BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/New_York
BEGIN:DAYLIGHT
DTSTART:20240310T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:EDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20241103T010000
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:EST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20240906T145318Z
UID:4E2CB5E7-EF77-42E6-82C1-63D614529DEC
DTSTART;TZID=America/New_York:20240904T080000
DTEND;TZID=America/New_York:20240905T163000
DESCRIPTION:Binghamton University\, GE Global Research and IBM Research are
  proud to host the 34th Annual Electronics Packaging Symposium\n\n— Smal
 l Systems Integration. The program will include two days of exciting invit
 ed presentations with a focus on supply chain interconnectivity.\n\nWe inv
 ite you to join us for this event on Sept. 4-5\, 2024\, at the Binghamton 
 University ITC Complex. We look forward to seeing you in person.\n\nThe sy
 mposium brings together leaders in academia\, industry and government to n
 etwork and discuss the latest advances in the field of electronics packagi
 ng\, and to bring value from the varying viewpoints of each respective sec
 tor.\n\nThe program will also include keynote presentations and student po
 ster sessions. The goal of the symposium is to have those who attend walk 
 away with insight\, career-building opportunities\, and the knowledge of h
 aving been an integral member in the advancement of the electronics packag
 ing field.\n\nSession topics will include: future of computing for HPC/AI\
 , flexible\, additive and wearable electronics\, heterogeneous integration
 \, photonics packaging\, thermal challenges\, advanced substrates and powe
 r electronics.\n\nAlso planned are two special panels\, the first is a pan
 el to address workforce development challenges to support the CHIPS and Sc
 ience Act and the second panel to review the new NIST sponsored Heterogene
 ous Integration Roadmaps\, what each of the 4 roadmaps are\, where they ar
 e focused and how they will help NIST and the electronics packaging indust
 ry identify gaps to supporting future packages.\n\nSymposium agenda can be
  found at https://[ww](http://www.binghamton.edu/ieec/eps/agenda.html)[w](
 http://www.binghamton.edu/ieec/eps/agenda.html)[.bingham](http://www.bingh
 amton.edu/ieec/eps/agenda.html)[t](http://www.binghamton.edu/ieec/eps/agen
 da.html)[on](http://www.binghamton.edu/ieec/eps/agenda.html)[.](http://www
 .binghamton.edu/ieec/eps/agenda.html)[edu/ieec](http://www.binghamton.edu/
 ieec/eps/agenda.html)[/](http://www.binghamton.edu/ieec/eps/agenda.html)[e
 ps](http://www.binghamton.edu/ieec/eps/agenda.html)[/](http://www.binghamt
 on.edu/ieec/eps/agenda.html)[agenda.html](http://www.binghamton.edu/ieec/e
 ps/agenda.html)\n\nRegister at [https://bit.ly/3WsBF7X](https://www.eventb
 rite.com/e/35th-annual-electronics-packaging-symposium-small-systems-integ
 ration-tickets-881352728737?aff=oddtdtcreator)\n\nGeneral conference Infor
 mation including speaker info and exhibitor opportunities:\n\nhttps://www.
 binghamton.edu/ieec/eps/index.htm\n\nInformation on Travel and hotels may 
 be found here:\n\nhttps://www.binghamton.edu/ieec/eps/travel.html\n\nWe ho
 pe that you will join us in September.\n\nAgenda: \nhttps://www.binghamton
 .edu/ieec/eps/agenda.html\n\nRoom: Symposium Hall\, Bldg: Center of Excell
 ence\, Binghamton University State University of New York\, 85 Murray Hill
  Road\, Vestal\, New York\, United States\, 13850
LOCATION:Room: Symposium Hall\, Bldg: Center of Excellence\, Binghamton Uni
 versity State University of New York\, 85 Murray Hill Road\, Vestal\, New 
 York\, United States\, 13850
ORGANIZER:chanb@binghamton.edu
SEQUENCE:19
SUMMARY:GE/BU/IBM Electronics Packaging Symposium
URL;VALUE=URI:https://events.vtools.ieee.org/m/429825
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;Binghamton University\, GE Global Research
  and IBM Research are proud to host the &lt;strong&gt;34th&lt;/strong&gt;&lt;strong&gt; &lt;/st
 rong&gt;&lt;strong&gt;Annual&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;Elect&lt;/strong&gt;&lt;stron
 g&gt;r&lt;/strong&gt;&lt;strong&gt;onics&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;P&lt;/strong&gt;&lt;str
 ong&gt;ac&lt;/strong&gt;&lt;strong&gt;k&lt;/strong&gt;&lt;strong&gt;aging&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;
 strong&gt;S&lt;/strong&gt;&lt;strong&gt;ymposium&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;mdash\; Small Systems 
 Integration. The program will include two days of exciting invited present
 ations with a focus on supply chain interconnectivity.&lt;/p&gt;\n&lt;p&gt;We invite y
 ou to join us for this event on Sept. 4-5\, 2024\, at the Binghamton Unive
