0
 0 pm to 4:00 pm&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Learning from the National Advanc
 ed Packaging &lt;/strong&gt;&lt;strong&gt;Manufacturing Program (NAPMP)&lt;/strong&gt;&lt;/p&gt;\n
 &lt;p&gt;Keynote Presentation from Professor Subramanian S. Iyer\, Director\, Na
 tional Advanced Packaging Manufacturing Program (NAPMP)&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Pa
 nel / Fireside Chat with three guest panelists&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Aj
 it Manocha - SEMI President&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Nicky Lu &amp;ndash\; CEO
 / Founder ETRON&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Tim Lee &amp;ndash\; IEEE USA Preside
 nt Elect &amp;amp\; Boeing Fellow&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Q&amp;amp\;A from the f
 loor&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Moderators: &lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Ravi M
 ahajan &amp;amp\; William Chen&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;text-decoration: 
 underline\;&quot;&gt;&lt;span style=&quot;font-size: 14pt\;&quot;&gt;&lt;strong&gt;Thursday February 22\
 , 2024&lt;/strong&gt;&lt;/span&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;9:00 am to 12:00 noon&lt;/stron
 g&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Conference Opening Welcome&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;HIR
  Technology Focus and Future Vision&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;text-dec
 oration: underline\;&quot;&gt;&lt;span style=&quot;font-size: 14pt\;&quot;&gt;&lt;strong&gt;Keynote Spea
 kers&lt;/strong&gt;&lt;/span&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Dr Vincent (Woopoung) Kim (Sam
 sung)&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;em&gt;&amp;ldquo\;&lt;/em&gt;&lt;/strong&gt;&lt;em&gt;Advanced Pack
 aging in the Era of HPC and AI&amp;rdquo\;&lt;/em&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Alan Smith (AM
 D)&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;em&gt;&amp;ldquo\;AMD Instinct&lt;sup&gt;TM&lt;/sup&gt;&amp;nbsp\;MI300 Seri
 es Modular Chiplet Package &amp;ndash\; HPC and AI Accelerator for Exa-Class S
 ystems&amp;rdquo\;&lt;/em&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Carl McCants (Darpa)&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;
 &amp;ldquo\;Challenges and Opportunities in Manufacturing 3 dimentional Hetero
 geneously Integrated (3DHI) Microsystem&amp;rdquo\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;John Schre
 ck &amp;amp\; S.V. Sreenivasan (TIE UT Austin)&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;ldquo\;Creati
 ng a Wafer-level 3DHI R&amp;amp\;D and Prototyping Facility&amp;rdquo\;&lt;/p&gt;\n&lt;p&gt;&lt;s
 pan style=&quot;text-decoration: underline\;&quot;&gt;&lt;em&gt;&lt;strong&gt;Lunch&lt;/strong&gt;&lt;/em&gt;&lt;/
 span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;1:15 pm to 4:30 pm&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;HIR TWG 
 Presentations &lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Wine Tasting&amp;nbsp\; &lt;/strong&gt;&lt;/p&gt;\
 n&lt;p&gt;&lt;span style=&quot;text-decoration: underline\; font-size: 14pt\;&quot;&gt;&lt;strong&gt;F
 riday February 23\, 2024&lt;/strong&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Wei-Chung Lo/ Shi
 h-Chieh Chang (EOSL-ITRI\, Taiwan)&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;ldquo\;Collaboration 
 in Advancing Advanced Packaging and Manufacturing in Heterogeneous Integra
 tion in ITRI&amp;rdquo\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Bob Wisniewski (Samsung)&lt;/strong&gt;&lt;/p&gt;
 \n&lt;p&gt;&lt;em&gt;&amp;ldquo\;&lt;/em&gt;The Importance of Tight Coupling for Performance and
