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DTSTART:20240310T030000
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DTSTART:20241103T010000
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DTSTAMP:20240607T011421Z
UID:312C5AE2-F7CF-4E89-B569-579126E597AF
DTSTART;TZID=America/New_York:20240606T181500
DTEND;TZID=America/New_York:20240606T200000
DESCRIPTION:The Additive Manufacturing (AM) technology\, also known as 3D-p
 rinting technology\, offers several interesting and attractive features\, 
 including fast prototyping\, geometry flexibility\, easily customizable pr
 oducts\, and low cost (in some cases). However\, using such technologies f
 or microwave devices is not straightforward as AM has not been specificall
 y developed for microwave components\, and in most cases\, some adaptation
  and post-processing is necessary. Furthermore\, there are many AM technol
 ogies available\, and it is important to understand their characteristics 
 before selecting one.\n\nIn the presentation\, an overview of the differen
 t AM technologies available will be provided. Additionally\, an analysis o
 f some of the most common AM technologies used for the manufacturing of mi
 crowave components will be conducted in more detail\, with the help of sev
 eral examples. Several microwave components manufactured with some of the 
 most popular AM technologies will be shown\, along with a detailed descrip
 tion of the manufacturing process\, post-processing\, and all actions nece
 ssary to make the component perform well. Furthermore\, it will be shown h
 ow the flexibility of this technology allows the development of new classe
 s of components with non-conventional geometries that can be exploited to 
 obtain high-performing components in terms of compactness\, weight\, losse
 s\, etc.\n\n[]\n\nSpeaker(s): Cristiano Tomassoni\n\nAgenda: \n6:15 pm: We
 lcome\n\n6:30 to 7:30 pm: Presentation+ Q&amp;A.\n\nVirtual: https://events.vt
 ools.ieee.org/m/421740
LOCATION:Virtual: https://events.vtools.ieee.org/m/421740
ORGANIZER:simoussa@ieee.org
SEQUENCE:21
SUMMARY:Additive Manufacturing: emerging opportunities for microwave compon
 ents
URL;VALUE=URI:https://events.vtools.ieee.org/m/421740
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot; style=&quot;text-align: justi
 fy\;&quot;&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;text-align: justify\;&quot;&gt;&lt;spa
 n lang=&quot;EN-GB&quot; style=&quot;font-size: 10.0pt\; line-height: 107%\; mso-ansi-lan
 guage: EN-GB\;&quot;&gt;The Additive Manufacturing (AM) technology\, also known as
  3D-printing technology\, offers several interesting and attractive featur
 es\, including fast prototyping\, geometry flexibility\, easily customizab
 le products\, and low cost (in some cases). However\, using such technolog
 ies for microwave devices is not straightforward as AM has not been specif
 ically developed for microwave components\, and in most cases\, some adapt
 ation and post-processing is necessary. Furthermore\, there are many AM te
 chnologies available\, and it is important to understand their characteris
 tics before selecting one.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;text-al
 ign: justify\;&quot;&gt;&lt;span lang=&quot;EN-GB&quot; style=&quot;font-size: 10.0pt\; line-height:
  107%\; mso-ansi-language: EN-GB\;&quot;&gt;In the presentation\, an overview of t
 he different AM technologies available will be provided. Additionally\, an
  analysis of some of the most common AM technologies used for the manufact
 uring of microwave components will be conducted in more detail\, with the 
 help of several examples. Several microwave components manufactured with s
 ome of the most popular AM technologies will be shown\, along with a detai
 led description of the manufacturing process\, post-processing\, and all a
 ctions necessary to make the component perform well. Furthermore\, it will
  be shown how the flexibility of this technology allows the development of
  new classes of components with non-conventional geometries that can be ex
 ploited to obtain high-performing components in terms of compactness\, wei
 ght\, losses\, etc.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;text-align: ju
 stify\;&quot;&gt;&lt;span lang=&quot;EN-GB&quot; style=&quot;font-size: 10.0pt\; line-height: 107%\;
  mso-ansi-language: EN-GB\;&quot;&gt;&lt;img src=&quot;https://events.vtools.ieee.org/vtoo
 ls_ui/media/display/7e21319e-89fb-409d-b93c-2768da6eaae2&quot; alt=&quot;&quot; width=&quot;74
 5&quot; height=&quot;745&quot;&gt;&lt;/span&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;6:15 pm: Welcome&amp;n
 bsp\;&lt;/p&gt;\n&lt;p&gt;6:30 to 7:30 pm: Presentation+ Q&amp;amp\;A.&lt;/p&gt;
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