 rsity ITC Complex. We look forward to seeing you in person.&lt;/p&gt;\n&lt;p&gt;The sy
 mposium brings together leaders in academia\, industry and government to n
 etwork and discuss the latest advances in the field of electronics packagi
 ng\, and to bring value from the varying viewpoints of each respective sec
 tor.&lt;/p&gt;\n&lt;p&gt;The program will also include keynote presentations and stude
 nt poster sessions. The goal of the symposium is to have those who attend 
 walk away with insight\, career-building opportunities\, and the knowledge
  of having been an integral member in the advancement of the electronics p
 ackaging field.&lt;/p&gt;\n&lt;p&gt;Session topics will include: future of computing f
 or HPC/AI\, flexible\, additive and wearable electronics\, heterogeneous i
 ntegration\, photonics packaging\, thermal challenges\, advanced substrate
 s and power electronics.&lt;/p&gt;\n&lt;p&gt;Also planned are two special panels\, the
  first is a panel to address workforce development challenges to support t
 he CHIPS and Science Act and the second panel to review the new NIST spons
 ored Heterogeneous Integration Roadmaps\, what each of the 4 roadmaps are\
 , where they are focused and how they will help NIST and the electronics p
 ackaging industry identify gaps to supporting future packages.&lt;/p&gt;\n&lt;p&gt;&lt;st
 rong&gt;S&lt;/strong&gt;&lt;strong&gt;ymposium&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;agenda&lt;/
 strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;can&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;be&lt;
 /strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;strong&gt;f&lt;/strong&gt;&lt;strong&gt;ound&lt;/strong&gt;&lt;strong&gt; 
 &lt;/strong&gt;&lt;strong&gt;a&lt;/strong&gt;&lt;strong&gt;t https:&lt;/strong&gt;&lt;strong&gt;/&lt;/strong&gt;&lt;str
 ong&gt;/&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http://www.binghamton.edu/ieec/eps/agenda.h
 tml&quot;&gt;ww&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http://www.binghamton.edu/ieec/eps/ag
 enda.html&quot;&gt;w&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http://www.binghamton.edu/ieec/e
 ps/agenda.html&quot;&gt;.bingham&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http://www.binghamto
 n.edu/ieec/eps/agenda.html&quot;&gt;t&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http://www.bing
 hamton.edu/ieec/eps/agenda.html&quot;&gt;on&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http://ww
 w.binghamton.edu/ieec/eps/agenda.html&quot;&gt;.&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;a href=&quot;http
 ://www.binghamton.edu/ieec/eps/agenda.html&quot;&gt;edu/ieec&lt;/a&gt;&lt;/strong&gt;&lt;strong&gt;&lt;
 a href=&quot;http://www.binghamton.edu/ieec/eps/agenda.html&quot;&gt;/&lt;/a&gt;&lt;/strong&gt;&lt;str
 ong&gt;&lt;a href=&quot;http://www.binghamton.edu/ieec/eps/agenda.html&quot;&gt;eps&lt;/a&gt;&lt;/stro
 ng&gt;&lt;strong&gt;&lt;a href=&quot;http://www.binghamton.edu/ieec/eps/agenda.html&quot;&gt;/&lt;/a&gt;&lt;
 /strong&gt;&lt;strong&gt;&lt;a href=&quot;http://www.binghamton.edu/ieec/eps/agenda.html&quot;&gt;a
 genda.html&lt;/a&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;R&lt;/strong&gt;&lt;strong&gt;egi&lt;/strong&gt;&lt;str
 ong&gt;s&lt;/strong&gt;&lt;strong&gt;t&lt;/strong&gt;&lt;strong&gt;er&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;stro
 ng&gt;a&lt;/strong&gt;&lt;strong&gt;t&lt;/strong&gt;&lt;strong&gt; &lt;/strong&gt;&lt;a href=&quot;https://www.even
 tbrite.com/e/35th-annual-electronics-packaging-symposium-small-systems-int
 egration-tickets-881352728737?aff=oddtdtcreator&quot;&gt;&lt;strong&gt;https:&lt;/strong&gt;&lt;s
 trong&gt;/&lt;/strong&gt;&lt;strong&gt;/bit.l&lt;/strong&gt;&lt;strong&gt;y&lt;/strong&gt;&lt;strong&gt;/&lt;/strong
 &gt;&lt;strong&gt;3&lt;/strong&gt;&lt;strong&gt;W&lt;/strong&gt;&lt;strong&gt;sBF7X&lt;/strong&gt;&lt;/a&gt;&lt;/p&gt;\n&lt;p&gt;Ge
 neral conference Information including speaker info and exhibitor opportun
 ities:&lt;/p&gt;\n&lt;p&gt;&lt;a href=&quot;https://www.binghamton.edu/ieec/eps/index.htm&quot;&gt;htt
 ps://www.binghamton.edu/ieec/eps/index.htm&lt;/a&gt;&lt;/p&gt;\n&lt;p&gt;Information on Trav
 el and hotels may be found here:&lt;/p&gt;\n&lt;p&gt;&lt;a href=&quot;https://www.binghamton.e
 du/ieec/eps/travel.html&quot;&gt;https://www.binghamton.edu/ieec/eps/travel.html&lt;/
 a&gt;&lt;/p&gt;\n&lt;p&gt;We hope that you will join us in September.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agen
 da: &lt;br /&gt;&lt;p&gt;&lt;a title=&quot;2022 Electronics Packaging Symposium Program&quot; href=
 &quot;https://www.binghamton.edu/ieec/eps/agenda.html&quot;&gt;https://www.binghamton.e
 du/ieec/eps/agenda.html&lt;/a&gt;&lt;/p&gt;
END:VEVENT
END:VCALENDAR