BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Phoenix BEGIN:STANDARD DTSTART:19671029T010000 TZOFFSETFROM:-0600 TZOFFSETTO:-0700 TZNAME:MST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20241115T112322Z UID:E8A483BF-FC99-4909-A1C1-16E647D7810C DTSTART;TZID=America/Phoenix:20241107T173000 DTEND;TZID=America/Phoenix:20241107T193000 DESCRIPTION:Abstract: As electronic products become more pervasive in appli cations\, interconnect reliability must be considered holistically with re gard to environmental conditions\, from thermomechanical to electrical and electrochemical. Thermal dissipation is another great concern as the powe r density increases. Understanding the failure mechanisms for different in terconnect materials at various levels (wafer\, chip\, package\, and syste m) of the semiconductor package is of great importance to interconnect rel iability and device performance.\n\nAt the same time\, as newer forms of i nterconnects emerge in advanced packaging to meet the demand for high dens ity and high performance\, interconnect reliability is becoming more compl ex and more critical. The growing adoption of heterogeneous integration le ads to increased diversity of interconnects in the same package\, with com plex reliability failure modes and mechanisms.\n\nIn this presentation\, t he technology trends for advanced packaging will be outlined\, and the gro wing demand for new materials for high density interconnects will be discu ssed. Process robustness\, reliability and product performance are some of the important considerations for innovative materials solutions for advan ced packaging and heterogeneous integration. Thermal management solutions will also be discussed.\n\n[]\nBiography: Dr. Dongkai Shangguan\, IEEE Fel low\, is Strategic Advisor to Indium Corporation\, and President of Therma l Engineering Associates\, Inc. Previously\, he served as Corporate Vice P resident at Flex (formerly Flextronics) for Technology & Engineering\, and as Chief Marketing Officer at STATSChipPAC. Early in his career\, he held various technical and management responsibilities at Ford Electronics and Visteon.\n\nDr. Shangguan has published 3 books\, including the recent bo ok “Direct Copper Interconnection for Advanced Semiconductor Technology ”. He has also authored/co-authored over 200 technical papers\, and has been issued 33 U.S. patents.\n\nDr. Shangguan has served on the iNEMI Boar d of Directors\, the IEEE EPS Board of Governors\, and the IPC Board of Di rectors. He is an IEEE EPS Distinguished Lecturer. He has previously recei ved a number of recognitions for his contributions to the industry\, inclu ding the Daniel C. Hughes\, Jr. Memorial Award and the William D. Ashman A chievement Award from IMAPS\, the Electronics Manufacturing Technology Awa rd and the Outstanding Sustained Technical Contribution Award from IEEE EP S\, the President’s Award from IPC\, and the Total Excellence in Electro nics Manufacturing Award from the Society of Manufacturing Engineers.\n\nD r. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsin ghua University\, China\, MBA degree from San Jose State University\, and Ph.D. in Materials from the University of Oxford\, U.K. He conducted post- doctoral research at the University of Cambridge and The University of Ala bama.\n\nDongkai currently lives in San Jose\, CA\, and travels globally i n service of the industry.\n\nLocation: Macro Technology Works Building Co nference Room 3654 ([Google Maps](https://maps.app.goo.gl/8pmm79TXL5teH3Ux 7))\n\nAgenda:\nRefreshments: 5:30-6:00pm\nSeminar Talk: 6:00-7:00pm\nMTW Tour: 7:00-7:30pm\n\nRoom: Conference Room 3654\, Bldg: Macro Technology W orks Building\, 7700 S River Pkwy\, Tempe\, Arizona\, United States\, 8528 4 LOCATION:Room: Conference Room 3654\, Bldg: Macro Technology Works Building \, 7700 S River Pkwy\, Tempe\, Arizona\, United States\, 85284 ORGANIZER:Christopher.J.Bailey@asu.edu SEQUENCE:21 SUMMARY:2024 IEEE EPS Phoenix Section Seminar: Materials and Reliability fo r Advanced Packaging and Heterogeneous Integration by Dr. Dongkai Shanggua n URL;VALUE=URI:https://events.vtools.ieee.org/m/438269 X-ALT-DESC:Description: <br /><p><strong>Abstract:</strong> As electronic p roducts become more pervasive in applications\, interconnect reliability m ust be considered holistically with regard to environmental conditions\, f rom thermomechanical to electrical and electrochemical. Thermal dissipatio n is another great concern as the power density increases. Understanding t he failure mechanisms for different interconnect materials at various leve ls (wafer\, chip\, package\, and system) of the semiconductor package is o f great importance to interconnect reliability and device performance.</p> \n<p>At the same time\, as newer forms of interconnects emerge in advanced packaging to meet the demand for high density and high performance\, inte rconnect reliability is becoming more complex and more critical. The growi ng adoption of heterogeneous integration leads to increased diversity of i nterconnects in the same package\, with complex reliability failure modes and mechanisms.</p>\n<p>In this presentation\, the technology trends for a dvanced packaging will be outlined\, and the growing demand for new materi als for high density interconnects will be discussed. Process robustness\, reliability and product performance are some of the important considerati ons for innovative materials solutions for advanced packaging and heteroge neous integration. Thermal management solutions will also be discussed.</p >\n<p><strong><img class="alignnone size-full wp-image-612" src="https://r 6.ieee.org/phoenix-eps/wp-content/uploads/sites/164/Dongkai.jpg" alt="" wi dth="146" height="177"><br>Biography:</strong> Dr. Dongkai Shangguan\, IEE E Fellow\, is Strategic Advisor to Indium Corporation\, and President of T hermal Engineering Associates\, Inc. Previously\, he served as Corporate V ice President at Flex (formerly Flextronics) for Technology &amp\; Enginee ring\, and as Chief Marketing Officer at STATSChipPAC. Early in his career \, he held various technical and management responsibilities at Ford Elect ronics and Visteon.</p>\n<p>Dr. Shangguan has published 3 books\, includin g the recent book &ldquo\;Direct Copper Interconnection for Advanced Semic onductor Technology&rdquo\;. He has also authored/co-authored over 200 tec hnical papers\, and has been issued 33 U.S. patents.</p>\n<p>Dr. Shangguan has served on the iNEMI Board of Directors\, the IEEE EPS Board of Govern ors\, and the IPC Board of Directors. He is an IEEE EPS Distinguished Lect urer. He has previously received a number of recognitions for his contribu tions to the industry\, including the Daniel C. Hughes\, Jr. Memorial Awar d and the William D. Ashman Achievement Award from IMAPS\, the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Co ntribution Award from IEEE EPS\, the President&rsquo\;s Award from IPC\, a nd the Total Excellence in Electronics Manufacturing Award from the Societ y of Manufacturing Engineers.</p>\n<p>Dr. Shangguan received his B.Sc. deg ree in Mechanical Engineering from Tsinghua University\, China\, MBA degre e from San Jose State University\, and Ph.D. in Materials from the Univers ity of Oxford\, U.K. He conducted post-doctoral research at the University of Cambridge and The University of Alabama.</p>\n<p>Dongkai currently liv es in San Jose\, CA\, and travels globally in service of the industry.</p> \n<p><strong>Location:</strong> Macro Technology Works Building Conference Room 3654 (<a href="https://maps.app.goo.gl/8pmm79TXL5teH3Ux7">Google Map s</a>)</p>\n<p><strong>Agenda:<br></strong>Refreshments: 5:30-6:00pm<br>Se minar Talk: 6:00-7:00pm<br>MTW Tour: 7:00-7:30pm</p> END:VEVENT END:VCALENDAR