  Productivity&amp;rdquo\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Josh Fryman (Intel)&lt;/strong&gt;&lt;/p&gt;\n&lt;p
 &gt;&amp;ldquo\;Future architecture demands for more aggressive packaging&amp;rdquo\;
 &lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Erik Jung/ Albert Heuberger (Fraunhofer Institute Germany
 )&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&quot;Advanced Heterogenous Integration as a core activity i
 n the European ChipsJU Initiative&quot;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Lunch&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;
 &lt;strong&gt;1:15 pm to 4:30 pm&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;HIR TWG Presentations 
 &lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;HIR Town Hall&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;* &lt;span s
 tyle=&quot;text-decoration: underline\;&quot;&gt;TWG Panel/ Teams &lt;/span&gt;&lt;/strong&gt;&lt;/p&gt;\
 n&lt;p&gt;&lt;span style=&quot;text-decoration: underline\;&quot;&gt;Team 1 Thursday February 22
 \, 2024&lt;/span&gt;&lt;/p&gt;\n&lt;ul&gt;\n&lt;li&gt;\n&lt;ul&gt;\n&lt;li&gt;Aerospace &amp;amp\; Defense: Tim Le
 e \, Dan Blass&lt;/li&gt;\n&lt;li&gt;5G Communications &amp;amp\; Beyond: Tim Lee \, Herbe
 rt Bennett&lt;/li&gt;\n&lt;li&gt;Thermal Management: Yin Hang\, Madhu Iyengar\, Azmat 
 Malik\, Weihua Tang&lt;/li&gt;\n&lt;li&gt;Co-Design: Jose E. Schutt-Aine&lt;/li&gt;\n&lt;li&gt;Tes
 t: Jeorge Hurtarte\, Ken Butler&lt;/li&gt;\n&lt;li&gt;Integrated Power Electronics: Pa
 trick McCluskey\, Douglas Hopkins&lt;/li&gt;\n&lt;/ul&gt;\n&lt;/li&gt;\n&lt;/ul&gt;\n&lt;p&gt;&lt;span styl
 e=&quot;text-decoration: underline\;&quot;&gt;Team 2 Thursday February 22\, 2024&lt;/span&gt;
 &lt;/p&gt;\n&lt;ul&gt;\n&lt;li&gt;\n&lt;ul&gt;\n&lt;li&gt;High Performance Computing &amp;amp\; Data Centers
 : Kanad Ghose\, John Shalf&lt;/li&gt;\n&lt;li&gt;2D-3D Interconnect: Ravi Mahajan&lt;/li&gt;
 \n&lt;li&gt;Modelling &amp;amp\; Simulation: Chris Bailey \, Xuejun Fan&lt;/li&gt;\n&lt;li&gt;Wa
 fer Level Packaging: Rozalia Beica \,&amp;nbsp\;&lt;/li&gt;\n&lt;li&gt;Automotive: Veer Dh
 andapani\, Vikas Gupta&lt;/li&gt;\n&lt;li&gt;Additive Electronics Manufacturing: Kris 
 Erickson&lt;/li&gt;\n&lt;/ul&gt;\n&lt;/li&gt;\n&lt;/ul&gt;\n&lt;p&gt;&lt;span style=&quot;text-decoration: under
 line\;&quot;&gt;Team 3 Friday February 23\, 2024&lt;/span&gt;&lt;/p&gt;\n&lt;ul&gt;\n&lt;li&gt;SiP &amp;amp\; 
 Module: Erik Jung\, Rolf Aschenbrenner&amp;nbsp\;\, Klaus Pressel&lt;/li&gt;\n&lt;li&gt;ME
 MS &amp;amp\; Sensors Integration: Benson Chan\, Mary-Ann Maher\, Shafi Saiyed
 &lt;/li&gt;\n&lt;li&gt;Advanced Manufacturing &amp;amp\; Multi Chip Integration Mark Gerbe
 r\, Annette Teng &amp;amp\; William Chen&lt;/li&gt;\n&lt;li&gt;Supply Chain: Kitty Pearsal
 l\, Melissa Grupen Shemansky Paul Trio \, Siva Sivasankar&lt;/li&gt;\n&lt;li&gt;Integr
 ated Photonics\, Amr Helmy\, Bill Bottoms&lt;/li&gt;\n&lt;li&gt;Cyber Security: Sohrab
  Aftabjahani&lt;/li&gt;\n&lt;/ul&gt;\n&lt;p&gt;&lt;span style=&quot;text-decoration: underline\;&quot;&gt;Te
 am 4 Friday &amp;nbsp\;February 23\, 2024&lt;/span&gt;&lt;/p&gt;\n&lt;ul&gt;\n&lt;li&gt;Medical\, Heal
 th &amp;amp\; Wearables: Mark Poliks \, Jan Vardaman&lt;/li&gt;\n&lt;li&gt;IoT: Robert Lo 
 Rockwell Hsu&lt;/li&gt;\n&lt;li&gt;Mobile: Benson Chan \, William Chen&lt;/li&gt;\n&lt;li&gt;Relia
 bility Abhijit Dasgupta\,&amp;nbsp\; Richard Rao &amp;amp\; Shubha Sahasrabudhe&lt;/l
 i&gt;\n&lt;li&gt;Emerging Research Devices: Meyya Meyyapan&lt;/li&gt;\n&lt;/ul&gt;\n&lt;p&gt;&lt;strong&gt;
 Parking available onsite: follow signs&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;WiFi avail
 able&lt;/strong&gt;&lt;/p&gt;
END:VEVENT
END:VCALENDAR