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TZID:America/Los_Angeles
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DTSTART:20240310T030000
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DTSTART:20241103T010000
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BEGIN:VEVENT
DTSTAMP:20240514T230609Z
UID:D8DDA251-11B2-46C8-A328-D516CCE68D70
DTSTART;TZID=America/Los_Angeles:20240502T083000
DTEND;TZID=America/Los_Angeles:20240503T163000
DESCRIPTION:BUSS’24 is a two-day\, in-person event — May 2-3\, 2024 at 
 SEMI Hdqtrs\, Silicon Valley\, CA USA Visit [www.ieee-buss.org](http://iee
 e-buss.org)\n\nUnfortunately\, we have reached the capacity of our facilit
 ies. Please plan to join us next year for BUSS'25!\n\nWe are living in the
  era of heterogenous integration driven by fast\, efficient and big data c
 omputing resources at our fingertips. The mega-monolithic silicon chip is 
 a thing of the past\, replaced with 3D heterogenous integration of chiplet
 s onto a platform made of an organic build-up substrate. Volume manufactur
 ers of build-up substrates are entirely based in Asia\, leaving a desert i
 n the US. Volume build-up substrates used by major IDMs are manufactured i
 n Asian countries including Taiwan\, Japan and China.\nHowever\, there are
  multiple activities starting up in the US\, and this is why a gathering o
 f the US players is important. This symposium is geared for all those invo
 lved in the supply chain of build-up substrates in the US\, as well as use
 rs. As the US Congress debates H.R. 3249\, the Protecting Circuit Boards a
 nd Substrates (PCBS) Act\, this Symposium is an opportunity for all build-
 up substrate players to meet\, network and cohesively work with funding ag
 encies who will be invited to this symposium to focus on onshoring build-u
 p substrate production and utilization.\n\nSEMI World Headquarters\, 673 S
 outh Milpitas Blvd\, Milpitas\, California\, United States\, 95035
LOCATION:SEMI World Headquarters\, 673 South Milpitas Blvd\, Milpitas\, Cal
 ifornia\, United States\, 95035
ORGANIZER:p.wesling@ieee.org
SEQUENCE:41
SUMMARY:IEEE Build-Up Substrate Symposium (BUSS)
URL;VALUE=URI:https://events.vtools.ieee.org/m/400827
X-ALT-DESC:Description: <br /><p><strong>BUSS&rsquo\;24 is a two-day\, in-p
 erson event &mdash\; May 2-3\, 2024 at SEMI Hdqtrs\, Silicon Valley\, CA U
 SA&nbsp\; Visit <a href="http://ieee-buss.org">www.ieee-buss.org</a><br></
 strong></p>\n<p><strong><span style="color: rgb(224\, 62\, 45)\;">Unfortun
 ately\, we have reached the capacity of our facilities.&nbsp\; Please plan
  to join us next year for BUSS'25!</span></strong></p>\n<p>We are living i
 n the era of heterogenous integration driven by fast\, efficient and big d
 ata computing resources at our fingertips. The mega-monolithic silicon chi
 p is a thing of the past\, replaced with 3D heterogenous integration of ch
 iplets onto a platform made of an organic build-up substrate. Volume manuf
 acturers of build-up substrates are entirely based in Asia\, leaving a des
 ert in the US. Volume build-up substrates used by major IDMs are manufactu
 red in Asian countries including Taiwan\, Japan and China.<br>However\, th
 ere are multiple activities starting up in the US\, and this is why a gath
 ering of the US players is important. This symposium is geared for all tho
 se involved in the supply chain of build-up substrates in the US\, as well
  as users. As the US Congress debates H.R. 3249\, the Protecting Circuit B
 oards and Substrates (PCBS) Act\, this Symposium is an opportunity for all
  build-up substrate players to meet\, network and cohesively work with fun
 ding agencies who will be invited to this symposium to focus on onshoring 
 build-up substrate production and utilization.</p>
END:VEVENT
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