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DESCRIPTION:[]Advanced Packaging enables heterogeneous integration of chipl
 ets with die-embedding and die-stacking techniques\, and provides maximum 
 device performance with a much faster product development cycle. However\,
  as the 2.5D and 3D packages are getting more and more complicated\, it is
  very challenging to ramp the yield and assure the reliability of new prod
 ucts within this short timeline using conventional methods. Artificial Int
 elligence (AI)-assisted design co-optimization\, manufacturing process sim
 ulation and monitoring\, yield enhancement\, reliability assurance\, and f
 ailure mode prediction\, which were developed for Si fabrication\, could b
 e employed to shorten the advanced packaging development cycle. This prese
 ntation summarizes the current status for the various applications of simu
 lation and AI in advanced packaging. Further development trends are highli
 ghted with the goal of providing a holistic and robust virtual representat
 ion\, or digital twin\, for advanced packaging.\n\nSpeaker(s): Yan Li\, \n
 \nVirtual: https://events.vtools.ieee.org/m/429467
LOCATION:Virtual: https://events.vtools.ieee.org/m/429467
ORGANIZER:p.wesling@ieee.org
SEQUENCE:15
SUMMARY:The Application of Simulation and Artificial Intelligence in Advanc
 ed Packaging
URL;VALUE=URI:https://events.vtools.ieee.org/m/429467
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/9823041b-f9ed-4cf7-aaca-e711
 13f49327" alt="" width="500" height="250">Advanced Packaging enables heter
 ogeneous integration of chiplets with die-embedding and die-stacking techn
 iques\, and provides maximum device performance with a much faster product
  development cycle. However\, as the 2.5D and 3D packages are getting more
  and more complicated\, it is very challenging to ramp the yield and assur
 e the reliability of new products within this short timeline using convent
 ional methods. Artificial Intelligence (AI)-assisted design co-optimizatio
 n\, manufacturing process simulation and monitoring\, yield enhancement\, 
 reliability assurance\, and failure mode prediction\, which were developed
  for Si fabrication\, could be employed to shorten the advanced packaging 
 development cycle. This presentation summarizes the current status for the
  various applications of simulation and AI in advanced packaging. Further 
 development trends are highlighted with the goal of providing a holistic a
 nd robust virtual representation\, or digital twin\, for advanced packagin
 g.</p>
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