BEGIN:VCALENDAR
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PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
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DTSTART:20240310T030000
TZOFFSETFROM:-0500
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DTSTAMP:20240418T201103Z
UID:EE742412-ECCB-41F9-991D-33F62CB5CD15
DTSTART;TZID=America/New_York:20240418T120000
DTEND;TZID=America/New_York:20240418T130000
DESCRIPTION:As glass is gaining a lot of attention and momentum as a state 
 of the art semiconductor packaging technology\, industry is looking to com
 plete the supply chain to enable this promising technology. Several advanc
 es have been made in the field of metallizing glass core through vias\, an
 d in today’s presentation\, we will discuss several options and MKS’ t
 ake on delivering a manufacturable solution. We will discuss options for s
 eed layer deposition and highlight the MKS wet metallization technique tha
 t allows us to directly plate on glass. We will also go over several optio
 ns for electrolytic plating of the bulk copper conductor for the through g
 lass vias.\n\nCo-sponsored by: Habib Hichiri\n\nSpeaker(s): Jobert van Eis
 den\, \n\nVirtual: https://events.vtools.ieee.org/m/412596
LOCATION:Virtual: https://events.vtools.ieee.org/m/412596
ORGANIZER:chanb@binghamton.edu
SEQUENCE:17
SUMMARY:Metallization of glass core and through-glass vias
URL;VALUE=URI:https://events.vtools.ieee.org/m/412596
X-ALT-DESC:Description: <br /><p class="MsoNormal">As glass is gaining a lo
 t of attention and momentum as a state of the art semiconductor packaging 
 technology\, industry is looking to complete the supply chain to enable th
 is promising technology. Several advances have been made in the field of m
 etallizing glass core through vias\, and in today&rsquo\;s presentation\, 
 we will discuss several options and MKS&rsquo\; take on delivering a manuf
 acturable solution. We will discuss options for seed layer deposition and 
 highlight the MKS wet metallization technique that allows us to directly p
 late on glass. We will also go over several options for electrolytic plati
 ng of the bulk copper conductor for the through glass vias.</p>
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