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DTSTAMP:20241010T162320Z
UID:8121D9D3-467A-44E2-993C-6530590015B6
DTSTART;TZID=America/New_York:20241009T173000
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DESCRIPTION:Abstract:\n\nAs device technologies evolve and continue to shri
 nk\, manufacturing methods are also being stressed\, which can impact yiel
 ds due to ESD performance. ESD test standards are continuing to evolve as 
 well to meet these changes. However as complex devices such as 3D packing 
 with 1000s of Die to Die interconnects become more widely used\, this is c
 hallenging the “standard” way ESD testing is performed.\n\nAnother poi
 nt of interest for system level testing\, is call for a Direct Pin Injecti
 on test method. Although the most widely used system level testing standar
 d\, IEC 61000-4-2 standard recommends not performing testing on pins of a 
 connector\, many manufacturers are being forced to perform this test. We
 ’ll discuss the Industry Councils on ESD Target Levels approaches to thi
 s testing requirement.\n\nZOOM RECORDING:\nhttps://us06web.zoom.us/rec/sha
 re/0SPZ2trsn2yQogr-ScnCrUoMCTMQsd_mAQDOVCpNZMX3-9nj9BrPmrusn1vCCNqT.MuqJkx
 ylGgVZdI_8\nPasscode: Qj@n56wS\n\nCo-sponsored by: ESDA NE Chapter\n\nSpea
 ker(s): Tom Meuse\n\nAgenda: \n5:30 PM Pizza\, salad\, soda\, and Networki
 ng\n\n6:00 PM Technical Presentation\n\n6:45 PM Questions and Answers\n\n7
 :00 PM Adjournment\n\nBldg: Main Cafeteria\, Lincoln Laboratory\, 244 Wood
  St\, Lexington\, Massachusetts\, United States\, 02421\, Virtual: https:/
 /events.vtools.ieee.org/m/427623
LOCATION:Bldg: Main Cafeteria\, Lincoln Laboratory\, 244 Wood St\, Lexingto
 n\, Massachusetts\, United States\, 02421\, Virtual: https://events.vtools
 .ieee.org/m/427623
ORGANIZER:james.yakura@ieee.org 
SEQUENCE:15
SUMMARY:Hybrid - Tom Meuse: ESD Device Level Testing Standards Review\, and
  Die to Die and Direct Pin Injection Testing Impacts
URL;VALUE=URI:https://events.vtools.ieee.org/m/427623
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;span style=&quot;font-family: &#39;Times New Roman
 &#39;\, serif\; font-size: 14pt\;&quot;&gt;&lt;strong&gt;Abstract:&lt;/strong&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;
 span style=&quot;font-family: &#39;Times New Roman&#39;\, serif\; font-size: 14pt\;&quot;&gt;As
  device technologies evolve and continue to shrink\, manufacturing methods
  are also being stressed\, which can impact yields due to ESD performance.
  ESD test standards are continuing to evolve as well to meet these changes
 . However as complex devices such as 3D packing with 1000s of Die to Die i
 nterconnects become more widely used\, this is challenging the &amp;ldquo\;sta
 ndard&amp;rdquo\; way ESD testing is performed. &lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;f
 ont-family: &#39;Times New Roman&#39;\, serif\; font-size: 14pt\;&quot;&gt;Another point o
 f interest for system level testing\, is call for a Direct Pin Injection t
 est method. Although the most widely used system level testing standard\, 
 IEC 61000-4-2 standard recommends not performing testing on pins of a conn
 ector\, many manufacturers are being forced to perform this test. We&amp;rsquo
 \;ll discuss the Industry Councils on ESD Target Levels approaches to this
  testing requirement.&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;font-fam
 ily: &#39;Times New Roman&#39;\, serif\; font-size: 14pt\;&quot;&gt;ZOOM RECORDING:&lt;/span&gt;
 &lt;/p&gt;\n&lt;div&gt;&lt;a href=&quot;https://us06web.zoom.us/rec/share/0SPZ2trsn2yQogr-ScnC
 rUoMCTMQsd_mAQDOVCpNZMX3-9nj9BrPmrusn1vCCNqT.MuqJkxylGgVZdI_8&quot; target=&quot;_bl
 ank&quot; rel=&quot;noopener&quot; data-saferedirecturl=&quot;https://www.google.com/url?q=htt
 ps://us06web.zoom.us/rec/share/0SPZ2trsn2yQogr-ScnCrUoMCTMQsd_mAQDOVCpNZMX
 3-9nj9BrPmrusn1vCCNqT.MuqJkxylGgVZdI_8&amp;amp\;source=gmail&amp;amp\;ust=17286183
 55780000&amp;amp\;usg=AOvVaw1usWriBP0lymFlANTYlUzJ&quot;&gt;https://us06web.zoom.us/re
 c/&lt;wbr&gt;share/0SPZ2trsn2yQogr-&lt;wbr&gt;ScnCrUoMCTMQsd_mAQDOVCpNZMX3-&lt;wbr&gt;9nj9Br
 Pmrusn1vCCNqT.&lt;wbr&gt;MuqJkxylGgVZdI_8&lt;/a&gt;&lt;/div&gt;\n&lt;div&gt;Passcode: Qj@n56wS&lt;/di
 v&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;5:30 PM&amp;nbsp\; &amp;nbsp\; &amp;nbsp\;&lt;/str
 ong&gt;Pizza\, salad\, soda\, and Networking&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;6:00&amp;nbsp\; PM&lt;/
 strong&gt;&amp;nbsp\; &amp;nbsp\;Technical Presentation&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;6:45 PM&lt;/stro
 ng&gt;&amp;nbsp\; &amp;nbsp\; Questions and Answers&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;7:00 PM&lt;/strong&gt;&amp;
 nbsp\; &amp;nbsp\; Adjournment&lt;/p&gt;
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