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DTSTART:20240310T030000
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DTSTART:20241103T010000
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RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
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DTSTAMP:20241130T231626Z
UID:D3B27B1A-54B8-4A0E-987C-3B7D107A0830
DTSTART;TZID=America/Los_Angeles:20240411T113000
DTEND;TZID=America/Los_Angeles:20240411T131500
DESCRIPTION:[]\n\nAbstract:\n\nAs downscaling approaches physical limits\, 
 semiconductor devices are evolving into increasingly complex 3D nano-archi
 tectures. Fabricating these unprecedented devices in HVM requires precise 
 and selective material deposition &amp; etch methods.\n\nAtomic layer etch (AL
 E) helps to sculpt these structures by selectively removing materials with
  angstrom-scale control. By exploiting chemical differences between materi
 als\, ALE processes are designed to etch certain exposed materials while m
 inimizing damage to others. ALE can enable scaling boosters such as fully 
 self-aligned via (FSAV)\, a critical method for logic back end of line (BE
 OL) downscaling. Vapor-phase thermal ALE can also provide controlled\, sel
 ective etch in features with high aspect ratio\, low critical dimension\, 
 or horizontal openings\, overcoming the limitations of wet and plasma etch
 es in emerging 3D structures.\n\nThis seminar will focus on ALE of metals 
 and metal oxides for logic and DRAM\, including process fundamentals\, sel
 ectivity mechanisms\, and thermal ALE processes developed at EMD Electroni
 cs\n\n[]\n\nBio:\n\nMartin McBriarty\n\nSenior Scientist\, EMD Electronics
 \n\nMartin McBriarty leads atomic layer etch development at EMD Electronic
 s in San Jose\, California.\n\nHe earned his B.S. in Materials Science &amp; E
 ngineering at the University of Florida in 2008 and his Ph.D. in the same 
 field at Northwestern University in 2014. He studied at the Fritz Haber In
 stitute as a Fulbright scholar and completed postdoctoral work at Pacific 
 Northwest National Laboratory before joining Intermolecular (a business of
  Merck KGaA\, Darmstadt\, Germany) in 2018.\n\nIn-Person Meeting\n\nThursd
 ay\, April 11\, 2024\n\n11:30 AM: Networking\, Pizza &amp; Drinks\n\nNoon -- 1
  pm: Seminar\n\nPlease register on Eventbrite before 9:30 AM on Thursday\,
  April 11 \, 2024\n\nhttps://www.eventbrite.com/e/868091132947?aff=oddtdtc
 reator\n\nWalk-In attendance is welcomed but discouraged\n\nCo-sponsored b
 y: CH06083 - SCV/SF Jt. Section Chapter\, ED15\n\nBldg: ==&gt; Use corner ent
 rance: Kifer Road / San Lucar Court ==&gt; Do not enter at main entrance on K
 ifer Road\, EAG Labs\, 810 Kifer Road\, Sunnyvale\, California\, United St
 ates\, 95051
LOCATION:Bldg: ==&gt; Use corner entrance: Kifer Road / San Lucar Court ==&gt; Do
  not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Su
 nnyvale\, California\, United States\, 95051
ORGANIZER:g.m.friedman@ieee.org
SEQUENCE:24
SUMMARY:Thermal Atomic Layer Etch for Logic and Memory Downscaling
URL;VALUE=URI:https://events.vtools.ieee.org/m/415097
X-ALT-DESC:Description: &lt;br /&gt;&lt;div class=&quot;eds-l-mar-vert-6 eds-l-sm-mar-ver
 t-4 eds-text-bm structured-content-rich-text&quot;&gt;\n&lt;div class=&quot;eds-text--left
 &quot;&gt;\n&lt;h3&gt;&amp;nbsp\;&lt;/h3&gt;\n&lt;h3&gt;&lt;img src=&quot;https://events.vtools.ieee.org/vtools_
 ui/media/display/51c2c863-fee6-4ce2-9b3c-b6245d39f0ce&quot; alt=&quot;&quot; width=&quot;546&quot; 
 height=&quot;364&quot;&gt;&lt;/h3&gt;\n&lt;h3&gt;&lt;em&gt;Abstract:&lt;/em&gt;&lt;/h3&gt;\n&lt;h3&gt;As downscaling approa
