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UID:F7497067-8EB9-456B-AE68-D04AB77C3C91
DTSTART;TZID=America/New_York:20241119T120000
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DESCRIPTION:Abstract\n\nRu is a candidate to replace Cu in the lower metal 
 layers of future scaled BEOL interconnects. Because Ru is compatible with 
 the direct metal etch integration approach\, putting air (further referred
  to as air gap or AG) between metal lines could become the preferred appro
 ach to isolate adjacent metal lines. Although such advanced Ru-AG nano-int
 erconnect schemes are awesome from a performance point-of-view\, their rel
 iability is challenged. In this presentation\, the main reliability challe
 nges for advanced Ru-AG BEOL systems will be discussed and future reliabil
 ity research opportunities will be proposed.\n\nFirst\, metal-reliability 
 challenges will be addressed\, where it will be argued that the determinat
 ion of Jmax-values is difficult because very high currents are needed to m
 ake the lines fail and thus Joule heating needs to be properly considered.
  Also\, the fact that Ru is a p-type metal makes data interpretation and f
 ailure analysis challenging (but interesting).\n\nSecond\, TDDB is discuss
 ed. Although lifetime predictions using standard TDDB tests look good\, th
 e non-existence of a consensus about a) the TDDB lifetime model\, b) the c
 onduction mechanism and the related conduction paths and c) the preferred 
 failure locations\, are worrisome and will require significant research ef
 forts.\n\nFinally\, experimental and modelling work related to potential m
 echanical issues with the Ru-AG system will be discussed. Where the mechan
 ically weaker places and their mitigation approaches are more-or-less know
 n for Cu-low-k systems\, the integration and design knobs to mitigate pote
 ntial CPI-issues in such systems require future research attention.\n\n[]\
 n\nSpeaker(s): Dr. Kristof Croes\, \n\nVirtual: https://events.vtools.ieee
 .org/m/445265
LOCATION:Virtual: https://events.vtools.ieee.org/m/445265
ORGANIZER:manohar.bongarala@nokia-bell-labs.com
SEQUENCE:3
SUMMARY:Reliability challenges for advanced Ru-AG BEOL systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/445265
X-ALT-DESC:Description: <br /><p><strong>Abstract</strong></p>\n<p>Ru is a 
 candidate to replace Cu in the lower metal layers of future scaled BEOL in
 terconnects. Because Ru is compatible with the direct metal etch integrati
 on approach\, putting air (further referred to as air gap or AG) between m
 etal lines could become the preferred approach to isolate adjacent metal l
 ines. Although such advanced Ru-AG nano-interconnect schemes are awesome f
 rom a performance point-of-view\, their reliability is challenged. In this
  presentation\, the main reliability challenges for advanced Ru-AG BEOL sy
 stems will be discussed and future reliability research opportunities will
  be proposed.</p>\n<p>First\, metal-reliability challenges will be address
 ed\, where it will be argued that the determination of Jmax-values is diff
 icult because very high currents are needed to make the lines fail and thu
 s Joule heating needs to be properly considered. Also\, the fact that Ru i
 s a p-type metal makes data interpretation and failure analysis challengin
 g (but interesting).</p>\n<p>Second\, TDDB is discussed. Although lifetime
  predictions using standard TDDB tests look good\, the non-existence of a 
 consensus about a) the TDDB lifetime model\, b) the conduction mechanism a
 nd the related conduction paths and c) the preferred failure locations\, a
 re worrisome and will require significant research efforts.</p>\n<p>Finall
 y\, experimental and modelling work related to potential mechanical issues
  with the Ru-AG system will be discussed. Where the mechanically weaker pl
 aces and their mitigation approaches are more-or-less known for Cu-low-k s
 ystems\, the integration and design knobs to mitigate potential CPI-issues
  in such systems require future research attention.</p>\n<p><img src="http
 s://events.vtools.ieee.org/vtools_ui/media/display/a88f35e8-29b2-4306-8b2a
 -eac4eed33c24" alt="" width="500" height="250"></p>
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