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DTSTART:20250309T030000
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DTSTART:20241103T010000
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DTSTAMP:20241222T144526Z
UID:A6F27A48-982C-4749-B845-C83BD09DD8DB
DTSTART;TZID=America/Indiana/Indianapolis:20241107T080000
DTEND;TZID=America/Indiana/Indianapolis:20241108T180000
DESCRIPTION:[]\n\nWelcome to the fifth year of this IEEE Electronics Packag
 ing Society Symposium. This symposium will focus on quantified reliability
 \, accelerated testing and probabilistic assessments of the useful lifetim
 e of electronic\, photonic\, MEMS and MOEMS materials\, assemblies\, packa
 ges and systems in electronics and photonics packaging in the context of h
 eterogeneous integration. Get ready to dive deep into topics such as failu
 re modes\, mechanisms\, testing methodologies\, accelerated testing\, stre
 ss levels\, and environmental stresses.\n\nWe&#39;re thrilled to bring togethe
 r a dynamic community of electrical\, reliability\, materials\, mechanical
 \, and computer engineers\, alongside applied scientists\, to share and di
 scuss the latest breakthroughs in electronic and photonic packaging. This 
 symposium is your chance to explore the state-of-the-art in design-for-rel
 iability\, manufacturing\, reliability modeling\, and accelerated testing.
  Join us for a memorable journey into the forefront of technology and inno
 vation.\n\nPurdue University\, West Lafayette\, Indiana\, United States\, 
 47906\, Virtual: https://events.vtools.ieee.org/m/431114
LOCATION:Purdue University\, West Lafayette\, Indiana\, United States\, 479
 06\, Virtual: https://events.vtools.ieee.org/m/431114
ORGANIZER:wei427@purdue.edu
SEQUENCE:44
SUMMARY:2024 Symposium on Reliability for Electronics and Photonics Packagi
 ng
URL;VALUE=URI:https://events.vtools.ieee.org/m/431114
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/c7c509d8-8eb9-43dc-9e0b-f4d0
 b1cae02a&quot; alt=&quot;&quot; width=&quot;403&quot; height=&quot;232&quot;&gt;&lt;/p&gt;\n&lt;p&gt;Welcome to the fifth ye
 ar of this IEEE Electronics Packaging Society Symposium. This symposium wi
 ll focus on quantified reliability\, accelerated testing and probabilistic
  assessments of the useful lifetime of electronic\, photonic\, MEMS and MO
 EMS materials\, assemblies\, packages and systems in electronics and photo
 nics packaging in the context of heterogeneous integration. Get ready to d
 ive deep into topics such as failure modes\, mechanisms\, testing methodol
 ogies\, accelerated testing\, stress levels\, and environmental stresses.&lt;
 /p&gt;\n&lt;p&gt;We&#39;re thrilled to bring together a dynamic community of electrical
 \, reliability\, materials\, mechanical\, and computer engineers\, alongsi
 de applied scientists\, to share and discuss the latest breakthroughs in e
 lectronic and photonic packaging. This symposium is your chance to explore
  the state-of-the-art in design-for-reliability\, manufacturing\, reliabil
 ity modeling\, and accelerated testing. Join us for a memorable journey in
 to the forefront of technology and innovation.&lt;/p&gt;
END:VEVENT
END:VCALENDAR