BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Pacific BEGIN:DAYLIGHT DTSTART:20170312T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20161106T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20161229T200235Z UID:AF8F8245-CDFD-11E6-A7C6-0050568D7F66 DTSTART;TZID=US/Pacific:20170118T173000 DTEND;TZID=US/Pacific:20170118T203000 DESCRIPTION:IEEE Spokane Section is proud to announce we will be hosting Te rry Klimchak\, who has over 30 years of experience in key applications eng ineering and consulting roles for ERICO products\, now a division of Penta ir Technical Solutions. Terry is joining us from the Cleveland area and wi ll be available for a 'meet and greet' just before his presentation.\n\n5: 30 - Event start\n\n6:00 - Dinner orders will be taken (meal purchase is n ot necessary to attend event\, but is at expense of attendee)\n\n6:15 - Sp eaker will begin\n\n7:30 – Exothermic demonstration (bring your coats\, it will be outside)\n\nAbstract: The purpose of this talk is to familiariz e participants with best practices in facility electrical protection as it pertains to grounding and equipotential bonding of substations. First\, w e will discuss Pentair’s approach to facility electrical protection util izing a six-point plan of protection that includes lightning protection\, grounding\, equipotential bonding\, and surge protection. We will then foc us our discussion on grounding and equipotential bonding by exploring fact ors affecting ground system resistance and products and installation proce dures to build longer lasting and more efficient grounding systems. As we further discuss bonding\, we will explore IEEE 837-2014 as further evidenc e of the superiority of an exothermic connection’s molecular bond and cu rrent carrying capacity over mechanical and compression/crimp connections. We will round out the discussion with global examples and troubleshooting recommendations for real world scenarios.\n\nSpeaker(s): Terry Klimchak\, \, Terry Klimchak\, \n\nRoom: Conference Room\, The Onion - Downtown Spok ane\, 302 W Riverside Ave\, Spokane\, Washington\, United States LOCATION:Room: Conference Room\, The Onion - Downtown Spokane\, 302 W River side Ave\, Spokane\, Washington\, United States ORGANIZER:asawyer@popu.org SEQUENCE:6 SUMMARY:Grounding and Bonding URL;VALUE=URI:https://events.vtools.ieee.org/m/42823 X-ALT-DESC:Description: <br /><p>IEEE Spokane Section is proud to announce we will be hosting Terry Klimchak\, who has over 30 years of experience in key applications engineering and consulting roles for ERICO products\, no w a division of Pentair Technical Solutions.&nbsp\;&nbsp\;Terry&nbsp\;is j oining us from the Cleveland area and will be available for a 'meet and gr eet' just before his presentation.&nbsp\;</p>\n<p>5:30 - Event&nbsp\;start </p>\n<p>6:00 - Dinner orders will be taken (meal purchase is not necessar y to attend event\, but is at expense of attendee)</p>\n<p>6:15 - Speaker will begin</p>\n<p>7:30 &ndash\; Exothermic demonstration (bring your coat s\, it will be outside)</p>\n<p><strong>Abstract: </strong>The purpose of this talk is to familiarize participants with best practices in facility e lectrical protection as it pertains to grounding and equipotential bonding of substations. First\, we will discuss Pentair&rsquo\;s approach to faci lity electrical protection utilizing a six-point plan of protection that i ncludes lightning protection\, grounding\, equipotential bonding\, and sur ge protection. We will then focus our discussion on grounding and equipote ntial bonding by exploring factors affecting ground system resistance and products and installation procedures to build longer lasting and more effi cient grounding systems. As we further discuss bonding\, we will explore I EEE 837-2014 as further evidence of the superiority of an exothermic conne ction&rsquo\;s molecular bond and current carrying capacity over mechanica l and compression/crimp connections. We will round out the discussion with global examples and troubleshooting recommendations for real world scenar ios.</p> END:VEVENT END:VCALENDAR