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PRODID:IEEE vTools.Events//EN
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DTSTART:20250309T030000
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DTSTART:20241103T010000
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DTSTAMP:20250121T141532Z
UID:93471C25-A29A-4AAB-912E-9D3A11362C5E
DTSTART;TZID=America/Chicago:20250120T183000
DTEND;TZID=America/Chicago:20250120T200000
DESCRIPTION:Brandon Schenck of Marvell will be giving a talk regarding AI a
 nd its impacts on design and advanced packaging.\n\nBrandon Schenck - Seni
 or Principal Engineer\, Marvell Custom Compute and Storage.\nI&#39;ve been a c
 ustom design and ASIC engineer for 20 years\, starting my career as a cloc
 k logic and physical design engineer at IBM as a co-op in 1999. After 4 ad
 ditional internships\, I finally started full time in 2004 and worked at I
 BM until its microelectronics divestiture to GlobalFoundries in 2015. When
  GlobalFoundries refocused their attention from leading-edge nodes to spec
 ialized processes in 2018\, our ASIC design services team divested (again)
  to Avera Semi\, which was ultimately acquired by Marvell in 2019\, where 
 I remain today. In the course of my career\, I&#39;ve participated in and led 
 design teams for leading industry customers like Microsoft\, Google\, Cisc
 o\, and Meta. Today I am part of the technical leadership for a number of 
 major client AI inference and network chip designs.\n\nAgenda: \n6:30 - 7:
 00 Social half hour to grab food and drink\n\n7:00 - 8:00 Technical talk\n
 \nRoom: Mann Hall\, Bldg: Medical Sciences Building\, 300 3rd Ave SW\, Roc
 hester\, Minnesota\, United States\, 55902\, Virtual: https://events.vtool
 s.ieee.org/m/461941
LOCATION:Room: Mann Hall\, Bldg: Medical Sciences Building\, 300 3rd Ave SW
 \, Rochester\, Minnesota\, United States\, 55902\, Virtual: https://events
 .vtools.ieee.org/m/461941
ORGANIZER:pramanik.leena@ieee.org
SEQUENCE:14
SUMMARY:Jan Talk: AI and Its Impacts on Design and Advanced Packaging (HYBR
 ID)
URL;VALUE=URI:https://events.vtools.ieee.org/m/461941
X-ALT-DESC:Description: &lt;br /&gt;&lt;div&gt;Brandon Schenck of Marvell will be givin
 g a talk regarding AI and its impacts on design and advanced packaging.&lt;/d
 iv&gt;\n&lt;div&gt;&amp;nbsp\;&lt;/div&gt;\n&lt;div&gt;Brandon Schenck - Senior Principal Engineer\
 , Marvell Custom Compute and Storage.&amp;nbsp\;&lt;/div&gt;\n&lt;div style=&quot;text-align
 : justify\;&quot;&gt;I&#39;ve been a custom design and ASIC engineer for 20 years\, st
 arting my career as a clock logic and physical design engineer at IBM as a
  co-op in 1999. After 4 additional internships\, I finally started full ti
 me in 2004 and worked at IBM until its microelectronics divestiture to Glo
 balFoundries in 2015. When GlobalFoundries refocused their attention from 
 leading-edge nodes to specialized processes in 2018\, our ASIC design serv
 ices team divested (again) to Avera Semi\, which was ultimately acquired b
 y Marvell in 2019\, where I remain today. In the course of my career\, I&#39;v
 e participated in and led design teams for leading industry customers like
  Microsoft\, Google\, Cisco\, and Meta. Today I am part of the technical l
 eadership for a number of major client AI inference and network chip desig
 ns.&lt;/div&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&lt;em&gt;6:30 - 7:00&lt;/em&gt;&amp;nbsp\;Social ha
 lf hour to grab food and drink&lt;/p&gt;\n&lt;p&gt;&lt;em&gt;7:00 - 8:00&lt;/em&gt;&amp;nbsp\;Technica
 l talk&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;
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