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DTSTART:20240310T030000
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DTSTAMP:20241019T210104Z
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DTSTART;TZID=America/New_York:20241016T200000
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DESCRIPTION:The number of connected devices is expected to reach 500 billio
 n by 2030\, which is 59-times larger than the expected world population. O
 bjects will become the dominant users of next-generation communications an
 d sensing at untethered\, wireline-like broadband performance\, bandwidths
 \, and throughputs. This sub-terahertz 6G communication and sensing will i
 ntegrate security and intelligence. It will enable a 10x to 100x increase 
 in peak data rates. FPGAs are well positioned to enable intelligent radios
  for 6G when coupled with high-performance chiplets incorporating RF circu
 its\, data converters\, and digital baseband circuits incorporating machin
 e learning and security. This talk presents use of 2.5D and 3D heterogeneo
 us integration of FPGAs with chiplets\, leveraging Intel’s EMIB/Foveros 
 technologies with focus on one emerging application driver: FPGA-based 6G 
 sub-THz intelligent wireless systems. Nano-\, micro-\, and macro-3D hetero
 geneous integration is summarized\, and previous research in 2.5D chiplet 
 integration with FPGAs is leveraged to forge a path towards new 3D-FPGA ba
 sed 6G platforms. Challenges in antenna\, packaging\, power delivery\, sys
 tem architecture design\, thermals\, and integrated design methodologies/t
 ools are briefly outlined. Opportunities to standardize die-to-die interfa
 ces for modular integration of internal and external circuit IPs are also 
 discussed.\n\nSpeaker(s): Dr Farhana Sheikh\, \n\nAgenda: \n8pm - 9pm EST 
 : DL and Q/A\n\nVirtual: https://events.vtools.ieee.org/m/420965
LOCATION:Virtual: https://events.vtools.ieee.org/m/420965
ORGANIZER:bshubha@ieee.org
SEQUENCE:11
SUMMARY:IEEE PCJS SSCS DL by Dr Farhana Sheikh : FPGA-Chiplet Architectures
  and Circuits for 2.5D/3D 6G Intelligent Radios
URL;VALUE=URI:https://events.vtools.ieee.org/m/420965
X-ALT-DESC:Description: <br /><p>The number of connected devices is expecte
 d to reach 500 billion by 2030\, which is 59-times larger than the expecte
 d world population. Objects will become the dominant users of next-generat
 ion communications and sensing at untethered\, wireline-like broadband per
 formance\, bandwidths\, and throughputs. This sub-terahertz 6G communicati
 on and sensing will integrate security and intelligence. It will enable a 
 10x to 100x increase in peak data rates. FPGAs are well positioned to enab
 le intelligent radios for 6G when coupled with high-performance chiplets i
 ncorporating RF circuits\, data converters\, and digital baseband circuits
  incorporating machine learning and security.&nbsp\; This talk presents us
 e of 2.5D and 3D heterogeneous integration of FPGAs with chiplets\, levera
 ging Intel&rsquo\;s EMIB/Foveros technologies with focus on one emerging a
 pplication driver: FPGA-based 6G sub-THz intelligent wireless systems.&nbs
 p\; Nano-\, micro-\, and macro-3D heterogeneous integration is summarized\
 , and previous research in 2.5D chiplet integration with FPGAs is leverage
 d to forge a path towards new 3D-FPGA based 6G platforms.&nbsp\; Challenge
 s in antenna\, packaging\, power delivery\, system architecture design\, t
 hermals\, and integrated design methodologies/tools are briefly outlined. 
 Opportunities to standardize die-to-die interfaces for modular integration
  of internal and external circuit IPs are also discussed.</p><br /><br />A
 genda: <br /><p>8pm - 9pm EST : DL and Q/A</p>
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