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DTSTAMP:20240409T133328Z
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DTSTART;TZID=America/New_York:20240405T130000
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DESCRIPTION:Abstract:\n\nHeterogeneous Integration (HI) provides the opport
 unity for dense connectivity between smaller dies from advanced technology
  nodes to improve yield\, provides for connectivity between optimized lega
 cy technology nodes to reduce time to market\, and enables the connectivit
 y of dissimilar dies on a single platform to enhance functionality. Though
  fueled by semiconductor packaging\, HI represents higher levels of integr
 ation than what the semiconductor industry is used to and has done in the 
 past. This is paramount to continuing Moore’s law and making More than M
 oore possible.\n\nAs expected\, this approach will pose many challenges bu
 t lots of opportunities as HI takes center stage. This presentation will c
 over the current state of the art\, emerging applications\, challenges tha
 t need to be addressed\, and solutions being pursued.\n\nSpeaker(s): Prof.
  Madhavan Swaminathan\, \n\nVirtual: https://events.vtools.ieee.org/m/4138
 48
LOCATION:Virtual: https://events.vtools.ieee.org/m/413848
ORGANIZER:manohar.bongarala@nokia-bell-labs.com
SEQUENCE:23
SUMMARY:Why are Semiconductor Packaging & Heterogeneous Integration taking 
 Center Stage for continuing Moore’s Law?
URL;VALUE=URI:https://events.vtools.ieee.org/m/413848
X-ALT-DESC:Description: <br /><p class="MsoNormal" style="text-align: justi
 fy\;">Abstract:</p>\n<p class="MsoNormal" style="text-align: justify\;">He
 terogeneous Integration (HI) provides the opportunity for dense connectivi
 ty between smaller dies from advanced technology nodes to improve yield\, 
 provides for connectivity between optimized legacy technology nodes to red
 uce time to market\, and enables the connectivity of dissimilar dies on a 
 single platform to enhance functionality. Though fueled by semiconductor p
 ackaging\, HI represents higher levels of integration than what the semico
 nductor industry is used to and has done in the past. This is paramount to
  continuing Moore&rsquo\;s law and making More than Moore possible.</p>\n<
 p class="MsoNormal" style="text-align: justify\;">As expected\, this appro
 ach will pose many challenges but lots of opportunities as HI takes center
  stage. This presentation will cover the current state of the art\, emergi
 ng applications\, challenges that need to be addressed\, and solutions bei
 ng pursued.</p>
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