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DTSTART:20250309T030000
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DTSTART:20241103T010000
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DTSTAMP:20260116T165712Z
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DTSTART;TZID=America/Denver:20250107T180000
DTEND;TZID=America/Denver:20250107T200000
DESCRIPTION:“If we make them smaller\, we can make them faster” has bee
 n the approach to building faster computers over the last 70-years startin
 g with the first transistors and continuing as we built increasingly more 
 complex integrated circuits. This was known as “Moore’s Law”. Recent
 ly\, our technology is no longer achieving higher densities as we scale to
  smaller features sizes first with NAND Flash and now with SRAM and DRAM. 
 New techniques known as Beyond Moore are required to continue to build fas
 ter and more complex computers. David Bondurant reviews the emergence of 3
 D memory and 3D packaging as today’s approach to building the fastest Su
 percomputers and AI Processors.\n\nVirtual: https://events.vtools.ieee.org
 /m/455111
LOCATION:Virtual: https://events.vtools.ieee.org/m/455111
ORGANIZER:s.mehalingam.us@ieee.org
SEQUENCE:36
SUMMARY:Beyond Moore: 3D Memory\, 3D Packaging
URL;VALUE=URI:https://events.vtools.ieee.org/m/455111
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot; style=&quot;border: none\; ms
 o-padding-alt: 31.0pt 31.0pt 31.0pt 31.0pt\; mso-border-shadow: yes\;&quot;&gt;&lt;sp
 an style=&quot;font-size: 11.0pt\; font-family: &#39;Helvetica Neue&#39;\; mso-fareast-
 font-family: &#39;Helvetica Neue&#39;\; mso-bidi-font-family: &#39;Helvetica Neue&#39;\; c
 olor: #242424\; background: white\; mso-highlight: white\;&quot;&gt;&amp;ldquo\;If we 
 make them smaller\, we can make them faster&amp;rdquo\; has been the approach 
 to building faster computers over the last 70-years starting with the firs
 t transistors and continuing as we built increasingly more complex integra
 ted circuits.&lt;span style=&quot;mso-spacerun: yes\;&quot;&gt;&amp;nbsp\; &lt;/span&gt;This was kno
 wn as &amp;ldquo\;Moore&amp;rsquo\;s Law&amp;rdquo\;.&lt;span style=&quot;mso-spacerun: yes\;&quot;
 &gt;&amp;nbsp\; &lt;/span&gt;Recently\, our technology is no longer achieving higher de
 nsities as we scale to smaller features sizes first with NAND Flash and no
 w with SRAM and DRAM.&lt;span style=&quot;mso-spacerun: yes\;&quot;&gt;&amp;nbsp\; &lt;/span&gt;New 
 techniques known as Beyond Moore are required to continue to build faster 
 and more complex computers.&lt;span style=&quot;mso-spacerun: yes\;&quot;&gt; &amp;nbsp\;&lt;span
  style=&quot;font-size: 11.0pt\; font-family: &#39;Helvetica Neue&#39;\; mso-fareast-fo
 nt-family: &#39;Helvetica Neue&#39;\; mso-bidi-font-family: &#39;Helvetica Neue&#39;\; col
 or: black\; mso-ansi-language: EN-US\; mso-fareast-language: EN-US\; mso-b
 idi-language: AR-SA\;&quot;&gt;David Bondurant&amp;nbsp\;&lt;/span&gt;&lt;/span&gt;reviews the eme
 rgence of 3D memory and 3D packaging as today&amp;rsquo\;s approach to buildin
 g the fastest Supercomputers and AI Processors.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoN
 ormal&quot; style=&quot;border: none\; mso-padding-alt: 31.0pt 31.0pt 31.0pt 31.0pt\
 ; mso-border-shadow: yes\;&quot;&gt;&lt;span style=&quot;font-size: 11.0pt\; font-family: 
 &#39;Helvetica Neue&#39;\; mso-fareast-font-family: &#39;Helvetica Neue&#39;\; mso-bidi-fo
 nt-family: &#39;Helvetica Neue&#39;\; color: #242424\; background: white\; mso-hig
 hlight: white\;&quot;&gt;&lt;img src=&quot;https://events.vtools.ieee.org/vtools_ui/media/
 display/863ce982-8673-4818-be52-3c5355dc80c7&quot;&gt;&lt;/span&gt;&lt;/p&gt;
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