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DTSTAMP:20240620T220135Z
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DESCRIPTION:[]In the field of silicon photonics\, advanced packaging integr
 ation is key to achieving product performance. Flip chip attach of Silicon
  Photonics devices poses new challenges and limitations not encountered fo
 r flip chip attach and underfill of mainstream silicon devices. The first 
 challenge in 2.5D silicon photonics die integration is its susceptibility 
 to cracking during downstream reflow processing. The second challenge is t
 o keep the edge-coupling waveguide facet of the silicon photonics die unco
 ntaminated after all MCM assembly processes\, for optical coupling. The th
 ird challenge is the post-reflow flip chip standoff variation and the unde
 rfill coverage under the silicon photonics die that affect optical couplin
 g sensitivity between the edge-coupling waveguide and the planar lightwave
  circuit (PLC). We have successfully demonstrated flip chip attach of sili
 con photonics optical light engine (OLE) on an organic substrate using bot
 h thermocompression bonding and mass reflow processes with custom tooling 
 to achieve defect-free and uniform standoff bonding of Pb-free flip chip b
 umps. Various underfill control methods were explored to achieve maximum c
 overage and avoid underfill creeping onto the waveguide facet. Furthermore
 \, we achieved stable optical coupling post-stress testing. More investiga
 tion would be necessary to further improve coupling efficiency stability.\
 n\nSpeaker(s): Pushkraj Tumne\, \n\nVirtual: https://events.vtools.ieee.or
 g/m/421351
LOCATION:Virtual: https://events.vtools.ieee.org/m/421351
ORGANIZER:p.wesling@ieee.org
SEQUENCE:20
SUMMARY:2.5D Silicon Photonics Interposer Flip Chip Attach
URL;VALUE=URI:https://events.vtools.ieee.org/m/421351
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/9391efdf-e907-40d6-ab4e-90c5
 dc2cf8eb" alt="" width="500" height="250">In the field of silicon photonic
 s\, advanced packaging integration is key to achieving product performance
 . Flip chip attach of Silicon Photonics devices poses new challenges and l
 imitations not encountered for flip chip attach and underfill of mainstrea
 m silicon devices. The first challenge in 2.5D silicon photonics die integ
 ration is its susceptibility to cracking during downstream reflow processi
 ng. The second challenge is to keep the edge-coupling waveguide facet of t
 he silicon photonics die uncontaminated after all MCM assembly processes\,
  for optical coupling. The third challenge is the post-reflow flip chip st
 andoff variation and the underfill coverage under the silicon photonics di
 e that affect optical coupling sensitivity between the edge-coupling waveg
 uide and the planar lightwave circuit (PLC). We have successfully demonstr
 ated flip chip attach of silicon photonics optical light engine (OLE) on a
 n organic substrate using both thermocompression bonding and mass reflow p
 rocesses with custom tooling to achieve defect-free and uniform standoff b
 onding of Pb-free flip chip bumps. Various underfill control methods were 
 explored to achieve maximum coverage and avoid underfill creeping onto the
  waveguide facet. Furthermore\, we achieved stable optical coupling post-s
 tress testing. More investigation would be necessary to further improve co
 upling efficiency stability.</p>
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