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DTSTART:20240310T030000
TZOFFSETFROM:-0500
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DTSTART:20241103T010000
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TZNAME:EST
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DTSTAMP:20241024T180313Z
UID:ACA8CBF3-D8BC-4C22-BE86-DB56D1D7B564
DTSTART;TZID=America/New_York:20241024T120000
DTEND;TZID=America/New_York:20241024T133000
DESCRIPTION:A major hurdle in developing next-generation systems for high-p
 erformance applications and industries that require handling large\, secur
 e data - such as System-in-Package (SiP) and System-on-Chip (SoC) - is the
  absence of low-latency\, high-bandwidth\, and high-density off-chip/chipl
 et/core interconnects. Achieving high-bandwidth chip-to-chip (or chiplet-t
 o-chiplet) communication using electrical interconnects faces challenges l
 ike high substrate dielectric losses\, reflections\, impedance discontinui
 ties\, and susceptibility to crosstalk. This underscores the motivation to
  adopt photonics to address these challenges and enable low-latency\, high
 -bandwidth communication. The objective is to develop a CMOS-compatible te
 chnology to support the next-generation photonic layer within 3D SiP/SoC\,
  moving towards converged microsystems.\n\nCo-sponsored by: Habib Hichiri\
 n\nSpeaker(s): Tolga Tekin\, \n\nVirtual: https://events.vtools.ieee.org/m
 /433297
LOCATION:Virtual: https://events.vtools.ieee.org/m/433297
ORGANIZER:chanb@binghamton.edu
SEQUENCE:28
SUMMARY:Photonics Systems for High Performance – CPO\, Towards Photonics 
 Chiplets
URL;VALUE=URI:https://events.vtools.ieee.org/m/433297
X-ALT-DESC:Description: <br /><p class="MsoNormal" style="text-align: justi
 fy\;">A major hurdle in developing next-generation systems for high-perfor
 mance applications and industries that require handling large\, secure dat
 a - such as System-in-Package (SiP) and System-on-Chip (SoC) - is the abse
 nce of low-latency\, high-bandwidth\, and high-density off-chip/chiplet/co
 re interconnects. Achieving high-bandwidth chip-to-chip (or chiplet-to-chi
 plet) communication using electrical interconnects faces challenges like h
 igh substrate dielectric losses\, reflections\, impedance discontinuities\
 , and susceptibility to crosstalk. This underscores the motivation to adop
 t photonics to address these challenges and enable low-latency\, high-band
 width communication. The objective is to develop a CMOS-compatible technol
 ogy to support the next-generation photonic layer within 3D SiP/SoC\, movi
 ng towards converged microsystems.</p>
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