BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD DTSTART:19451014T230000 TZOFFSETFROM:+0630 TZOFFSETTO:+0530 TZNAME:IST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20241226T175030Z UID:9EEB75EC-57B6-4EBE-BBE9-05C3FC5527D2 DTSTART;TZID=Asia/Kolkata:20240408T190000 DTEND;TZID=Asia/Kolkata:20240408T200000 DESCRIPTION:[]\n\nThe Distinguished Lecturer Program started with the Welco me Address and Introduction of the Resource Person by Ms. S\,Usha\, Adviso r\, IEEE Circuits and Systems Society\, Sri Sairam Engineering College. Ne xt\, the session was taken over by Prof. Emre Salman. 90 participants atte nded this DLP.\n\nMonolithic 3D integration represents a promising avenue for advancing integrated circuit (IC) technology\, offering enhanced perfo rmance and functionality in a compact footprint. Thermal management is a c ritical aspect of Monolithic 3D IC design due to increased heat density re sulting from vertical stacking of device layers. Design methodologies focu sing on thermal-centric approaches aim to mitigate thermal challenges whil e optimizing performance and reliability. These methodologies encompass va rious techniques such as thermal-aware floorplanning\, placement\, and rou ting to ensure efficient heat dissipation and temperature uniformity acros s the 3D IC. Advanced thermal simulation tools and models play a crucial r ole in predicting and analyzing thermal behaviour at different design stag es. Thermal-aware design optimization algorithms are employed to balance t rade-offs between thermal\, electrical\, and physical constraints\, maximi zing overall system performance. Integration of microfluidic cooling solut ions and novel materials with high thermal conductivity further enhances t hermal management in Monolithic 3D ICs. Collaborative efforts between desi gn\, packaging\, and thermal experts are essential for developing holistic approaches to thermal-centric design in Monolithic 3D ICs.By prioritizing thermal considerations throughout the design process\, thermal-centric me thodologies pave the way for the development of next-generation Monolithic 3D integrated circuits with improved performance\, reliability\, and ener gy efficiency.\n\nHe also answered the queries asked by our students. The vote of thanks was proposed by Mr. Ramakrishnan Sriram\, third year ECE st udent of our college.\n\nWe take this opportunity to thank our CEO sir\, P rincipal sir\, Dean (Academics) and HOD-ECE Dr. J.Raja sir for their suppo rt and guidance towards the successful completion of this Distinguished Le cturer Program.\n\nSpeaker(s): Prof. Emre Salman\, \, \n\nVirtual: https:/ /events.vtools.ieee.org/m/416021 LOCATION:Virtual: https://events.vtools.ieee.org/m/416021 ORGANIZER:uska0422@gmail.com SEQUENCE:15 SUMMARY:Distinguished Lecturer Program on Thermal Centric Design Methodolog ies for Monolithic 3D Integrated Circuits URL;VALUE=URI:https://events.vtools.ieee.org/m/416021 X-ALT-DESC:Description: <br /><p><img src="https://events.vtools.ieee.org/v tools_ui/media/display/bbaf573f-28fd-4f59-bce2-2efafa4ece8d" alt="" width= "356" height="356"> &nbsp\;<strong id="docs-internal-guid-32be4886-7fff-cc 92-850a-7d4746237556"><img src="https://lh7-us.googleusercontent.com/fY_-P S78BcXXLJ0uxPOrWYjcJHQHfa9zkoUoIguKqeDY5Mj6_VoVSL5t1UOeDksHyl39v3FYAFp6swp F98haRfOZsNqlB7qz-EXmEx5EJ1n8X-WOv5eAgrCHBVXWKHkfazQlW2lrFgnklcQFfa_2bW4" width="360" height="360"></strong></p>\n<p dir="ltr">The Distinguished Lec turer Program started with the Welcome Address and Introduction of the Res ource Person by Ms. S\,Usha\, Advisor\, IEEE Circuits and Systems Society\ , Sri Sairam Engineering College. Next\, the session was taken over by Pro f. Emre Salman. 90 participants attended this DLP.&nbsp\;</p>\n<p dir="ltr ">Monolithic 3D integration represents a promising avenue for advancing in tegrated circuit (IC) technology\, offering enhanced performance and funct ionality in a compact footprint.&nbsp\; Thermal management is a critical a spect of Monolithic 3D IC design due to increased heat density resulting f rom vertical stacking of device layers. Design methodologies focusing on t hermal-centric approaches aim to mitigate thermal challenges while optimiz ing performance and reliability. These methodologies encompass various tec hniques such as thermal-aware floorplanning\, placement\, and routing to e nsure efficient heat dissipation and temperature uniformity across the 3D IC. Advanced thermal simulation tools and models play a crucial role in pr edicting and analyzing thermal behaviour at different design stages.&nbsp\ ; Thermal-aware design optimization algorithms are employed to balance tra de-offs between thermal\, electrical\, and physical constraints\, maximizi ng overall system performance.&nbsp\; Integration of microfluidic cooling solutions and novel materials with high thermal conductivity further enhan ces thermal management in Monolithic 3D ICs. Collaborative efforts between design\, packaging\, and thermal experts are essential for developing hol istic approaches to thermal-centric design in Monolithic 3D ICs.By priorit izing thermal considerations throughout the design process\, thermal-centr ic methodologies pave the way for the development of next-generation Monol ithic 3D integrated circuits with improved performance\, reliability\, and energy efficiency.</p>\n<p dir="ltr">He also answered the queries asked b y our students. The vote of thanks was proposed by Mr. Ramakrishnan Sriram \, third year ECE&nbsp\; student of our college.&nbsp\;</p>\n<p dir="ltr"> We take this opportunity to thank our CEO sir\, Principal sir\, Dean (Acad emics) and HOD-ECE Dr. J.Raja sir for their support and guidance towards t he successful completion of this Distinguished Lecturer Program.&nbsp\;</p >\n<p dir="ltr">&nbsp\;</p>\n<p>&nbsp\;</p> END:VEVENT END:VCALENDAR