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DESCRIPTION:Beyond Moore: 3D Memory\, 3D Packaging\n\nDavid Bondurant\, Ret
 ired PE\, President of Vertical Memory\n\n“If we make them smaller\, we 
 can make them faster” has been the approach to building faster computers
  over the last 70-years starting with the first transistors and continuing
  as we built increasingly more complex integrated circuits. This was known
  as “Moore’s Law”. Recently\, our technology is no longer achieving 
 higher densities as we scale to smaller features sizes first with NAND Fla
 sh and now with SRAM and DRAM. New techniques known as Beyond Moore are re
 quire to continue to build faster and more complex computers. I review the
  emergence of 3D memory and 3D packaging as today’s approach to building
  the fastest Supercomputers and AI Processors.\n\nLunch will be provided b
 y the Pikes Peak LMAG\n\nSpeaker(s): David Bondurant\, \n\nAgenda: \nLunch
 \n\nPresentation\n\nRoom: Tom Saponas Lounge (2nd Floor)\, Bldg: Engineeri
 ng Building\, 1420 Austin Bluffs Pkwy\, Co\, Colorado\, United States\, 80
 918
LOCATION:Room: Tom Saponas Lounge (2nd Floor)\, Bldg: Engineering Building\
 , 1420 Austin Bluffs Pkwy\, Co\, Colorado\, United States\, 80918
ORGANIZER:tkalkur@uccs.edu
SEQUENCE:28
SUMMARY:Joint Pikes Peak Electronic Devices/Circuits and Systems and Life M
 ember Affinity Group Meeting
URL;VALUE=URI:https://events.vtools.ieee.org/m/436515
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;Beyond Moore: 3D Memory\, 3D Packa
 ging&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;David Bondurant\, Retired PE\, President of 
 Vertical Memory&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;ldquo\;If we make them smaller\,
  we can make them faster&amp;rdquo\;&lt;/strong&gt; has been the approach to buildin
 g faster computers over the last 70-years starting with the first transist
 ors and continuing as we built increasingly more complex integrated circui
 ts.&lt;span class=&quot;Apple-converted-space&quot;&gt;&amp;nbsp\; &lt;/span&gt;This was known as &lt;s
 trong&gt;&amp;ldquo\;Moore&amp;rsquo\;s Law&amp;rdquo\;&lt;/strong&gt;.&lt;span class=&quot;Apple-conve
 rted-space&quot;&gt;&amp;nbsp\; &lt;/span&gt;Recently\, our technology is no longer achievin
 g higher densities as we scale to smaller features sizes first with NAND F
 lash and now with SRAM and DRAM.&lt;span class=&quot;Apple-converted-space&quot;&gt;&amp;nbsp\
 ; &lt;/span&gt;New techniques known as &lt;strong&gt;Beyond Moore&lt;/strong&gt; are require
  to continue to build faster and more complex computers.&lt;span class=&quot;Apple
 -converted-space&quot;&gt;&amp;nbsp\; &lt;/span&gt;I review the emergence of 3D memory and 3
 D packaging as today&amp;rsquo\;s approach to building the fastest Supercomput
 ers and AI Processors.&lt;/p&gt;\n&lt;p&gt;Lunch will be provided by the Pikes Peak LM
 AG&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;Lunch&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;Presentation&lt;/p&gt;
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