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DTSTART:20240310T030000
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
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END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20241103T010000
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:CST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20240516T232309Z
UID:1C3A4FF3-41A2-41D8-BA18-ACF4837C60F0
DTSTART;TZID=America/Chicago:20240509T190000
DTEND;TZID=America/Chicago:20240509T200000
DESCRIPTION:The increasing high requirements of wireless communications and
  sensors are making research and commercialization of millimeter-wave inte
 grated circuits and antennas experience tremendous growth. The advancement
  of modern CMOS technology facilitates it to become the prevailing technol
 ogy to achieve low-cost and highly-integrated millimeter-wave integrated c
 ircuits. Meanwhile\, the compound semiconductor is still a must for low no
 ise and high power millimeter-wave system.\n\nAs the operating frequency e
 nters the millimeter-wave regime\, the circuit component’s size becomes 
 comparable to the electromagnetic wave wavelength. Therefore\, a mixed des
 ign methodology using both the lumped and distributed elements in the mill
 imeter-wave integrated circuit design is of great interest\, not only comp
 ound semiconductor but also CMOS integrated circuits. On one hand\, to ach
 ieve high-integration and high-performance\, the heterogeneous packaging a
 rchitecture to combined the merits of both CMOS and compound semiconductor
  millimeter-wave integrated circuits is becoming an attractive technology.
  On the other hand\, considering the efficiency\, cost\, and integration o
 f advanced wireless systems\, discrete antenna is no longer suitable for m
 illimeter-wave wireless systems. Therefore\, antenna-in-package (AiP) has 
 become the mainstream for millimeter-wave system\, which implements an ant
 enna or antennas on (or in) package of chips leading to a high efficiency 
 and highly-integrated radio.\n\nIn the talk\, innovative design approaches
  and methodologies on millimeter-wave integrated circuits\, subsystems and
  corresponding antenna-in-package will be introduced.\n\nThis presentation
  is open to all and both experienced and novice level engineers are welcom
 e to attend.\n\nSpeaker(s): Prof. Quan Xue\n\nAgenda: \n6:45pm - WebEx Wai
 ting Room\n\n7:00-8:00pm - Presentation\n\n8:00-8:15pm - Questions\n\nVirt
 ual: https://events.vtools.ieee.org/m/418916
LOCATION:Virtual: https://events.vtools.ieee.org/m/418916
ORGANIZER:menders@ieee.org
SEQUENCE:42
SUMMARY:Millimeter-wave Transceiver Chips with Antenna in Package
URL;VALUE=URI:https://events.vtools.ieee.org/m/418916
X-ALT-DESC:Description: &lt;br /&gt;&lt;table style=&quot;border-collapse: collapse\; wid
 th: 99.9808%\; border-width: 1px\; border-style: none\;&quot; border=&quot;1&quot;&gt;&lt;colgr
 oup&gt;&lt;col style=&quot;width: 64.1513%\;&quot;&gt;&lt;col style=&quot;width: 35.8293%\;&quot;&gt;&lt;/colgro
 up&gt;\n&lt;tbody&gt;\n&lt;tr&gt;\n&lt;td style=&quot;border-style: none\;&quot;&gt;\n&lt;p&gt;The increasing h
 igh requirements of wireless communications and sensors are making researc
 h and commercialization of millimeter-wave integrated circuits and antenna
 s experience tremendous growth. The advancement of modern CMOS technology 
 facilitates it to become the prevailing technology to achieve low-cost and
  highly-integrated millimeter-wave integrated circuits. Meanwhile\, the co
 mpound semiconductor is still a must for low noise and high power millimet
 er-wave system.&lt;/p&gt;\n&lt;p&gt;As the operating frequency enters the millimeter-w
 ave regime\, the circuit component&amp;rsquo\;s size becomes comparable to the
  electromagnetic wave wavelength. Therefore\, a mixed design methodology u
 sing both the lumped and distributed elements in the millimeter-wave integ
 rated circuit design is of great interest\, not only compound semiconducto
 r but also CMOS integrated circuits. On one hand\, to achieve high-integra
 tion and high-performance\, the heterogeneous packaging architecture to co
 mbined the merits of both CMOS and compound semiconductor millimeter-wave 
 integrated circuits is becoming an attractive technology. On the other han
 d\, considering the efficiency\, cost\, and integration of advanced wirele
 ss systems\, discrete antenna is no longer suitable for millimeter-wave wi
 reless systems. Therefore\, antenna-in-package (AiP) has become the mainst
 ream for millimeter-wave system\, which implements an antenna or antennas 
 on (or in) package of chips leading to a high efficiency and highly-integr
 ated radio.&lt;/p&gt;\n&lt;p&gt;In the talk\, innovative design approaches and methodo
 logies on millimeter-wave integrated circuits\, subsystems and correspondi
 ng antenna-in-package will be introduced.&lt;/p&gt;\n&lt;p&gt;This presentation is ope
 n to all and both &lt;strong&gt;experienced and novice level engineers&lt;/strong&gt; 
 are welcome to attend.&lt;/p&gt;\n&lt;/td&gt;\n&lt;td style=&quot;border-style: none\; text-al
 ign: center\;&quot;&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;img src=&quot;https://even
 ts.vtools.ieee.org/vtools_ui/media/display/0eca0a22-75f0-458c-b7bc-51f328a
 c40f9&quot; width=&quot;312&quot; height=&quot;187&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;
 nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;/td&gt;\n&lt;/tr&gt;\n&lt;/tbody&gt;\n&lt;/table&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/
 p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;6:45pm - WebEx Waiting Room&lt;/p&gt;\n&lt;p&gt;&lt;strong
 &gt;7:00-8:00pm - Presentation&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;8:00-8:15pm - Questions&lt;/p&gt;
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