BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20250309T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:PDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20241103T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:PST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20241115T231406Z
UID:2162DB48-4E5D-418F-B821-95BD13CA1674
DTSTART;TZID=America/Los_Angeles:20241114T163000
DTEND;TZID=America/Los_Angeles:20241114T190000
DESCRIPTION:[]\n\nThe IEEE EPS (SCV\, SF\, OEB) is excited to be hosting a 
 &#39;Meet &amp; Greet&#39; (an in-person event in Milpitas\, CA) for those in the fiel
 ds of semiconductor packaging. This is a unique opportunity for the packag
 ing professionals in the Valley to find out more about our committees\, he
 ar about upcoming events (online and in-person)\, connect and network with
  local experts in materials\, advanced packaging\, production\, and reliab
 ility.\nThe organizers also plan to have quickfire presentations/discussio
 ns on some of the enabling technologies that have helped and will continue
  to spur the evolution of AI around us. The topics for discussion include 
 Heterogeneous Integration\, Hybrid Bonding\, Build-Up Substrates and Quant
 um Computing. We&#39;ll also touch on some aspects of IEEE Membership\, its be
 nefits\, opportunities for Member Elevation\, and guidance if one were int
 erested to pursue becoming a Senior Member.\nFood and drinks will be serve
 d -- come enjoy this time together!\n\nSEMI World Headquarters\, 673 South
  Milpitas Blvd\, Milpitas\, California\, United States\, 95035
LOCATION:SEMI World Headquarters\, 673 South Milpitas Blvd\, Milpitas\, Cal
 ifornia\, United States\, 95035
ORGANIZER:p.wesling@ieee.org
SEQUENCE:24
SUMMARY:EPS Chapter Meet-and-Greet
URL;VALUE=URI:https://events.vtools.ieee.org/m/436260
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/ffb2bdf9-84d9-403e-8449-796f
 eecfacc7&quot; alt=&quot;&quot; width=&quot;274&quot; height=&quot;401&quot;&gt;&lt;/p&gt;\n&lt;p&gt;The IEEE EPS (SCV\, SF\
 , OEB) is excited to be hosting a &#39;&lt;strong&gt;Meet &amp;amp\; Greet&lt;/strong&gt;&#39; (an
  in-person event in Milpitas\, CA) for those in the fields of semiconducto
 r packaging. This is a unique opportunity for the packaging professionals 
 in the Valley to find out more about our committees\, hear about upcoming 
 events (online and in-person)\, connect and network with local experts in 
 materials\, advanced packaging\, production\, and reliability.&lt;br&gt;The orga
 nizers also plan to have quickfire presentations/discussions on some of th
 e enabling technologies that have helped and will continue to spur the evo
 lution of AI around us. The topics for discussion include Heterogeneous In
 tegration\, Hybrid Bonding\, Build-Up Substrates and Quantum Computing.&amp;nb
 sp\; We&#39;ll also touch on some aspects of IEEE Membership\, its benefits\, 
 opportunities for Member Elevation\, and guidance if one were interested t
 o pursue becoming a Senior Member.&lt;br&gt;&lt;strong&gt;Food and drinks &lt;/strong&gt;wil
 l be served -- come enjoy this time together!&lt;/p&gt;
END:VEVENT
END:VCALENDAR