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DTSTART:20170312T030000
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DTSTAMP:20170313T184801Z
UID:2F0A037D-081C-11E7-A7C6-0050568D7F66
DTSTART;TZID=US/Eastern:20170517T173000
DTEND;TZID=US/Eastern:20170517T200000
DESCRIPTION:For years semiconductor manufacturers have used gold wire to co
 nnect the semiconductor die to the lead frames and external pins. However\
 , rising gold prices are driving manufacturers towards less expensive alte
 rnative materials such as copper for use in high volume commercial plastic
  package devices. Military standards such as MIL-STD-883 do not define req
 uirements for copper bond wire and therefore manufacturers are using quali
 fication and process monitoring developed for gold wire to qualify the cop
 per bond wire technology. Although copper bond wire designs are moving for
 ward for commercial applications\, there are concerns with quality and rel
 iability for use of copper bond wire in high reliability military electron
 ics with long mission life.\n\nThis presentation will review findings from
  the destructive physical analysis (DPA) testing performed on a number of 
 standard commercial plastic encapsulated microcircuits (PEMs). We will foc
 us on the die ball bond and lead frame crescent bond metallurgical structu
 res\, mechanical bond strength\, wire composition\, and manufacturing bond
 ing process workmanship & overall quality.\n\nBased on the DPA findings\, 
 potential risks will be defined along with recommendations to the qualific
 ation program of PEMs with copper bond wire for use in harsh environments 
 and long term high reliability military programs.\n\nSpeaker(s): Aaron Lec
 omte\, \, Aaron Lecomte\, \n\nAgenda: \n5:30-6:00 Sign In\, Networking\, L
 ight Dinner & Refreshments\n6:00-6:10 Chapter Chair Greetings & Announceme
 nts\n6:10-8:00 Aaron Lacomte\, Raytheon Integrated Defense Systems\n8:00-8
 :15 Q&A session\, meeting adjourns\n\nMACOM Hale Street Bldg\, 121 Hale St
 \, Lowell \, Massachusetts\, United States
LOCATION:MACOM Hale Street Bldg\, 121 Hale St\, Lowell \, Massachusetts\, U
 nited States
ORGANIZER:charles.recchia@ieee.org
SEQUENCE:4
SUMMARY:Assessment of Copper Bond Wire for Use in Long Term Military Applic
 ations
URL;VALUE=URI:https://events.vtools.ieee.org/m/44455
X-ALT-DESC:Description: <br /><p><span style="font-size: 12pt\;">For years 
 semiconductor manufacturers have used gold wire to connect the semiconduct
 or die to the lead frames and external pins. However\, rising gold prices 
 are driving manufacturers towards less expensive alternative materials suc
 h as copper for use in high volume commercial plastic package devices. Mil
 itary standards such as MIL-STD-883 do not define requirements for copper 
 bond wire and therefore manufacturers are using qualification and process 
 monitoring developed for gold wire to qualify the copper bond wire technol
 ogy. Although copper bond wire designs are moving forward for commercial a
 pplications\, there are concerns with quality and reliability for use of c
 opper bond wire in high reliability military electronics with long mission
  life.</span></p>\n<p><span style="font-size: 12pt\;">This presentation wi
 ll review findings from the destructive physical analysis (DPA) testing pe
 rformed on a number of standard commercial plastic encapsulated microcircu
 its (PEMs). We will focus on the die ball bond and lead frame crescent bon
 d metallurgical structures\, mechanical bond strength\, wire composition\,
  and manufacturing bonding process workmanship &amp\; overall quality.</sp
 an></p>\n<p><span style="font-size: 12pt\;">Based on the DPA findings\, po
 tential risks will be defined along with recommendations to the qualificat
 ion program of PEMs with copper bond wire for use in harsh environments an
 d long term high reliability military programs.</span></p><br /><br />Agen
 da: <br /><p><span style="font-size: 12pt\;">5:30-6:00 Sign In\, Networkin
 g\, Light Dinner &amp\; Refreshments</span><br /><span style="font-size: 1
 2pt\;">6:00-6:10 Chapter Chair Greetings &amp\; Announcements</span><br />
 <span style="font-size: 12pt\;">6:10-8:00 Aaron Lacomte\, Raytheon Integra
 ted Defense Systems</span><br /><span style="font-size: 12pt\;">8:00-8:15 
 Q&amp\;A session\, meeting adjourns</span></p>
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