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TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
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DTSTART:20241103T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
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END:STANDARD
END:VTIMEZONE
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DTSTAMP:20250119T184407Z
UID:E09D7188-A000-4D8E-9C4C-59B91EA5032D
DTSTART;TZID=America/Los_Angeles:20250116T080000
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DESCRIPTION:[]Hybrid Bonding has emerged as the technology of choice in the
  semiconductor industry for ultra-fine-pitch interconnection. With signifi
 cant benefits for interconnect density and device performance\, it will be
 come widely adopted for a broad range of high-performance semiconductor de
 vices in the years to come. The success of Hybrid Bonding technology for h
 igh-volume manufacturing depends critically on the process technology as w
 ell as materials and equipment. Design\, performance characterization\, th
 ermal management and reliability are also important considerations to enab
 le applications in various areas.\n\nJoin us to learn about this expanding
  field\, and discover how it will affect heterogeneous integration and sys
 tem design.\n\nSEMI World Headquarters\, 673 South Milpitas Blvd\, Milpita
 s\, California\, United States\, Virtual: https://events.vtools.ieee.org/m
 /436711
LOCATION:SEMI World Headquarters\, 673 South Milpitas Blvd\, Milpitas\, Cal
 ifornia\, United States\, Virtual: https://events.vtools.ieee.org/m/436711
ORGANIZER:p.wesling@ieee.org
SEQUENCE:73
SUMMARY:IEEE/EPS Hybrid Bonding Symposium
URL;VALUE=URI:https://events.vtools.ieee.org/m/436711
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/a2a83423-46d6-492b-954d-be61
 462d5cf8&quot; alt=&quot;&quot; width=&quot;348&quot; height=&quot;269&quot;&gt;&lt;strong&gt;Hybrid Bonding&lt;/strong&gt; 
 has emerged as the technology of choice in the semiconductor industry for 
 ultra-fine-pitch interconnection. With significant benefits for interconne
 ct density and device performance\, it will become widely adopted for a br
 oad range of high-performance semiconductor devices in the years to come. 
 The success of Hybrid Bonding technology for high-volume manufacturing dep
 ends critically on the process technology as well as materials and equipme
 nt. Design\, performance characterization\, thermal management and reliabi
 lity are also important considerations to enable applications in various a
 reas.&lt;/p&gt;\n&lt;p&gt;Join us to learn about this expanding field\, and discover h
 ow it will affect heterogeneous integration and system design.&lt;/p&gt;
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