 ches physical limits\, semiconductor devices are evolving into increasingl
 y complex 3D nano-architectures. Fabricating these unprecedented devices i
 n HVM requires precise and selective material deposition &amp;amp\; etch metho
 ds.&lt;/h3&gt;\n&lt;h3&gt;Atomic layer etch (ALE) helps to sculpt these structures by 
 selectively removing materials with angstrom-scale control. By exploiting 
 chemical differences between materials\, ALE processes are designed to etc
 h certain exposed materials while minimizing damage to others. ALE can ena
 ble scaling boosters such as fully self-aligned via (FSAV)\, a critical me
 thod for logic back end of line (BEOL) downscaling. Vapor-phase thermal AL
 E can also provide controlled\, selective etch in features with high aspec
 t ratio\, low critical dimension\, or horizontal openings\, overcoming the
  limitations of wet and plasma etches in emerging 3D structures.&lt;/h3&gt;\n&lt;h3
 &gt;This seminar will focus on ALE of metals and metal oxides for logic and D
 RAM\, including process fundamentals\, selectivity mechanisms\, and therma
 l ALE processes developed at EMD Electronics&lt;/h3&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n&lt;div cl
 ass=&quot;&quot; data-testid=&quot;image-content&quot;&gt;\n&lt;div class=&quot;eds-l-mar-vert-6 eds-l-sm
 -mar-vert-4 eds-text-bm undefined&quot;&gt;\n&lt;div&gt;\n&lt;div class=&quot;eds-fx--fade-in&quot;&gt;&lt;
 img class=&quot;eds-max-img&quot; src=&quot;https://img.evbuc.com/https%3A%2F%2Fcdn.evbuc
 .com%2Fimages%2F726167079%2F28237422945%2F1%2Foriginal.20240322-182657?h=2
 000&amp;amp\;w=720&amp;amp\;auto=format%2Ccompress&amp;amp\;q=75&amp;amp\;sharp=10&amp;amp\;s=
 29d82628dce7f57e8bf481d6e09c1b2a&quot; alt=&quot;&quot; loading=&quot;lazy&quot;&gt;&lt;/div&gt;\n&lt;/div&gt;\n&lt;/
 div&gt;\n&lt;/div&gt;\n&lt;div class=&quot;eds-l-mar-vert-6 eds-l-sm-mar-vert-4 eds-text-bm
  structured-content-rich-text&quot;&gt;\n&lt;div class=&quot;eds-text--left&quot;&gt;\n&lt;h3&gt;&lt;em&gt;Bio
 :&lt;/em&gt;&lt;/h3&gt;\n&lt;h3&gt;Martin McBriarty&lt;/h3&gt;\n&lt;h3&gt;Senior Scientist\, EMD Electro
 nics&lt;/h3&gt;\n&lt;h3&gt;Martin McBriarty leads atomic layer etch development at EMD
  Electronics in San Jose\, California.&lt;/h3&gt;\n&lt;h3&gt;He earned his B.S. in Mat
 erials Science &amp;amp\; Engineering at the University of Florida in 2008 and
  his Ph.D. in the same field at Northwestern University in 2014. He studie
 d at the Fritz Haber Institute as a Fulbright scholar and completed postdo
 ctoral work at Pacific Northwest National Laboratory before joining Interm
 olecular (a business of Merck KGaA\, Darmstadt\, Germany) in 2018.&lt;/h3&gt;\n&lt;
 p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;&lt;em&gt;In-Person Meeting&lt;/em&gt;&lt;/h3&gt;\n&lt;p&gt;&lt;strong&gt;Thursday\, 
 April 11&lt;/strong&gt;&lt;strong&gt;\, 2024&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;11:30 AM: Networ
 king\, Pizza &amp;amp\; Drinks&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Noon -- 1 pm: Seminar&lt;
 /strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Please register on Eventbrite before 9:30 AM on&lt;/
 strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;Thursday\, April 11&lt;/strong&gt;&lt;strong&gt; \, 2
 024&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;https://www.eventbrite.com/e/868091132947?aff
 =oddtdtcreator&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Walk-In attendance is welcomed but
  discouraged&lt;/strong&gt;&lt;/p&gt;\n&lt;/div&gt;\n&lt;/div&gt;
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