BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Asia/Tokyo
BEGIN:STANDARD
DTSTART:19510909T000000
TZOFFSETFROM:+1000
TZOFFSETTO:+0900
TZNAME:JST
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BEGIN:VEVENT
DTSTAMP:20240214T053218Z
UID:E926575C-3BC9-4D99-B110-71FC8601A9B6
DTSTART;TZID=Asia/Tokyo:20230714T160000
DTEND;TZID=Asia/Tokyo:20230714T183000
DESCRIPTION:58th IEEE EPS Japan Chapter Evening Meeting ~ Special Session f
 rom ECTC 2023 ~\n\nAgenda: \n16:05-16:30 Development of Fluxless Micro-Bon
 ding and Narrow Gap Filling Process\n\nMr. Sadaaki Katoh (Resonac Corporat
 ion)\n\n16:30-16:55 50 nm Overlay Accuracy for Wafer-to-wafer Bonding by H
 igh-precision Alignment Technologies\n\nMr. Hajime Mitsuishi (NIKON CORPOR
 ATION)\n\n16:55-17:20 Innovative Fan-Out Embedded Bridge Structure for Co-
 Packaged Optics\n\nDr. Jay Li (SPIL)\n\n17:30-17:55 A Scalable Heterogeneo
 us AiP Module for a 256-Element 5G Phased Array\n\nDr. Atom O. Watanabe (I
 BM Corporation)\n\n17:55-18:20 A New Millimeter-wave Package Design Based 
 on Pseudo-cavity Mode Electromagnetic Wave Excitation Using 400-μm Core F
 CBGA\n\nMr. Ryuichi Oikawa (Renesas Electronics Corporation)\n\nBldg: AIRB
 IC\, 7-7 Shinkawasaki\, Saiwai-ku\, Kawasaki\, Kanagawa\, Japan\, 212-0032
 \, Virtual: https://events.vtools.ieee.org/m/406623
LOCATION:Bldg: AIRBIC\, 7-7 Shinkawasaki\, Saiwai-ku\, Kawasaki\, Kanagawa\
 , Japan\, 212-0032\, Virtual: https://events.vtools.ieee.org/m/406623
ORGANIZER:SHIGETOU.Akitsu@nims.go.jp
SEQUENCE:34
SUMMARY:58th IEEE EPS Japan Chapter Evening Meeting
URL;VALUE=URI:https://events.vtools.ieee.org/m/406623
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;58th IEEE EPS Japan Chapter Evening Meetin
 g&amp;nbsp\; ~ Special Session from ECTC 2023 ~&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;
 p&gt;16:05-16:30 &amp;nbsp\;Development of Fluxless Micro-Bonding and Narrow Gap 
 Filling Process&lt;/p&gt;\n&lt;p&gt;Mr. Sadaaki Katoh (Resonac Corporation)&lt;br /&gt;&lt;br /
 &gt;16:30-16:55 &amp;nbsp\;50 nm Overlay Accuracy for Wafer-to-wafer Bonding by H
 igh-precision Alignment Technologies&lt;/p&gt;\n&lt;p&gt;Mr. Hajime Mitsuishi (NIKON C
 ORPORATION)&lt;br /&gt;&lt;br /&gt;16:55-17:20 &amp;nbsp\;Innovative Fan-Out Embedded Brid
 ge Structure for Co-Packaged Optics&lt;/p&gt;\n&lt;p&gt;Dr. Jay Li (SPIL)&lt;/p&gt;\n&lt;p&gt;17:3
 0-17:55 &amp;nbsp\;A Scalable Heterogeneous AiP Module for a 256-Element 5G Ph
 ased Array&lt;/p&gt;\n&lt;p&gt;Dr. Atom O. Watanabe (IBM Corporation)&lt;/p&gt;\n&lt;p&gt;17:55-18
 :20 &amp;nbsp\;A New Millimeter-wave Package Design Based on Pseudo-cavity Mod
 e Electromagnetic Wave Excitation Using 400-&amp;mu\;m Core FCBGA&lt;/p&gt;\n&lt;p&gt;Mr. 
 Ryuichi Oikawa (Renesas Electronics Corporation)&lt;/p&gt;
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